Device having an electroceramic component

    公开(公告)号:US12010787B2

    公开(公告)日:2024-06-11

    申请号:US17635124

    申请日:2020-08-11

    CPC classification number: H05H1/2481 H10N30/40 H05H2240/10 H05H2240/20

    Abstract: A device including an electroceramic component having a first area and a second area, a potting compound at least partially surrounding the electroceramic component, and a sleeve-shaped housing which at least partially surrounds the potting compound. The housing has, in a first housing section that surrounds the potting compound in the first area of the electroceramic component, a material wherein the thermal conductivity of said material is greater than the thermal conductivity of a material of the housing in a second housing section. The housing in the second housing section surrounding the potting compound in the second area of the electroceramic component includes a non-conductive material.

    DEVICE HAVING AN ELECTROCERAMIC COMPONENT

    公开(公告)号:US20220304134A1

    公开(公告)日:2022-09-22

    申请号:US17635124

    申请日:2020-08-11

    Abstract: The invention relates to a device comprising an electroceramic component (1) having a first area (2) and a second area (3), a potting compound (11) at least partially surrounding the electroceramic component (1), and a sleeve-shaped housing (15) which at least partially surrounds the potting compound (11), the housing (15) having, in a first housing section (15a) which surrounds the potting compound (11) in the first area of the electroceramic component (1), a material wherein the thermal conductivity of said material is greater than the thermal conductivity of a material of the housing (15) in a second housing section (15b), and wherein the housing (15) in the second housing section (15b) surrounding the potting compound (11) in the second area of the electroceramic component (1) comprises a non-conductive material.

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