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公开(公告)号：US12117606B2
公开(公告)日：2024-10-15
申请号：US17001477
申请日：2020-08-24
发明人： Yuki Ashida , Stephen Hamann , Olav Solgaard , Alexander Payne , Lars Eng , James Hunter
CPC分类号： G02B26/0833 , B81B3/0083 , B81B7/0067 , B81B7/02 , G01S7/4817 , G02B5/1814 , B81B2201/047
摘要： An optical scanner including micro-electromechanical system phased-arrays suitable for use in a LiDAR system, and methods of operating the same are described. Generally, the scanner includes an optical transmitter having first phased-arrays to receive light from a light source, form a swath of illumination in a far field scene and to modulate phases of the light to sweep or steer the swath over the scene in two-dimensions (2D). An optical receiver in the scanner includes second phased-arrays to receive light from the far field scene and direct at least some of the light onto a detector. The second phased-arrays are configured to de-scan the received light by directing light reflected from the far field scene onto the detector while rejecting background light. In one embodiment the second phased-arrays direct light from a slice of the far field scene onto a 1D detector array.
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公开(公告)号：US20240302185A1
公开(公告)日：2024-09-12
申请号：US18272141
申请日：2022-01-14
CPC分类号： G01D3/0365 , B81B7/02 , G01P15/02 , G01P21/00 , G06N3/08 , B81B2201/0235 , B81B2201/0242
摘要： A system includes an inertial sensing device having an inertial sensor and plurality of stress sensors configured to measure stress applied to the inertial sensing device, and at least one computing device configured to: receive sensor data from the inertial sensor and the plurality of stress sensors; and determine a drift compensation of the inertial sensor based on the sensor data. Other systems, methods, and devices are disclosed.
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公开(公告)号：US20240288679A1
公开(公告)日：2024-08-29
申请号：US18174338
申请日：2023-02-24
发明人： Jaleel MOIDU , John HEANUE
CPC分类号： G02B26/0833 , B81B7/02 , G02B6/12004 , B81B2201/042 , B81B2207/01
摘要： Disclosed is an opto-electronic module including a first substrate, a photonic integrated circuit (PIC) attached to the first substrate, a laser assembly attached to the first substrate, and a microelectromechanical systems (MEMS) micro-mirror device positioned between the laser and the waveguide. The PIC comprising a waveguide. The laser assembly is configured to generate a laser beam to optically couple to the waveguide. The laser assembly includes a thermal electric cooler (TEC) and a laser thermally coupled to the TEC. The MEMS micro-mirror device comprising an actuatable MEMS mirror and a fixed mirror.
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公开(公告)号：US12058939B2
公开(公告)日：2024-08-06
申请号：US18140577
申请日：2023-04-27
发明人： Karl Grosh , Robert J. Littrell
CPC分类号： H10N30/50 , B81B3/0021 , B81B7/0032 , B81B7/02 , H04R17/00 , H04R17/02 , H10N30/302 , H10N30/306 , H10N30/308 , H10N30/853 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81B2207/09 , H04R2201/003
摘要： A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.
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公开(公告)号：US12037238B2
公开(公告)日：2024-07-16
申请号：US17257214
申请日：2019-07-26
CPC分类号： B81B7/02 , B81B7/0032 , B81C1/00317 , B81C1/00333 , B81B2201/047 , B81B2207/012 , G02B26/001
摘要： An optoelectronic module includes an optical filter and can have a relatively small overall height. The module includes a semiconductor die for the optical filter, where the die has a cavity in its underside. The cavity provides space to accommodate an optoelectronic device such as a light sensor or light emitter. Such an arrangement can reduce the overall height of the module, thereby facilitating its integration into a host device in which space is at a premium.
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公开(公告)号：US20240158225A1
公开(公告)日：2024-05-16
申请号：US18075882
申请日：2022-12-06
发明人： Jung-Hao CHANG , Weng-Yi CHEN
CPC分类号： B81C1/00476 , B81B7/02 , B81B2201/0257 , B81B2203/0315 , B81B2203/033 , B81B2203/0353 , B81B2207/01 , B81C2201/0108 , B81C2201/0132 , B81C2201/0133 , B81C2201/014 , B81C2201/0176
摘要： A micro electro mechanical system (MEMS) device and a method for manufacturing the same are provided. The MEMS device includes a substrate, a polymer film on the substrate and having a lower surface facing toward the substrate, a cavity passing through the substrate, and coil structures on the substrate and in the polymer film. The polymer film includes a corrugation pattern on the lower surface of the polymer film. A portion of the polymer film is exposed in the cavity.
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公开(公告)号：US20240158224A1
公开(公告)日：2024-05-16
申请号：US18540253
申请日：2023-12-14
发明人： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geißler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
CPC分类号： B81C1/00158 , B81B3/0021 , B81B7/02 , B81C1/00103 , H04R1/08 , H04R7/02 , H04R7/08 , H04R31/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/0384 , B81C2201/013 , H04R2201/003
摘要： A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
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公开(公告)号：US11940618B2
公开(公告)日：2024-03-26
申请号：US17255233
申请日：2019-08-20
申请人： Robert Bosch GmbH
发明人： Alexander Eberspaecher , Frank Schatz , Janine Riedrich-Moeller , Joerg Muchow , Josip Mihaljevic , Kerrin Doessel , Ralf Boessendoerfer , Timo Schary
CPC分类号： G02B26/0858 , B81B3/0021 , B81B7/02 , B81C1/00134 , B81B2201/042 , B81C2201/0161
摘要： A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.
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公开(公告)号：US11933648B2
公开(公告)日：2024-03-19
申请号：US17345778
申请日：2021-06-11
申请人： INVENSENSE, INC.
摘要： The described technology is generally directed towards a sensor output digitizer. The sensor output digitizer can comprise a multiplexer stage, a multi-stage analog to digital converter, and a digital output combiner. The multiplexer stage can be configured to sequentially select sensor outputs from one or more sensors, resulting in a stream of selected sensor outputs. The multi-stage analog to digital converter can be coupled with the multiplexer stage, and can be configured to convert the stream of selected sensor outputs into a stream of digitized outputs. The digital output combiner can be configured to re-scale and sum intermediate outputs of the multi-stage analog to digital converter to produce a stream of digitized sensor outputs.
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公开(公告)号：US11902727B2
公开(公告)日：2024-02-13
申请号：US17670387
申请日：2022-02-11
申请人： Apple Inc.
CPC分类号： H04R1/023 , B81B7/02 , H04R1/08 , H04R1/2803 , H04R1/2873 , B81B2201/0257 , H04R2499/11
摘要： Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.
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