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公开(公告)号：US20230360857A1
公开(公告)日：2023-11-09
申请号：US18222513
申请日：2023-07-17
CPC分类号： H01G4/30 , H01G2/06 , H01G4/2325
摘要： A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.
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公开(公告)号：US20230245831A1
公开(公告)日：2023-08-03
申请号：US18133570
申请日：2023-04-12
摘要： A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member.
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公开(公告)号：US20220384099A1
公开(公告)日：2022-12-01
申请号：US17752900
申请日：2022-05-25
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.
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公开(公告)号：US20220301780A1
公开(公告)日：2022-09-22
申请号：US17489884
申请日：2021-09-30
摘要： A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via an insulator, holding the two interposers connected via the insulator on a holding portion, placing the capacitor main body on the two interposers on the holding portion such that the external electrode is connected to each of the two interposers, and removing the holding portion.
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公开(公告)号：US20210335547A1
公开(公告)日：2021-10-28
申请号：US17149924
申请日：2021-01-15
发明人： Satoshi YOKOMIZO
IPC分类号： H01G4/30 , H01G4/12 , H01G4/008 , C04B35/468
摘要： An interposer of a multilayer ceramic capacitor includes a first through-hole in which a first pass-through conductive portion is provided on an inside wall thereof. A first surface side of the first through-hole is filled with a first conductive joining material that recessed at a central portion thereof as the first through-hole is seen from a second surface toward a first surface. The interposer includes a second through-hole in which a second pass-through conductive portion is provided on an inside wall thereof. A first surface side of the second through-hole is filled with a second conductive joining material that is recessed at a central portion thereof as the second through-hole is seen from a second surface toward a first surface.
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公开(公告)号：US20240312721A1
公开(公告)日：2024-09-19
申请号：US18670161
申请日：2024-05-21
CPC分类号： H01G4/30 , H01G2/06 , H01G4/2325 , H01G4/248
摘要： A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.
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公开(公告)号：US20220386466A1
公开(公告)日：2022-12-01
申请号：US17752896
申请日：2022-05-25
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and is joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A maximum length of the interposer board is smaller than a length of the electronic element. A width of the interposer board is smaller than a width of the electronic element.
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公开(公告)号：US20220384100A1
公开(公告)日：2022-12-01
申请号：US17752902
申请日：2022-05-25
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A solder layer is provided between the electronic element and the interposer board, joins the electronic element with the interposer board, and includes a solder unfilled region.
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公开(公告)号：US20210335543A1
公开(公告)日：2021-10-28
申请号：US17236022
申请日：2021-04-21
发明人： Satoshi YOKOMIZO
摘要： A multilayer ceramic capacitor includes, on a side of a first external electrode in a length direction of an interposer, a first joining electrode on a first surface and a first mounting electrode on a second surface, a first through conductive portion penetrating the interposer, and a first conductive joining agent providing electrical conduction between the first external electrode and the first joining electrode, and includes on a side of a second external electrode, a second joining electrode on the first surface and a second mounting electrode on the second surface, a second through conductive portion penetrating the interposer, and a second conductive joining agent providing electrical conduction between the second external electrode and the second joining electrode. A first joining region joining the first external electrode and the first conductive joining agent extends directly above an end at an upper end of the first through conductive portion, and a second joining region joining the second external electrode and the second conductive joining agent extends directly above an end at an upper end of the second through conductive portion.
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公开(公告)号：US20200312554A1
公开(公告)日：2020-10-01
申请号：US16822065
申请日：2020-03-18
发明人： Satoshi YOKOMIZO , Toshihiro HARADA
摘要： A multilayer ceramic capacitor includes a laminate and an external electrode. The laminate includes a central layer portion in which first and second internal electrode layers are alternately laminated with a dielectric ceramic layer therebetween, a peripheral layer portion sandwiching the central layer portion in a lamination direction, and a side margin sandwiching the central layer portion and the peripheral layer portion in a width direction. When viewing the laminate and the first external electrode through a cross-section parallel to the width direction and the lamination direction at a central portion in a length direction of the first external electrode, W1>R1 is satisfied and T1>R1 is satisfied.
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