公开(公告)号：US12120827B2

公开(公告)日：2024-10-15

申请号：US16924796

申请日：2020-07-09

申请人： AJINOMOTO CO., INC.

发明人： Kazuhiko Tsurui

IPC分类号： H05K3/00 ,  C23C14/20 ,  C23C14/34

CPC分类号： H05K3/0044 ,  C23C14/20 ,  C23C14/34 ,  H05K2203/0221 ,  H05K2203/0264 ,  H05K2203/107 ,  H05K2203/125

摘要： Provided is a technique that can achieve an insulating layer with small surface undulations and can suppress a haloing phenomenon in manufacturing a printed wiring board even when using a thin resin composition layer. Specifically, provided is a method for manufacturing a printed wiring board that includes the steps of: (A) preparing a resin sheet with an inorganic layer including (i) a support with an inorganic layer including an inorganic layer, a support in contact with the inorganic layer, and a release layer and (ii) a resin composition layer in contact with the release layer of the support with an inorganic layer; (B) laminating the resin sheet with an inorganic layer onto an internal layer substrate so that the resin composition layer of the resin sheet with an inorganic layer is in contact with the internal layer substrate; (C) curing the resin composition layer to form an insulating layer; and (D) perforating the insulating layer.

公开(公告)号：US20240008187A1

公开(公告)日：2024-01-04

申请号：US18039379

申请日：2020-12-01

申请人： Hewlett-Packard Development Company, L.P.

发明人： Elizabeth Ann GALATI ,  John Samuel Dilip JANGAM ,  Thomas Craig ANTHONY ,  Aja Pariante HARTMAN ,  Kristopher J. ERICKSON

IPC分类号： H05K3/10 ,  H05K1/09

CPC分类号： H05K3/105 ,  H05K1/097 ,  H05K2203/125 ,  H05K2203/0783

摘要： The present disclosure relates to a conductive trace precursor composition comprising a metal salt; 3 to 15 weight % of a reducing solvent selected from a lactam and/or a polyol, and water. Where the reducing solvent is 2-pyrrolidinone, the 2-pyrrolidinone is not present in an amount of 5 weight % or in an amount of 7.5 weight % of the conductive trace precursor composition.

公开(公告)号：US20190239357A1

公开(公告)日：2019-08-01

申请号：US16246799

申请日：2019-01-14

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Jolanta Klocek ,  Thomas Krivec

IPC分类号： H05K3/06 ,  C23F1/16

CPC分类号： H05K3/067 ,  C23F1/16 ,  H05K2203/124 ,  H05K2203/125

摘要： An etching composition for etching an electrically conductive layer structure for forming a conductor track is provided. The etching composition includes an etchant, a highly branched compound and optionally a solvent. In addition, a method of etching an electrically conductive layer structure, a conductor track, an arrangement of at least two conductor tracks, and a component carrier are provided.

公开(公告)号：US20180352652A1

公开(公告)日：2018-12-06

申请号：US15609103

申请日：2017-05-31

申请人： International Business Machines Corporation

发明人： MATTHEW S. DOYLE ,  JEFFREY N. JUDD ,  JOSEPH KUCZYNSKI ,  SCOTT D. STRAND ,  TIMOTHY J. TOFIL

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H05K3/30 ,  H02H3/08 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/0293 ,  H05K1/116 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/0326 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/10151 ,  H05K2203/125

摘要： A process of utilizing a heat-activated conductive spinel material for PCB via overcurrent protection includes forming a PCB laminate structure that includes a spinel-doped insulator layer having a heat-activated conductive spinel material incorporated into a dielectric material as a spinel-based electrically non-conductive metal oxide. A sensing via is formed in the PCB laminate structure at a location that is proximate to a power via in the PCB laminate structure. The sensing via is electrically isolated from the power via by a region of the spinel-doped insulator layer and is electrically connected to a monitoring component configured to detect current flow through the sensing via that results from an overcurrent event in the power via that generates sufficient heat to cause the spinel-based electrically conductive metal oxide to release metal nuclei into the region to provide a conductive pathway through the region from the power via to the sensing via.

公开(公告)号：US20180332713A1

公开(公告)日：2018-11-15

申请号：US16042947

申请日：2018-07-23

申请人： Averatek Corporation

发明人： Mihir Reddy ,  Michael Riley Vinson ,  Sunity K. Sharma

IPC分类号： H05K3/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/18 ,  C23C18/38 ,  C23C18/32 ,  C23C18/30 ,  C23C18/00

CPC分类号： H05K3/184 ,  C23C18/00 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1817 ,  C23C18/1841 ,  C23C18/1844 ,  C23C18/1865 ,  C23C18/1889 ,  C23C18/1893 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H05K2203/0565 ,  H05K2203/125

摘要： Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

公开(公告)号：US10059852B2

公开(公告)日：2018-08-28

申请号：US14242763

申请日：2014-04-01

申请人： SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Bifeng Mao ,  Weifeng Miao

IPC分类号： C23C18/40 ,  H05K3/18 ,  C09D11/322 ,  C23C18/18 ,  C23C18/16 ,  C23C18/20 ,  C01G37/00 ,  C01G39/00 ,  C01G49/00 ,  C01G15/00 ,  C09D11/10 ,  B01J37/34 ,  B01J37/04 ,  B01J37/08 ,  B01J23/00 ,  B01J23/825 ,  B01J23/86 ,  B01J23/887 ,  B01J35/02 ,  B01J37/00 ,  B01J31/06

CPC分类号： C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

摘要： The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

公开(公告)号：US09809489B2

公开(公告)日：2017-11-07

申请号：US14849960

申请日：2015-09-10

申请人： JSR Corporation

发明人： Sugirou Shimoda ,  Kenzou Ookita ,  Keisuke Satou ,  Kazuto Watanabe

IPC分类号： H01B1/02 ,  C03C17/10 ,  H05K1/09 ,  H05K3/18 ,  G06F3/044 ,  G06F3/041 ,  H05K1/03 ,  H05K3/38

CPC分类号： C03C17/10 ,  C03C2217/253 ,  C03C2217/256 ,  C03C2217/27 ,  C03C2218/365 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04111 ,  H01B1/02 ,  H05K1/0306 ,  H05K1/0386 ,  H05K1/097 ,  H05K3/188 ,  H05K3/38 ,  H05K2203/1157 ,  H05K2203/125

摘要： A composition for forming a conductive film includes at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, and a metalloxane compound (B). The metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au. The metalloxane compound (B) has at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain. Preferably, the metal salt (A1) is a carboxylate containing a metal selected from the group consisting of Cu, Ag, and Ni. Preferably, the metal particle (A2) has an average particle diameter of 5 nm to 100 nm and comprises a metal selected from the group consisting of Cu, Ag, and Ni.

公开(公告)号：US20160360612A1

公开(公告)日：2016-12-08

申请号：US15241871

申请日：2016-08-19

申请人： WASEDA UNIVERSITY

发明人： Eiji Iwase ,  Tomoya Koshi

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/09 ,  H05K3/22

CPC分类号： H05K1/0283 ,  H05K1/0277 ,  H05K1/03 ,  H05K1/092 ,  H05K1/11 ,  H05K1/118 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/225 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/2009 ,  H05K2203/0723 ,  H05K2203/0776 ,  H05K2203/105 ,  H05K2203/125 ,  H05K2203/173

摘要： A self-healing wire includes, an electric wire arranged on a substrate, and a hybrid structure in which the electric wire is covered with at least one fluid selected from the group consisting of a fluid having conductive particles dispersed therein and a fluid having metal ions dissolved therein, formed on a healing portion for a crack to be generated in the electric wire. And a stretchable device includes the self-healing wire formed on a stretchable base material and an electric element mounted only on a base material higher in rigidity than the stretchable base material. Even when a crack is generated in the electric wire due to stretching of the substrate having flexibility, the crack is bridged by the conductive particles or a solid metal deposited from the metal ions in the fluid. Thus the self-healing wire and the stretchable device having both high conductivity and high stretchability are provided.

摘要翻译： 自修复线包括布置在基板上的电线，以及混合结构，其中电线被选自由其中分散有导电粒子的流体和具有金属离子的流体组成的组中的至少一种流体覆盖 溶解在其中，形成在用于在电线中产生的裂纹的愈合部分上。 另外，可拉伸装置包括形成在可拉伸基材上的自修复线，以及只安装在刚性高于伸缩性基材的基材上的电气元件。 即使由于具有柔性的基板的拉伸而在电线中产生裂纹，所以裂纹由导电颗粒或从流体中的金属离子沉积的固体金属桥接。 因此，提供了具有高导电性和高拉伸性的自愈线和可拉伸装置。

公开(公告)号：US20160230289A1

公开(公告)日：2016-08-11

申请号：US15134672

申请日：2016-04-21

申请人： Samsung Display Co., Ltd. ,  LTCAM CO., LTD.

发明人： Bong-Yeon Kim ,  Jin-Ho Ju ,  Jun-Hyuk Woo ,  Jung-Hwan Song ,  Seok-Ho Lee ,  Seong-Sik Jeon ,  Jong-Su Han

IPC分类号： C23F1/16 ,  C23F11/04 ,  C11D7/32 ,  C11D7/26 ,  C11D11/00 ,  C11D7/08

CPC分类号： C23F1/16 ,  C11D7/06 ,  C11D7/08 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D11/0047 ,  C23F11/04 ,  H01L21/02068 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2203/124 ,  H05K2203/125

摘要： A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

公开(公告)号：US09226405B1

公开(公告)日：2015-12-29

申请号：US14584506

申请日：2014-12-29

申请人： International Business Machines Corporation

发明人： Matthew S. Doyle ,  Joseph Kuczynski ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

IPC分类号： H05K3/06 ,  C09K13/00 ,  C09K13/12 ,  H01F1/44

CPC分类号： H05K3/067 ,  C09K13/12 ,  H01F1/442 ,  H05K2203/0323 ,  H05K2203/104 ,  H05K2203/125

摘要： The method includes applying a magnetic etching ferrofluid, that contains an aqueous etchant solution within one or more reverse micelles responsive to a magnetic field, onto the substrate at a first depth. The method also includes creating a magnetic field at a first strength that causes the reverse micelle to move in a first direction at a first rate. The method also includes determining whether the substrate is at a second depth. The method also includes reducing, in response to the substrate being at a second depth, the magnetic field to a second strength to cause the reverse micelle to move in the first direction at a second rate.

摘要翻译： 该方法包括在第一深度处将基于磁场的一个或多个反胶束中含有水性蚀刻剂溶液的磁性蚀刻铁磁体应用于基底上。 该方法还包括产生第一强度的磁场，使得反向胶束以第一速率在第一方向上移动。 该方法还包括确定衬底是否处于第二深度。 该方法还包括响应于衬底处于第二深度，将磁场减小到第二强度，以使反胶束以第二速率在第一方向上移动。