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公开(公告)号:US12111201B2
公开(公告)日:2024-10-08
申请号:US17636738
申请日:2020-09-07
申请人: TDK Electronics AG
发明人: Michael Gebhart , Stefan Sax , Thomas Koidl , Michael Pirolt
IPC分类号: G01F23/2962
CPC分类号: G01F23/2962
摘要: In an embodiment a sensor system includes a housing, an electronic circuit and an ultrasonic distance sensor, wherein the electronic circuit and the ultrasonic distance sensor are arranged in the housing, and wherein the sensor system is configured to measure a distance between the sensor system and a surface of a material in a container by an echo propagation time of an ultrasonic burst in air.
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公开(公告)号:US12102009B2
公开(公告)日:2024-09-24
申请号:US17112402
申请日:2020-12-04
发明人: Stefan Nettesheim , Klaus Forster , Markus Puff , Johann Pichler
CPC分类号: H10N30/883 , H01G4/12 , H01G4/224 , H01G4/40 , H10N30/40
摘要: A device (1) comprising an electro-ceramic component (2) which has a first electrical contact (3A), provided on a first side face (2A) of the electro-ceramic component (2) in the excitation zone (11), and a second electrical contact (3B) provided on a second side face (2B) of the electro-ceramic component (2). A sealing compound (20) is placed around the electro-ceramic component (2) so that the first electrical contact (3A) and the second electrical contact (3B) are covered by the sealing compound (20) and a free end (26) of a section (24) of the high-voltage zone (12) of the electro-ceramic component (2) projects beyond a free end (22) of the sealing compound (20).
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公开(公告)号:US12094673B2
公开(公告)日:2024-09-17
申请号:US16956406
申请日:2018-12-04
申请人: TDK Electronics AG
发明人: Robert Hoffmann , Jonas Weinhardt
CPC分类号: H01H47/002 , H01H50/023 , H01H50/18 , H01H50/546 , H01H50/641
摘要: A relay is disclosed. In an embodiment a relay includes a first switching contact having a first main contact, a second main contact and a first movable contact; a second switching contact having a third main contact, a fourth main contact and a second movable contact, wherein the second switching contact is electrically isolated from the first switching contact; and an actuator configured to move both the first and second movable contacts from a first switching state into a second switching state by moving a drive element of the actuator from a first position into a second position.
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公开(公告)号:US20240288317A1
公开(公告)日:2024-08-29
申请号:US18572331
申请日:2022-05-30
申请人: TDK Electronics AG
发明人: Markus WEHRING , Daniel GILLE , Carsten DEHOFF
摘要: A measuring assembly for measuring a temperature of a test body is provided, wherein at least two separate wires suitable for thermal conduction are led away from a test body and combined into a wire bundle at a distance from the test body, and wherein a temperature sensor is attached to the wire bundle by clamping action by means of a holder. Preferably, the holder comprises a holder base having an inner side and an outer side, and spring clips connected thereto, wherein a recess for receiving a temperature sensor is arranged on the inner side of the holder base, and wherein two of the spring clips are arranged opposite each other with respect to the holder base and are adapted to generate a clamping force towards the inner side of the holder base.
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公开(公告)号:US20240288315A1
公开(公告)日:2024-08-29
申请号:US18570302
申请日:2022-03-10
申请人: TDK Electronics AG
CPC分类号: G01K1/08 , F16L59/029 , G01K1/143 , G01K13/02 , G01K2201/02
摘要: Assembly to protect a sensing device including a pipe configured for transportation of a fluid, a sensing device arranged on a peripheral surface of the pipe and in thermal contact with the pipe and a protection element for protection of the sensing device against mechanical impacts and for thermal isolation of the device against the environment.
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公开(公告)号:US20240262035A1
公开(公告)日:2024-08-08
申请号:US18625468
申请日:2024-04-03
申请人: TDK Electronics AG
IPC分类号: B29C64/165 , B29C64/205 , B29C64/232 , B29C64/236 , B29C64/245 , B29C64/264 , B29C64/35 , B29C64/357 , B33Y10/00 , B33Y30/00 , B33Y40/00
CPC分类号: B29C64/165 , B29C64/205 , B29C64/232 , B29C64/236 , B29C64/245 , B29C64/264 , B29C64/35 , B29C64/357 , B33Y10/00 , B33Y30/00 , B33Y40/00
摘要: A 3D printer for additively manufacturing a multilayer component. The 3D printer includes at least two separate dispensers coating a conveyor belt with respectively different raw material, a manufacturing unit in which at least part of the raw material is added to the component as a new layer, at least two separate recovery devices for selectively recovering the respectively different raw material, which is not consumed when a layer is added to the component, and for returning the raw material to the respective associated dispenser, and conveyor belt that transports the raw material from the dispenser to the manufacturing unit and further to the recovery device in the lateral direction.
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公开(公告)号:US20240234019A1
公开(公告)日:2024-07-11
申请号:US18563043
申请日:2022-06-24
申请人: TDK Electronics AG
发明人: Felipe JEREZ GALDEANO , Thomas GIMPEL , Thomas LENZEN , Anneliese DRESPLING , Reinhard NEUREITER
CPC分类号: H01F27/292 , H01F17/0006 , H01F2017/004 , H02M3/04
摘要: An inductor with reduced losses is provided. The inductor comprises a first terminal, a second terminal and a conductor between the first terminal and the second terminal. The first terminal, the conductor and the second terminal establish a monolithic structure.
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公开(公告)号:US12014852B2
公开(公告)日:2024-06-18
申请号:US17636286
申请日:2020-09-15
申请人: TDK Electronics AG
发明人: Jan Ihle , Thomas Bernert , Gerald Kloiber
IPC分类号: H01C7/04 , G01K7/22 , H01C1/14 , H01C17/075
CPC分类号: H01C7/041 , G01K7/22 , H01C1/1413 , H01C7/048 , H01C17/075
摘要: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
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公开(公告)号:US20240194623A1
公开(公告)日:2024-06-13
申请号:US18554923
申请日:2022-03-08
申请人: TDK ELECTRONICS AG
IPC分类号: H01L23/00 , H01L21/56 , H01L21/784 , H01L23/31
CPC分类号: H01L24/05 , H01L21/561 , H01L23/3171 , H01L24/02 , H01L24/03 , H01L24/06 , H01L24/95 , H01L21/784 , H01L2224/0231 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/03002 , H01L2224/03422 , H01L2224/05008 , H01L2224/05082 , H01L2224/05139 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0529 , H01L2224/05339 , H01L2224/05347 , H01L2224/05548 , H01L2224/05583 , H01L2224/05611 , H01L2224/05644 , H01L2224/06181 , H01L2224/95001 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/10253 , H01L2924/1203
摘要: A semiconductor die and a method for manufacturing a semiconductor die are disclosed. In an embodiment a semiconductor die includes a base body having a semiconductor material and a surface with two contact areas having contact pads at which the semiconductor die is electrically contactable and two metal caps arranged directly at the contact pads.
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公开(公告)号:US20240171917A1
公开(公告)日:2024-05-23
申请号:US18448601
申请日:2023-08-11
发明人: Joseph Seeger , Dennis Mortensen
CPC分类号: H04R19/04 , H04R7/04 , H04R7/18 , H04R2201/003 , H04R2410/03
摘要: The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.
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