公开(公告)号：US12119275B2

公开(公告)日：2024-10-15

申请号：US17461207

申请日：2021-08-30

申请人： Apple Inc.

发明人： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai

IPC分类号： H01L23/053 ,  H01L23/10

CPC分类号： H01L23/053 ,  H01L23/10

摘要： Modules and methods of assembly are described. A module includes a lid mounted on a module substrate and covering a component. A stiffener structure may optionally be mounted between the lid and module substrate. A recess can be formed in any of an outer wall bottom surface of the lid, and top or bottom surface of the stiffener structure such that an adhesive layer at least partially fills the recess.

公开(公告)号：US20240290730A1

公开(公告)日：2024-08-29

申请号：US18175985

申请日：2023-02-28

申请人： International Business Machines Corporation

发明人： Sathyanarayanan Raghavan ,  Mukta Ghate Farooq ,  Prabudhya Roy Chowdhury

IPC分类号： H01L23/00 ,  H01L21/304 ,  H01L23/053 ,  H01L25/065

CPC分类号： H01L23/562 ,  H01L21/3043 ,  H01L23/053 ,  H01L25/0657

摘要： A semiconductor structure for tailoring a die stiffness. The semiconductor structure may include a packaging substrate, a lid, and a first semiconductor die between the packaging substrate and the lid. The first semiconductor die may have a frontside attached to the packaging substrate that has semiconductor devices. The first semiconductor die may also have a backside, opposite the frontside, that has grooves less than a thickness of the first semiconductor die.

公开(公告)号：US12068209B2

公开(公告)日：2024-08-20

申请号：US17708209

申请日：2022-03-30

申请人： Siemens Aktiengesellschaft

发明人： Stephan Jonas ,  Norbert Reichenbach ,  Juergen Trottmann

IPC分类号： H01L23/053 ,  G01K1/08 ,  H01L23/34 ,  H01L25/07

CPC分类号： H01L23/053 ,  G01K1/08 ,  H01L23/34 ,  H01L25/072

摘要： A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.

公开(公告)号：US20240258249A1

公开(公告)日：2024-08-01

申请号：US18415810

申请日：2024-01-18

申请人： ROHM Co., LTD.

发明人： Shunsuke Akasaka

IPC分类号： H01L23/00 ,  H01L23/053 ,  H01L23/08

CPC分类号： H01L23/564 ,  H01L23/053 ,  H01L23/08

摘要： Provided is a semiconductor package member including a substrate having a first main surface on which a recess is formed, in which the substrate includes a plurality of through holes formed in such a manner as to, from a first main surface, reach a second main surface opposite to the first main surface, and at least some of the plurality of through holes are formed at positions overlapping the recess.

公开(公告)号：US20240203803A1

公开(公告)日：2024-06-20

申请号：US18082012

申请日：2022-12-15

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jae Yun Kim

IPC分类号： H01L23/053 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/053 ,  H01L21/4817 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19105

摘要： In one example, an electronic device comprises a substrate comprising a top side, a bottom side, a lateral side, and a conductive structure, a first electronic component over the top side of the substrate and coupled with the conductive structure, an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate, a lid over the first electronic component and over the encapsulant, and a second electronic component over the top side of the substrate and coupled with the conductive structure, wherein the second electronic component is between the first electronic component and the lateral side of the substrate. Other examples and related methods are also disclosed herein.

公开(公告)号：US11990435B2

公开(公告)日：2024-05-21

申请号：US17867287

申请日：2022-07-18

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Sung Sun Park ,  Ji Young Chung ,  Christopher Berry

IPC分类号： G06V40/13 ,  B81C3/00 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31

CPC分类号： H01L24/05 ,  B81C3/00 ,  G06V40/13 ,  G06V40/1329 ,  H01L23/053 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27622 ,  H01L2224/2784 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81471 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/014 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01079 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2224/1146 ,  H01L2924/00014 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/11849 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/03452 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05139 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/0347 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01074 ,  H01L2224/05671 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01028 ,  H01L2224/0361 ,  H01L2924/00014 ,  H01L2224/119 ,  H01L2224/034 ,  H01L2224/1147 ,  H01L2224/034 ,  H01L2224/114 ,  H01L2224/0361 ,  H01L2224/13294 ,  H01L2924/00014 ,  H01L2224/133 ,  H01L2924/014 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025 ,  H01L2224/2929 ,  H01L2924/07025 ,  H01L2224/2919 ,  H01L2924/069 ,  H01L2224/2929 ,  H01L2924/069 ,  H01L2224/83102 ,  H01L2924/00014 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/29294 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/29299 ,  H01L2924/00014 ,  H01L2224/27622 ,  H01L2924/00014 ,  H01L2224/2732 ,  H01L2924/00014 ,  H01L2224/27312 ,  H01L2924/00014 ,  H01L2224/81447 ,  H01L2924/00014 ,  H01L2224/81424 ,  H01L2924/00014 ,  H01L2224/81455 ,  H01L2924/00014 ,  H01L2224/8146 ,  H01L2924/00014 ,  H01L2224/81439 ,  H01L2924/00014 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2224/81484 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/81466 ,  H01L2924/00014 ,  H01L2224/81471 ,  H01L2924/00014 ,  H01L2224/8185 ,  H01L2924/00012 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

公开(公告)号：US11978684B2

公开(公告)日：2024-05-07

申请号：US17362088

申请日：2021-06-29

申请人： Infineon Technologies AG

发明人： Tomas Manuel Reiter ,  Peter Bayer ,  Christoph Koch

IPC分类号： H01L23/053 ,  H01L23/14 ,  H01L23/495 ,  H01L23/528 ,  H05K3/40 ,  H05K3/32

CPC分类号： H01L23/053 ,  H01L23/145 ,  H01L23/49503 ,  H01L23/5286 ,  H05K3/40 ,  H05K3/32

摘要： A power semiconductor module includes: an electrically insulative frame having opposite first and second mounting sides, and a border that defines a periphery of the electrically insulative frame; a first substrate seated in the electrically insulative frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a plurality of busbars attached to the first substrate and extending through the border of the electrically insulative frame; a plurality of fixing positions at the first mounting side of the electrically insulative frame; and a plurality of electrically insulative protrusions jutting out from the second mounting side of the electrically insulative frame, wherein the protrusions are vertically aligned with the fixing positions. Methods of producing the power semiconductor module and power electronic assemblies that incorporate the power semiconductor module are also described.

公开(公告)号：US20240128137A1

公开(公告)日：2024-04-18

申请号：US18530193

申请日：2023-12-05

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Sebastian Meier ,  Bernhard Peter Lange

IPC分类号： H01L23/10 ,  G01N27/28 ,  G01N27/416 ,  H01L21/56 ,  H01L23/00 ,  H01L23/053 ,  H01L23/16

CPC分类号： H01L23/10 ,  G01N27/28 ,  G01N27/4167 ,  H01L21/56 ,  H01L23/053 ,  H01L23/16 ,  H01L24/48 ,  H01L2224/48225

摘要： In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.

公开(公告)号：US20240105639A1

公开(公告)日：2024-03-28

申请号：US17951978

申请日：2022-09-23

申请人： Apple Inc.

发明人： Helia Rahmani ,  Stephane J. Marcadet ,  Scott J. Campbell ,  Zhiyong C. Xia ,  Stephen V. Jayanathan ,  Vineet Negi ,  Christian Kettenbeil

IPC分类号： H01L23/00 ,  H01L23/053 ,  H05K1/18 ,  H05K5/00

CPC分类号： H01L23/562 ,  H01L23/053 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0091 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734

摘要： Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

公开(公告)号：US20240079281A1

公开(公告)日：2024-03-07

申请号：US18239447

申请日：2023-08-29

申请人： NEC Corporation

发明人： Suguru WATANABE ,  Kunihiko ISHIHARA ,  Katsumi KIKUCHI

IPC分类号： H01L23/053 ,  H01L23/498 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H10N69/00

CPC分类号： H01L23/053 ,  H01L23/49822 ,  H01R12/7005 ,  H01R12/714 ,  H01R13/2421 ,  H10N69/00 ,  H01L24/16 ,  H01L2224/16225

摘要： A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.