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公开(公告)号:US12131870B2
公开(公告)日:2024-10-29
申请号:US18332176
申请日:2023-06-09
发明人: Tomoki Sakai
CPC分类号: H01G4/30 , C04B35/468 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/1227 , C04B2235/66
摘要: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and an external electrode including: a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material, a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film.
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公开(公告)号:US20240351325A1
公开(公告)日:2024-10-24
申请号:US18683597
申请日:2022-08-03
申请人: KYOCERA Corporation
发明人: Hirotoshi ETO , Hisashi SATO
CPC分类号: B32B38/0004 , B32B38/04 , H01G4/012 , H01G4/1227 , H01G4/30 , B32B2038/042
摘要: A method includes cutting a multilayer base including a plurality of dielectric ceramic bodies and a plurality of internal electrode layers alternately stacked on one another along a cutting line orthogonal to the multilayer base to obtain a plurality of base precursors each including a cut side surface on which the plurality of internal electrode layers is exposed, aligning the plurality of base precursors each to have the cut side surface being opened, applying an air remover to the cut side surface being opened, and placing a side green sheet into contact with the air remover applied to the cut side surface and pressing the side green sheet.
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公开(公告)号:US12119183B2
公开(公告)日:2024-10-15
申请号:US18524673
申请日:2023-11-30
发明人: Keita Kitahara , Yuta Saito , Noriyuki Ookawa , Riyousuke Akazawa , Takefumi Takahashi , Masahiro Wakashima , Yuta Kurosu , Akito Mori
CPC分类号: H01G4/2325 , H01G4/008 , H01G4/1227 , H01G4/30
摘要: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, base electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers and each including glass and copper, and plated layers respectively provided on an outer side of the base electrode layers. A protective layer including sulfur is provided between the glass included in the base electrode layers and the plated layers.
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4.
公开(公告)号:US12106905B2
公开(公告)日:2024-10-01
申请号:US17707390
申请日:2022-03-29
发明人: Bum Suk Kang , Su Jin Lee , Dae Woo Yoon , Da Mi Kim , Jeong Ryeol Kim
CPC分类号: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.
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公开(公告)号:US12102009B2
公开(公告)日:2024-09-24
申请号:US17112402
申请日:2020-12-04
发明人: Stefan Nettesheim , Klaus Forster , Markus Puff , Johann Pichler
CPC分类号: H10N30/883 , H01G4/12 , H01G4/224 , H01G4/40 , H10N30/40
摘要: A device (1) comprising an electro-ceramic component (2) which has a first electrical contact (3A), provided on a first side face (2A) of the electro-ceramic component (2) in the excitation zone (11), and a second electrical contact (3B) provided on a second side face (2B) of the electro-ceramic component (2). A sealing compound (20) is placed around the electro-ceramic component (2) so that the first electrical contact (3A) and the second electrical contact (3B) are covered by the sealing compound (20) and a free end (26) of a section (24) of the high-voltage zone (12) of the electro-ceramic component (2) projects beyond a free end (22) of the sealing compound (20).
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公开(公告)号:US12100560B2
公开(公告)日:2024-09-24
申请号:US17742690
申请日:2022-05-12
申请人: UT-Battelle, LLC
发明人: Shajjad Chowdhury , Raj Sahu , Emre Gurpinar , Burak Ozpineci
CPC分类号: H01G4/38 , H01G4/232 , H05K1/162 , H01G4/1245 , H05K2201/09227
摘要: A capacitor packaging having a central termination and three or more capacitors (or groups of capacitors) arranged about the central termination. The electrical flow paths between the termination and the capacitors or groups of capacitors are of substantially the same length. The capacitors or groups of capacitors may be arranged in a generally circular pattern with the termination centered on the center. The termination may include first and second terminals. The capacitors may be mounted to a printed circuit board (“PCB”) with traces on opposite surfaces of the PCB providing electrical flow paths from the terminals to opposite legs of the capacitors. The capacitor packaging may include a primary PCB with a first circular arrangement of capacitors and a secondary PCB with a second circular arrangement of capacitors. The capacitors may be sandwiched between the PCBs with the second arrangement of capacitors disposed concentrically inwardly of the first arrangement.
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公开(公告)号:US20240312723A1
公开(公告)日:2024-09-19
申请号:US18673499
申请日:2024-05-24
摘要: A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member.
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公开(公告)号:US20240312716A1
公开(公告)日:2024-09-19
申请号:US18235531
申请日:2023-08-18
发明人: Sehun Park , Youngghyu Ahn , Sung-Min Cho , Taejoon Park , Hwidae Kim
摘要: A multilayer capacitor includes: a body including a dielectric layer, and first and second internal electrodes stacked on each other in a thickness direction of the capacitor while being spaced apart from each other with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode spaced apart from the first external electrode in a length direction of the capacitor that is perpendicular to the thickness direction, and connected to the second internal electrode. One of the first internal electrode and the second internal electrode has a horizontal plane perpendicular to the thickness direction and an inclined plane inclined with respect to the horizontal plane in at least a partial region thereof.
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9.
公开(公告)号:US20240290541A1
公开(公告)日:2024-08-29
申请号:US18659337
申请日:2024-05-09
发明人: Anderson Lin , Chun-Ren Cheng , Chi-Yuan Shih , Shih-Fen Huang , Yi-Chuan Teng , Yi Heng Tsai , You-Ru Lin , Yen-Wen Chen , Fu-Chun Huang , Fan Hu , Ching-Hui Lin , Yan-Jie Liao
IPC分类号: H01G4/012 , H01G4/12 , H01G4/228 , H01L21/311 , H01L21/3213 , H10N30/30 , H10N30/50 , H10N30/87
CPC分类号: H01G4/012 , H01G4/12 , H01G4/228 , H01L21/31111 , H01L21/32139 , H01L28/60 , H10N30/302 , H10N30/501 , H10N30/508 , H10N30/872
摘要: Various embodiments of the present disclosure are directed towards an integrated chip including a first conductive structure and a second conductive structure. A dielectric structure is arranged between the first conductive structure and the second conductive structure. The dielectric structure comprises an upper region over a lower region. The lower region comprises a first lateral surface and a second lateral surface on opposing sides of the upper region. A passivation layer overlies the second conductive structure and the dielectric structure. The passivation layer comprises a lateral segment contacting the first lateral surface. A height of the lateral segment is greater than a height of the upper region. A top surface of the lateral segment is below a top surface of the passivation layer.
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公开(公告)号:US20240282522A1
公开(公告)日:2024-08-22
申请号:US18650285
申请日:2024-04-30
发明人: Yasuyuki SHIMADA
摘要: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers that are laminated, first and second main surfaces opposed to each other in a lamination direction, first and second lateral surfaces opposed to each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and first and second end surfaces opposed to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction. The multilayer body further includes external electrodes that are respectively provided on the first end surface and the second end surface and connected to the internal electrode layers. The internal electrode layers each include first and second regions respectively including different coverages. The first region includes a larger coverage than the second region. The first region is connected to a corresponding one of the external electrodes.
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