公开(公告)号：US20230420314A1

公开(公告)日：2023-12-28

申请号：US17849760

申请日：2022-06-27

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chin-Hua Wang ,  Yu-Fan Chen ,  Yu Chen Lee ,  Shin-Puu Jeng

IPC分类号： H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/13 ,  H01L24/32 ,  H01L25/0655 ,  H01L24/96 ,  H01L24/97 ,  H01L21/563 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/561 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/73 ,  H01L2924/1437 ,  H01L2924/35121 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2924/15151 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632

摘要： A bonded assembly includes an interposer including redistribution wiring interconnects and redistribution insulating layers and including recesses in corner regions. The recesses include surfaces that are recessed relative to a horizontal plane including a horizontal surface of the interposer. A least one semiconductor die is attached to the interposer through a respective array of solder material portions. An underfill material portion is located between the interposer and the at least one semiconductor die. The underfill material includes downward-protruding anchor portions that protrude downward from a horizontally-extending portion of the underfill material portion that laterally surrounds each array of solder material portions into the recesses.