公开(公告)号：US20230285959A1

公开(公告)日：2023-09-14

申请号：US18010290

申请日：2021-04-13

申请人： NOK CORPORATION

发明人： Takayuki KOMORI

IPC分类号： B01L3/00 ,  B81B1/00 ,  B01J19/00 ,  B81C3/00 ,  C12M1/34 ,  B03C5/02

CPC分类号： B01L3/502707 ,  B81B1/00 ,  B01J19/0093 ,  B81C3/00 ,  C12M1/34 ,  B03C5/02 ,  B01J2219/00783

摘要： A method of manufacturing a micro flow path device includes: arranging a cover film on a surface of a base film on which an electrode pattern made of a metallic thin film has been formed and obtaining a flow path forming laminate; punching the obtained flow path forming laminate along a shape of a flow path so as to cut a part of the electrode pattern and forming a punched portion in which at least a pair of opposite electrodes are exposed to a part of the punched cut surface; and disposing a first planar member, defining a bottom surface of the flow paths on a back surface side of the flow path forming laminate on which the punched portion has been formed and disposing a second planar member defining a top surface of the flow path on a front surface side of the flow path forming laminate.

公开(公告)号：US20190253791A1

公开(公告)日：2019-08-15

申请号：US16392546

申请日：2019-04-23

申请人： Knowles Electronics, LLC

发明人： Anthony D. MINERVINI

IPC分类号： H04R1/28 ,  B81B3/00 ,  H04R23/00 ,  B81B7/00 ,  H01L21/78 ,  H04R19/00 ,  H04R19/01 ,  H04R19/04 ,  H04R31/00 ,  B81C3/00 ,  B81C1/00 ,  H04R3/00 ,  H04R1/04 ,  H01L23/15 ,  H01L23/10 ,  H04R1/22

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

公开(公告)号：US20180148314A1

公开(公告)日：2018-05-31

申请号：US15316549

申请日：2015-06-10

申请人： HAMAMATSU PHOTONICS K.K.

发明人： Sadaharu TAKIMOTO ,  Shinya IWASHINA ,  Masakuni KIMOTO ,  Yuki MORINAGA

IPC分类号： B81B3/00 ,  B81C3/00 ,  G02B26/08 ,  G02B26/10

CPC分类号： B81B3/001 ,  B81B3/00 ,  B81C3/00 ,  B81C3/001 ,  G02B7/1821 ,  G02B26/085 ,  G02B26/101

摘要： A mirror drive device includes a support part, a movable part, a permanent magnet forming a magnetic field in the periphery of the movable part, and a circuit board disposed between the support part and the permanent magnet in a facing direction of a pair of principal surfaces of the movable part so as to cause the movable part to be positioned at an inside of the circuit board when viewed in the facing direction. The movable part includes a mirror disposition portion, a mirror disposed and a drive coil so as to face the permanent magnet. The support part includes a base portion connected to a connection member and a reinforcing portion extending from the base portion toward a side away from the permanent magnet and the circuit board. The drive coil is connected to electrodes by lead-out conductors.

公开(公告)号：US09950922B2

公开(公告)日：2018-04-24

申请号：US15127237

申请日：2015-03-17

申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN

发明人： Yogesh Gianchandani ,  Tao Li ,  Yushu Ma

IPC分类号： B81B7/00 ,  B81B7/02 ,  B81C3/00 ,  H01L23/043 ,  H01L23/053

CPC分类号： B81B7/0048 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/02 ,  B81B2201/0264 ,  B81C3/00 ,  B81C3/002 ,  B81C3/004 ,  H01L23/043 ,  H01L23/053

摘要： A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps.

公开(公告)号：US09693133B2

公开(公告)日：2017-06-27

申请号：US15135125

申请日：2016-04-21

申请人： Knowles Electronics, LLC

发明人： Anthony D. Minervini

IPC分类号： H01L23/12 ,  H01L21/00 ,  H04R11/04 ,  H04R31/00 ,  H04R1/28 ,  B81B7/00 ,  H04R19/00 ,  H04R19/01 ,  H04R19/04 ,  H01L23/10 ,  H01L23/15 ,  H04R1/04 ,  H04R3/00 ,  B81B3/00 ,  H01L21/78 ,  B81C1/00 ,  B81C3/00 ,  H04R23/00 ,  H04R1/22

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

公开(公告)号：US09338560B1

公开(公告)日：2016-05-10

申请号：US14836499

申请日：2015-08-26

申请人： Knowles Electronics, LLC

发明人： Anthony D. Minervini

IPC分类号： H01L23/12 ,  H01L21/00 ,  H04R11/04 ,  H04R31/00 ,  H04R19/04 ,  H04R23/00 ,  B81B7/00 ,  H01L23/10 ,  H01L21/78 ,  H04R19/01 ,  H04R19/00 ,  B81B3/00

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

摘要翻译： 公开了一种用于微机电系统（MEMS）麦克风管芯的表面安装封装。 表面安装封装具有带有金属焊盘的基板，用于将封装表面安装到器件的印刷电路板上，并用于在麦克风封装和器件的电路板之间进行电气连接。 表面安装麦克风封装具有盖，并且MEMS麦克风管芯被衬底安装并声耦合到设置在表面安装封装中的声学端口。 基板和盖子连接在一起以形成MEMS麦克风，并且基板和盖子协作以形成用于基板安装的MEMS麦克风管芯的声室。

公开(公告)号：US09051171B1

公开(公告)日：2015-06-09

申请号：US14149525

申请日：2014-01-07

申请人： Knowles Electronics, LLC

发明人： Anthony D. Minervini

IPC分类号： H01L23/12 ,  H04R11/04 ,  H01L21/00 ,  H04R31/00 ,  B81B7/00 ,  H04R19/04 ,  H01L21/78 ,  H01L23/10 ,  H04R19/01 ,  H04R19/00 ,  B81B3/00

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： A bottom port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

摘要翻译： 公开了用于微机电系统（MEMS）麦克风管芯的底部端口，表面安装封装。 表面安装封装具有带有金属焊盘的基板，用于将封装表面安装到器件的印刷电路板上，并用于在麦克风封装和器件的电路板之间进行电气连接。 表面安装麦克风封装具有盖，并且MEMS麦克风管芯被衬底安装并声耦合到衬底中的声学端口。 基板和盖子连接在一起以形成MEMS麦克风，并且基板和盖子协作以形成用于基板安装的MEMS麦克风管芯的声室。

公开(公告)号：US08835207B2

公开(公告)日：2014-09-16

申请号：US13750615

申请日：2013-01-25

申请人： Renesas Electronics Corporation

发明人： Koichi Arai

IPC分类号： H01L21/02 ,  B81C1/00 ,  B81C3/00 ,  H01L29/84 ,  H01L23/48 ,  B81B3/00

CPC分类号： B81B3/0072 ,  B81B3/00 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00896 ,  B81C3/00 ,  B81C2201/056 ,  G01L9/0042 ,  G01L19/06 ,  H01L29/84 ,  H01L2224/13 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor integrated circuit device having an MEMS element over a single semiconductor chip, the movable part of the MEMS element is fixed before the formation of a rewiring. After formation of the rewiring, the wafer is diced. Then, the movable part of the MEMS element is released by etching the wafer.

摘要翻译： 在制造在单个半导体芯片上具有MEMS元件的半导体集成电路器件的方法中，MEMS元件的可移动部件在形成重新布线之前被固定。 在重新布线形成之后，晶片被切割。 然后，通过蚀刻晶片来释放MEMS元件的可移动部分。

公开(公告)号：US08629552B1

公开(公告)日：2014-01-14

申请号：US13732265

申请日：2012-12-31

申请人： Knowles Electronics, LLC

发明人： Anthony D. Minervini

IPC分类号： H01L23/12 ,  H04R11/04 ,  H01L21/00 ,  H04R31/00

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

摘要翻译： 本发明涉及一种用于硅电容麦克风的表面安装封装以及用于制造表面贴装封装的方法。 表面安装封装使用有限数量的部件，其简化了制造并降低了成本，并且具有执行传统上需要多个部件的功能的基板，包括提供其上机械地连接硅冷凝器管芯的内表面， 表面，用于在硅冷凝器管芯和封装之间进行电连接，并且提供用于将封装表面安装到器件的印刷电路板并用于在封装和器件的印刷电路板之间进行电连接的外表面。

公开(公告)号：US20070202627A1

公开(公告)日：2007-08-30

申请号：US11741884

申请日：2007-04-30

申请人： Anthony Minervini

发明人： Anthony Minervini

IPC分类号： H01L21/00

CPC分类号： H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

摘要： A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

摘要翻译： 公开了一种硅电容麦克风封装。 硅电容麦克风封装包括一个换能器单元基板和一个盖子。 基板包括其中形成有凹部的上表面。 换能器单元附接到基板的上表面并且与凹部的至少一部分重叠，其中换能器单元的后部体积形成在换能器单元和基板之间。 将盖放置在换能器单元上方并且包括孔。