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公开(公告)号：US20180332713A1
公开(公告)日：2018-11-15
申请号：US16042947
申请日：2018-07-23
申请人： Averatek Corporation
IPC分类号： H05K3/18 , C23C18/20 , C23C18/16 , C23C18/18 , C23C18/38 , C23C18/32 , C23C18/30 , C23C18/00
CPC分类号： H05K3/184 , C23C18/00 , C23C18/1608 , C23C18/161 , C23C18/1817 , C23C18/1841 , C23C18/1844 , C23C18/1865 , C23C18/1889 , C23C18/1893 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , H05K2203/0565 , H05K2203/125
摘要： Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
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2.发明申请公开(公告)号：US20160113121A1
公开(公告)日：2016-04-21
申请号：US14918227
申请日：2015-10-20
申请人： Averatek Corporation
CPC分类号： H05K3/184 , C23C18/00 , C23C18/1608 , C23C18/161 , C23C18/1817 , C23C18/1841 , C23C18/1844 , C23C18/1865 , C23C18/1889 , C23C18/1893 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , H05K2203/0565 , H05K2203/125
摘要： Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
摘要翻译： 介绍了在基板上图案化无电金属的方法和装置。 衬底上的活性催化剂层可以用图案化掩模覆盖并用钝化化学试剂处理，其使未被掩模覆盖的催化剂层失活。 一旦图案化掩模被去除，化学金属层可被放置成具有图案化的无电金属。 或者，可以在将催化剂层置于封闭剂层之上，然后将无电金属层放置在催化剂层上之前，首先以模式首先用封装剂涂覆底物以抑制催化剂层的形成。 封闭试剂的图案作为最终导电线图案的负图案。
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公开(公告)号：US20170354040A1
公开(公告)日：2017-12-07
申请号：US15632216
申请日：2017-06-23
申请人： Averatek Corporation
IPC分类号： H05K3/18 , C23C18/16 , C23C18/00 , C23C18/32 , C23C18/30 , C23C18/20 , C23C18/18 , C23C18/38
CPC分类号： H05K3/184 , C23C18/00 , C23C18/1608 , C23C18/161 , C23C18/1817 , C23C18/1841 , C23C18/1844 , C23C18/1865 , C23C18/1889 , C23C18/1893 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , H05K2203/0565 , H05K2203/125
摘要： Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
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公开(公告)号：US10034386B2
公开(公告)日：2018-07-24
申请号：US15632216
申请日：2017-06-23
申请人： Averatek Corporation
IPC分类号： H05K1/11 , H05K3/18 , C23C18/18 , C23C18/00 , C23C18/20 , C23C18/16 , C23C18/38 , C23C18/32 , C23C18/30
摘要： Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
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公开(公告)号：US09699914B2
公开(公告)日：2017-07-04
申请号：US14918227
申请日：2015-10-20
申请人： Averatek Corporation
CPC分类号： H05K3/184 , C23C18/00 , C23C18/1608 , C23C18/161 , C23C18/1817 , C23C18/1841 , C23C18/1844 , C23C18/1865 , C23C18/1889 , C23C18/1893 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , H05K2203/0565 , H05K2203/125
摘要： Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
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