公开(公告)号：US11929369B2

公开(公告)日：2024-03-12

申请号：US17143114

申请日：2021-01-06

申请人： InnoLux Corporation

发明人： Shuhei Hosaka

IPC分类号： H01L27/12 ,  G02F1/1335 ,  G02F1/1339 ,  G02F1/1345 ,  G02F1/1362 ,  H01L23/057 ,  H01L25/16 ,  H01L27/15 ,  H10K50/842 ,  H10K59/131 ,  H10K59/38

CPC分类号： H01L27/124 ,  H01L23/057 ,  G02F1/133514 ,  G02F1/1339 ,  G02F1/13458 ,  G02F1/136286 ,  H01L25/167 ,  H01L27/156 ,  H10K50/8428 ,  H10K59/131 ,  H10K59/38

摘要： An electronic device includes a first substrate including a first surface and a first side-surface adjacent to the first surface, a second substrate including a second surface and a second side-surface adjacent to the second surface, a plurality of first conductive wires disposed on the first surface, a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively and a plurality of second conductive wires disposed on the first side-surface and the second side-surface. The plurality of first conductive wires are electrically connected to the plurality of second conductive wires respectively.

公开(公告)号：US20190148316A1

公开(公告)日：2019-05-16

申请号：US16230240

申请日：2018-12-21

申请人： NGK ELECTRONICS DEVICES, INC. ,  NGK INSULATORS, LTD.

发明人： Noboru KUBO ,  Naoki GOTO

IPC分类号： H01L23/66 ,  H01L23/15 ,  H01L23/498 ,  H01L23/13

CPC分类号： H01L23/66 ,  H01L23/02 ,  H01L23/057 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2223/6638 ,  H05K1/02

摘要： A highly reliable high-frequency ceramic board appropriately transmitting signals with high frequencies up to 50 GHz includes a flat ceramic substrate, a pair of ground lines bonded to a peripheral portion of a back surface of the ceramic substrate, a first lead pad electrode bonding the ground lines, at least one pair of signal lines between the ground lines, second lead pad electrodes attached where the signal lines are bonded, and a groove-like recess between the second lead pad electrodes. The pair of signal lines forms a differential transmission line. An interval LGS between a first edge of the first lead pad electrode and a second edge of a corresponding second lead pad electrode and an interval LSS between facing second edges satisfy LSS

公开(公告)号：US20180166377A1

公开(公告)日：2018-06-14

申请号：US15890482

申请日：2018-02-07

申请人： Tesla, Inc.

发明人： Wenjun Liu ,  Robert James Ramm ,  Colin Kenneth Campbell

IPC分类号： H01L23/50 ,  H01L49/02 ,  H01G4/12 ,  H01L23/373

CPC分类号： H01L23/50 ,  H01G4/12 ,  H01L21/4825 ,  H01L23/057 ,  H01L23/3735 ,  H01L23/49534 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L25/072 ,  H01L28/40 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/014

摘要： A semiconductor device includes housing, a substrate, a first semiconductor die, a second semiconductor die, a first terminal, and a second terminal. The first terminal in a first terminal plane couples to the first semiconductor die. The second terminal has a contact portion in a contact portion plane within the housing that couples to the second semiconductor die, a main portion in a main portion plane partially within the housing, the main portion plane substantially parallel to and offset from the first terminal plane, and the main portion plane substantially parallel to and offset from the contact portion plane, and an offsetting portion within the housing and that connects the contact portion to the main portion. At least some of the main portion of the second terminal overlaps the first terminal and the first terminal and the main portion of the second terminal extend from the housing in a same direction.

公开(公告)号：US20170373017A1

公开(公告)日：2017-12-28

申请号：US15407566

申请日：2017-01-17

申请人： Kabushiki Kaisha Toshiba

发明人： Osamu MORIYA ,  Tomohiro SENJU

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/057 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/057 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6683 ,  H01L2224/16227

摘要： A high frequency semiconductor device package includes a metal plate, a frame body, a first lead part, a second lead part, a first conductive layer, and a second conductive layer. The frame body includes a first frame part made and a second frame part. The first frame part has a lower surface bonded to the metal plate. The first frame part has an upper surface including a first region and a second region. The first lead part protrudes outward along a line passing through a central part of the first region and a central part of the second region in plan view. The second lead part protrudes outward along the line in plan view. The first conductive layer includes a first stripe part and a first connection part. The second conductive layer includes a second stripe part and a second connection part.

公开(公告)号：US20170372977A1

公开(公告)日：2017-12-28

申请号：US15626032

申请日：2017-06-16

申请人： FUJI ELECTRIC CO., LTD.

发明人： Yuta TAMAI ,  Fumihiko MOMOSE

IPC分类号： H01L23/04 ,  H01L23/00 ,  H01L21/52 ,  H01L23/367 ,  H01L23/10 ,  H01L23/492 ,  H01L23/498 ,  H01L25/18

CPC分类号： H01L21/52 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/498 ,  H01L23/562 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/13091

摘要： A semiconductor device has a U terminal with an internal joint portion at one end that is joined to a circuit board, an intermediate portion that is embedded in a case, and an external joint portion at another end that is exposed from the case, the U terminal being provided with a shock absorbing portion that is positioned between an inner surface of the case and the internal joint portion and absorbing stress that acts upon the internal joint portion. Due to the presence of the shock absorbing portion, even when the entire semiconductor device deforms or there is local deformation such that stress becomes concentrated at the joined surfaces of the internal joint portion and the circuit board, the stress is absorbed by the shock absorbing portion.

公开(公告)号：US09831152B2

公开(公告)日：2017-11-28

申请号：US15280054

申请日：2016-09-29

申请人： FUJI ELECTRIC CO., LTD.

发明人： Fumio Shigeta ,  Yoshihiro Kodaira

IPC分类号： H01L23/373 ,  H01L25/07 ,  H01L25/18 ,  H01L23/053 ,  H01L23/057 ,  H01L23/40 ,  H01L23/498

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/057 ,  H01L23/4006 ,  H01L23/49822 ,  H01L25/07 ,  H01L25/18 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A control terminal 14 of a semiconductor device has a recessed portion 14c. A resin case 15 is provided with a fixing member 152 engaging with and fixing a recessed portion 14c of a control terminal 14. The fixing member 152 is constituted by a resin block portion 154 having a step portion engaging with the recessed portion 14c, a nut-housing portion 153, and a beam portion 155 integrated by linking the resin block portion 154 and the nut-housing portion 153. A resin case main body 151 to which the fixing member 152 is fixed is provided with a hollow portion enabling insertion of the resin block portion 154. The nut-housing portion 153 of the fixing member 152 and the resin block portion 154 are attached to the resin case main body 151 from one direction.

公开(公告)号：US09805995B2

公开(公告)日：2017-10-31

申请号：US15111238

申请日：2015-01-23

申请人： KYOCERA Corporation

发明人： Yoshiki Kawazu

IPC分类号： H05K5/00 ,  H01L23/04 ,  H01L23/057 ,  H01L23/14 ,  H01L23/552 ,  H01R24/38 ,  H01R103/00

CPC分类号： H01L23/041 ,  H01L23/057 ,  H01L23/142 ,  H01L23/552 ,  H01L2924/0002 ,  H01R24/38 ,  H01R2103/00 ,  H05K5/0069 ,  H05K5/0091 ,  H01L2924/00

摘要： An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.

公开(公告)号：US20170294362A1

公开(公告)日：2017-10-12

申请号：US15630112

申请日：2017-06-22

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Yusheng LIN ,  Chee Hiong CHEW ,  Francis J. CARNEY

IPC分类号： H01L23/055 ,  H01R4/48 ,  H01L23/50 ,  H01L23/10 ,  H01L23/057

CPC分类号： H01L23/055 ,  H01L21/50 ,  H01L23/041 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4006 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49844 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/72 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01R4/4863 ,  H01R4/489 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Implementations of semiconductor packages may include: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die, wherein the pin includes a reversibly elastically deformable lower portion configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered to be coupled to the substrate.

公开(公告)号：US20170284951A1

公开(公告)日：2017-10-05

申请号：US15086573

申请日：2016-03-31

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： G01N27/02 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18 ,  H01L23/31

CPC分类号： H01L23/315 ,  G01N27/028 ,  G01N27/128 ,  G01N33/0036 ,  H01L21/185 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/568 ,  H01L21/7624 ,  H01L23/053 ,  H01L23/057 ,  H01L23/291 ,  H01L23/295 ,  H01L23/296 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/24 ,  H01L24/96 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K1/181

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US09741628B2

公开(公告)日：2017-08-22

申请号：US14877334

申请日：2015-10-07

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kenichiro Sato

IPC分类号： H01L25/18 ,  H01L21/66 ,  H01L21/48 ,  H01L29/16 ,  H01L29/872 ,  H01L29/739 ,  H01L25/11 ,  H01L23/00 ,  H01L25/07 ,  H01L23/498 ,  H01L23/057 ,  H01L23/373

CPC分类号： H01L22/14 ,  H01L21/4889 ,  H01L23/057 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49844 ,  H01L23/49866 ,  H01L24/37 ,  H01L24/40 ,  H01L25/072 ,  H01L25/115 ,  H01L25/18 ,  H01L29/1608 ,  H01L29/7393 ,  H01L29/872 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84214 ,  H01L2224/84801 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/00014

摘要： A method for manufacturing a semiconductor module includes the step of soldering two or more semiconductor elements having substrate materials and heights different from each other to a metal foil disposed at one side of an insulating substrate; connecting a plurality of wiring members, not interconnecting the semiconductor elements, to front face electrodes of the semiconductor elements through solder so that heights from a surface of the insulating substrate to top faces of the wiring members become same level with each other; inspecting a leakage current while applying electricity on each one of semiconductor elements individually through the wiring members; and connecting the top faces of the wiring members with a bus bar.