公开(公告)号：US20240306301A1

公开(公告)日：2024-09-12

申请号：US18684051

申请日：2022-07-15

Applicant: Samkee Ev Co., Ltd.

Inventor： Gyu Sik CHO

IPC: H05K1/11 ,  H01R12/77 ,  H05K1/02

CPC classification number: H05K1/118 ,  H01R12/771 ,  H05K1/028 ,  H05K2201/2009

Abstract: Embodiment relates to a flat flexible printed circuit and, more specifically, to a flat flexible printed circuit which is flexible, due to the inclusion of films, and on which a surface mount technology (SMT) terminal can be mounted. According to the embodiment, the flat flexible printed circuit includes a film material capable of withstanding high temperatures, and thus can be electrically connected to an external device in a high-temperature environment and, as a result, is highly versatile.

公开(公告)号：US11942708B2

公开(公告)日：2024-03-26

申请号：US17454948

申请日：2021-11-15

Applicant: NIPPON MEKTRON, LTD.

Inventor： Masanori Hirata ,  Shunsuke Aoyama ,  Yu Miura ,  Kenji Kiya

IPC: H01R12/69 ,  H01R43/048 ,  H05K1/18

CPC classification number: H01R12/69 ,  H01R43/048 ,  H05K1/189 ,  H05K2201/10333 ,  H05K2201/10522 ,  H05K2201/2009

Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

公开(公告)号：US20240057249A1

公开(公告)日：2024-02-15

申请号：US18446487

申请日：2023-08-09

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  HeeSoo LEE ,  YeJin PARK

IPC: H05K1/02 ,  H05K1/18 ,  H01L25/16 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L21/56 ,  H05K3/28

CPC classification number: H05K1/0271 ,  H05K1/18 ,  H01L25/16 ,  H01L23/3121 ,  H01L23/552 ,  H05K9/0022 ,  H01L21/56 ,  H05K3/284 ,  H05K2201/2009 ,  H05K2201/10189 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: An electronic package comprises: a substrate comprising a first region and a second region adjacent to the first region in a lengthwise direction of the substrate; a first electronic component mounted on the substrate in the first region; a second electronic component mounted on the substrate in the second region, wherein the second electronic component does not occupy an entirety of the substrate in a widthwise direction of the substrate; and an encapsulant layer formed on the substrate, wherein at least the second electronic component is exposed from the encapsulant layer, and wherein the encapsulant layer extends from the first region to the second region to reinforce the substrate in both the first region and the second region.

公开(公告)号：US11839018B2

公开(公告)日：2023-12-05

申请号：US17427110

申请日：2020-12-17

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Wenxiao Niu ,  Xinpeng Wang ,  Hengzhen Liang ,  Xiaolong Zhu ,  Lianbin Liu

IPC: H05K1/18 ,  H05K1/02 ,  G06F3/041 ,  G06F3/044 ,  H10K59/40 ,  H10K59/131

CPC classification number: H05K1/0218 ,  G06F3/04164 ,  H05K1/0281 ,  H05K1/189 ,  G06F3/0412 ,  G06F3/0446 ,  H05K2201/0715 ,  H05K2201/09027 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09509 ,  H05K2201/10128 ,  H05K2201/10189 ,  H05K2201/2009 ,  H10K59/131 ,  H10K59/40

Abstract: A flexible printed circuit board and a display touch apparatus are provided. The flexible printed circuit board includes a binding terminal region, a first circuit region and a second circuit region; the binding terminal region includes multiple terminals, the first circuit region includes a driver circuit, multiple first signal lines, multiple second signal lines, and multiple third signal lines, and the second circuit region includes an external connector; first ends of the multiple first signal lines, the multiple second signal lines and the multiple third signal lines are respectively connected to the terminals of the binding terminal region; second ends of the multiple first signal lines and the multiple second signal lines are respectively connected to the driver circuit; and second ends of the multiple third signal lines are connected to the connector.

公开(公告)号：US11810906B2

公开(公告)日：2023-11-07

申请号：US16920194

申请日：2020-07-02

Applicant: LG Display Co., Ltd.

Inventor： Seulki Kim

IPC: H01L27/12 ,  H01L27/15 ,  H05K1/14 ,  H01L33/62 ,  H01L25/16 ,  G09F9/30 ,  H05K1/02 ,  H01L25/075 ,  H10K102/00

CPC classification number: H01L25/167 ,  G09F9/301 ,  H01L25/0753 ,  H01L27/124 ,  H01L27/156 ,  H05K1/0283 ,  H01L33/62 ,  H05K1/0268 ,  H05K1/147 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/162 ,  H10K2102/311

Abstract: A stretchable display device according to one or more embodiments of the present disclosure includes a lower substrate including a display area, a first non-display area disposed at a left side and a right side of the display area, and a second non-display area disposed above and below the display area and the first non-display area, a plurality of first substrates disposed on the lower substrate in the display area and defining a plurality of pixels, a plurality of second substrates disposed on the lower substrate in the first non-display area and including a gate driver disposed thereon, and an inspection unit disposed on the lower substrate in the second non-display area and including a plurality of inspection substrates connected to a second substrate which is the most adjacent to the second non-display area among the plurality of second substrates.

公开(公告)号：US20190254160A1

公开(公告)日：2019-08-15

申请号：US16393477

申请日：2019-04-24

Applicant: Longitude Licensing Limited

Inventor： Sensho Usami

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H05K1/18 ,  H01L25/00 ,  H01L23/16

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/2009 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00014

Abstract: One semiconductor device includes a wiring substrate, a first semiconductor chip that is mounted on one surface of the wiring substrate, a second semiconductor chip that is laminated on the first semiconductor chip so as to form exposed surfaces where the surface of the first semiconductor chip is partially exposed, silicon substrates that are mounted on the exposed surfaces and serve as warping control members, and an encapsulation body that is formed on the wiring substrate so as to cover the first semiconductor chip, the second semiconductor chip and the silicon substrates.

公开(公告)号：US20180359849A1

公开(公告)日：2018-12-13

申请号：US15805195

申请日：2017-11-07

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akira TANAKA ,  Masaya HIRASHIMA ,  Satoru YASUI ,  Shukuyo YAMADA

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/111 ,  H05K1/183 ,  H05K3/34 ,  H05K3/3442 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278

Abstract: According to one embodiment, provided are an electronic device and an electronic component protection substrate in which an electronic component is prevented from entering an irregular state. According to the electronic device of the present embodiment, an electronic component is soldered onto a pattern line of a printed circuit substrate, and a surface of the printed circuit substrate where the electronic component is disposed is formed as a recess such that the thickness of the printed circuit substrate in the recess part is thinned.

公开(公告)号：US20180269610A1

公开(公告)日：2018-09-20

申请号：US15921671

申请日：2018-03-15

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： SHUO-HSIU HSU

IPC: H01R12/79 ,  H05K1/18 ,  H05K1/02 ,  H04B1/40

CPC classification number: H01R12/79 ,  H04B1/3888 ,  H04B1/40 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A connector assembly having two ends respectively connected to a case and a main circuit board comprises a bracket, a bottom plate assembled on the bottom of the bracket and a flexible circuit board located between the bracket and the bottom plate. The bracket includes a mating surface attached to the case, a mounting surface opposite the mating surface, and a receiving cavity recessed inwardly from the mounting surface. The bracket includes a pair of openings extending through the mating surface thereof and communicating with the receiving cavity. A pair of chip modules are disposed on the flexible circuit board corresponding to the openings. One side of the flexible circuit board, which is farther away from the bracket, includes an electrical connector for mating with the main circuit board.

公开(公告)号：US20180235087A1

公开(公告)日：2018-08-16

申请号：US15862693

申请日：2018-01-05

Applicant: Oclaro Japan, Inc.

Inventor： Yoshikuni UCHIDA ,  Naohiko BABA ,  Hideaki ASAKURA ,  Michihide SASADA ,  Kazuhiro KOMATSU

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/34 ,  H05K1/11 ,  G02B6/42

CPC classification number: H05K1/189 ,  G02B6/4245 ,  G02B6/4262 ,  G02B6/4279 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/3463 ,  H05K2201/2009

Abstract: A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.

公开(公告)号：US10039192B1

公开(公告)日：2018-07-31

申请号：US15703174

申请日：2017-09-13

Applicant: WIESON TECHNOLOGIES CO., LTD.

Inventor： Qiang-Long Hu ,  Wen-Sheng Liu

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/36 ,  H01R12/59 ,  H05K1/14 ,  H05K3/34 ,  H01R12/77

CPC classification number: H05K1/189 ,  H01R12/59 ,  H01R12/61 ,  H01R12/778 ,  H01R13/6461 ,  H05K1/117 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3447 ,  H05K3/3457 ,  H05K3/363 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09327 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: The present disclosure illustrates an ultra-thin dual-channel flexible circuit bridge connector including a dual-channel flexible circuit board, a first connection interface and a second connection interface. The dual-channel flexible circuit board includes, in a sequential order, a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer. The first connection interface and the second connection interface can be used to link two extend interface cards spaced apart by various distances, thereby forming a bridge status. The ground layer between the first circuit layer and the second circuit layer can be served as a common reference plane for dual-channel high frequency signal transmission and provide shielding and isolating effect, so as to satisfy the requirement for working bandwidth to satisfy the requirement for characteristic impedance, reduce skin effect, reduce EMI and crosstalk interference.