公开(公告)号：US20180139840A1

公开(公告)日：2018-05-17

申请号：US15867924

申请日：2018-01-11

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jin-Wei You ,  Chun-Lung Chen

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/18

CPC classification number: H05K1/0271 ,  H05K3/007 ,  H05K3/184 ,  H05K3/4682 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2203/0709

Abstract: A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.

公开(公告)号：US09907161B2

公开(公告)日：2018-02-27

申请号：US14833101

申请日：2015-08-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jin-Wei You ,  Chun-Lung Chen

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/18

CPC classification number: H05K1/0271 ,  H05K3/007 ,  H05K3/184 ,  H05K3/4682 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2203/0709

Abstract: A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.

公开(公告)号：US20180046284A1

公开(公告)日：2018-02-15

申请号：US15797885

申请日：2017-10-30

Applicant: FUJIFILM Corporation

Inventor： Kohei HIGASHI ,  Naoki TSUKAMOTO ,  Masataka SATOU

IPC: G06F3/044 ,  C23C18/30 ,  H05K3/18 ,  B32B5/02 ,  H05K1/02 ,  B32B15/04 ,  C23C18/31

CPC classification number: G06F3/044 ,  B32B5/028 ,  B32B15/04 ,  B32B15/08 ,  B32B2307/202 ,  B32B2457/208 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  C23C18/54 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K3/184 ,  H05K2201/09245 ,  H05K2201/10128 ,  H05K2203/0557 ,  H05K2203/072

Abstract: According to the invention, there are provided a conductive film which has a mesh-like metal layer composed of metal thin wires and in which visual recognition of the metal thin wires is suppressed and the metal layer has excellent conductive characteristics, a touch panel sensor, and a touch panel. A conductive film according to the invention includes a substrate; a patterned to-be-plated layer which is disposed on the substrate in a mesh pattern and has a functional group interacting with a plating catalyst or a precursor thereof; and a mesh-like metal layer which is disposed on the patterned to-be-plated layer and has a plurality of metal thin wires intersecting each other, an average thickness of the patterned to-be-plated layer is 0.05 to 100 μm, an average thickness of the metal layer is 0.05 to 0.5 μm, and an average intersection growing rate at an intersection of metal thin wires of the mesh of the metal layer is 1.6 or less.

公开(公告)号：US09795033B2

公开(公告)日：2017-10-17

申请号：US14096514

申请日：2013-12-04

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara

IPC: H01L23/48 ,  H05K1/11 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  G11B5/48 ,  H05K1/18 ,  H05K3/18 ,  H01L21/66 ,  H01L23/31 ,  H01L21/56

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

公开(公告)号：US09699914B2

公开(公告)日：2017-07-04

申请号：US14918227

申请日：2015-10-20

Applicant: Averatek Corporation

Inventor： Mihir Reddy ,  Michael Riley Vinson ,  Sunity K. Sharma

IPC: H05K1/09 ,  H05K3/18 ,  C23C18/00

CPC classification number: H05K3/184 ,  C23C18/00 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1817 ,  C23C18/1841 ,  C23C18/1844 ,  C23C18/1865 ,  C23C18/1889 ,  C23C18/1893 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H05K2203/0565 ,  H05K2203/125

Abstract: Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

公开(公告)号：US09625812B2

公开(公告)日：2017-04-18

申请号：US14413557

申请日：2013-07-02

Applicant: MICRO PROCESS INC.

Inventor： Akifumi Ueda ,  Hidetaka Nakagawara ,  Shintaro Okada ,  Saki Fujita ,  Kazuo Watanabe ,  Shigeki Watanabe

IPC: G03F7/038 ,  G03F7/023 ,  G03F7/022 ,  G03F7/30 ,  G03F7/32 ,  G03F7/40 ,  H05K3/06 ,  H05K3/18 ,  C08F212/14 ,  C08F220/18

CPC classification number: G03F7/038 ,  C08F212/14 ,  C08F220/18 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0388 ,  G03F7/30 ,  G03F7/322 ,  G03F7/40 ,  G03F7/405 ,  H05K3/064 ,  H05K3/184 ,  C08F220/06 ,  C08F220/14 ,  C08F2220/1808 ,  C08F212/08 ,  C08F2220/185 ,  C08F2220/281

Abstract: The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (α) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (β) containing a vinyl-based monomer (b) represented by CH2═CR1COO(R2O)kR3 (wherein R1=a hydrogen atom or a methyl group, R2=a hydrocarbon group having a carbon number of 1 to 4, R3=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.

公开(公告)号：US20160330845A1

公开(公告)日：2016-11-10

申请号：US15107858

申请日：2014-12-22

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Shota OKADE ,  Masahiro MIYASAKA ,  Yukiko MURAMATSU

IPC: H05K3/00 ,  G03F7/20 ,  G03F7/38 ,  C25D7/12 ,  C23C18/16 ,  C25D3/12 ,  C25D3/38 ,  C25D3/48 ,  G03F7/033 ,  G03F7/32

CPC classification number: H05K3/0023 ,  C23C18/1633 ,  C25D3/12 ,  C25D3/38 ,  C25D3/48 ,  C25D5/022 ,  C25D7/00 ,  C25D7/12 ,  G03F7/027 ,  G03F7/033 ,  G03F7/2053 ,  G03F7/322 ,  G03F7/38 ,  H05K3/064 ,  H05K3/108 ,  H05K3/184

Abstract: A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or α-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.

Abstract translation: 感光性树脂组合物包含粘合剂聚合物，光聚合性化合物和光聚合引发剂。 粘合剂聚合物具有衍生自（甲基）丙烯酸的结构单元，衍生自苯乙烯或α-甲基苯乙烯的结构单元和衍生自具有1至12个碳原子的羟烷基的（甲基）丙烯酸羟烷基酯的结构单元 原子 可光聚合化合物包括具有1-20个乙烯氧基结构单元并具有0-7个丙烯氧基结构单元的双酚二（甲基）丙烯酸酯。

公开(公告)号：US09332650B2

公开(公告)日：2016-05-03

申请号：US13494417

申请日：2012-06-12

Applicant: Shingo Yoshioka ,  Hiroaki Fujiwara

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara

IPC: H05K3/02 ,  H05K3/18 ,  H05K1/16 ,  H05K3/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/184 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15173 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/023 ,  H05K1/0284 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/381 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4661 ,  H05K2201/09381 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2203/0108 ,  H05K2203/0565 ,  Y10T29/49114 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film.

Abstract translation: 本发明涉及一种制造多层电路板的方法，包括：在绝缘基板的表面上形成可溶胀树脂膜的成膜步骤，形成电路槽的电路槽形成步骤，该电路槽的深度等于或等于 大于膜的外表面上的可溶胀树脂膜的厚度，在电路槽的表面和可溶胀树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤， 分离步骤，用特定的液体使溶胀性树脂膜溶胀，然后从膨胀的基材表面分离溶胀的树脂膜;以及电镀处理步骤，仅在由镀催化剂或电镀催化剂形成的镀层催化剂的区域形成无电镀膜 电镀催化剂前体在分离膜后保持未分离。

公开(公告)号：US09070393B2

公开(公告)日：2015-06-30

申请号：US14196363

申请日：2014-03-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC: H01L23/04 ,  G11B5/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/18 ,  H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/31 ,  H01L21/56 ,  H01L23/14

CPC classification number: G11B5/486 ,  H01L21/4846 ,  H01L21/565 ,  H01L22/12 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49866 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82385 ,  H01L2224/82399 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/386 ,  H01L2924/3862 ,  H05K1/111 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2203/1461 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Abstract translation: 本发明的一个方面是一种三维结构，其中在表面上形成布线，所述三维结构具有绝缘树脂层，所述绝缘树脂层含有由选自典型非金属元素中的至少一种元素形成的填料和 典型的金属元件，其中在绝缘树脂层的表面上形成用于布线的凹槽，并且布线导体的至少一部分嵌入到凹槽中用于布线。

公开(公告)号：US20150171312A1

公开(公告)日：2015-06-18

申请号：US14632006

申请日：2015-02-26

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Tatsuya Honda

IPC: H01L41/27

CPC classification number: H01L41/27 ,  G02F1/1368 ,  H01H2057/006 ,  H01L23/481 ,  H01L27/20 ,  H01L41/0986 ,  H01L41/29 ,  H01L2924/0002 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/181 ,  H05K3/184 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49105 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method for manufacturing a switching element which has enough resistance to repeat switching operations and which can be miniaturized and have low power consumption, and a display device including the switching element are provided. The switching element includes a first electrode to which a constant potential is applied, a second electrode adjacent to the first electrode, and a third electrode over the first electrode with a spacer layer formed of a piezoelectric material interposed therebetween and provided across the second electrode such that there is a gap between the second electrode and the third electrode. A potential which is different from or approximately the same as a potential of the first electrode is applied to the third electrode to expand and contract the spacer layer, so that a contact state or a noncontact state between the second electrode and the third electrode can be selected.

Abstract translation: 一种制造开关元件的方法，其具有足够的电阻以重复开关操作并且可以小型化并且具有低功耗，并且提供了包括开关元件的显示装置。 开关元件包括施加恒定电位的第一电极，与第一电极相邻的第二电极，以及位于第一电极之上的第三电极，隔着层由插入其间的压电材料形成，并且设置在第二电极两侧， 在第二电极和第三电极之间存在间隙。 将与第一电极的电位不同或大致相同的电位施加到第三电极以使间隔层膨胀和收缩，使得第二电极和第三电极之间的接触状态或非接触状态可以是 选择。