公开(公告)号：US20190212604A1

公开(公告)日：2019-07-11

申请号：US16358164

申请日：2019-03-19

申请人： LG Display Co., Ltd.

发明人： Kaoru FURUTA

IPC分类号： G02F1/1345 ,  G02F1/1333

CPC分类号： G02F1/13452 ,  G02F1/13336 ,  H05K1/189 ,  H05K3/3463 ,  H05K2201/10128

摘要： A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

公开(公告)号：US20190193210A1

公开(公告)日：2019-06-27

申请号：US16290401

申请日：2019-03-01

申请人： FUJI ELECTRIC CO., LTD.

发明人： Hirohiko WATANABE ,  Shunsuke Saito ,  Yoshihiro Kodaira

IPC分类号： B23K35/02 ,  B23K1/20 ,  B23K35/26 ,  C22C13/02 ,  H01L21/48 ,  H01L23/00

CPC分类号： B23K35/0222 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/42 ,  C22C13/02 ,  H01L21/4853 ,  H01L24/00 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/29211 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/3463 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

公开(公告)号：US20180318969A1

公开(公告)日：2018-11-08

申请号：US15802963

申请日：2017-11-03

申请人： International Business Machines Corporation

发明人： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC分类号： B23K35/362 ,  B23K35/30 ,  B23K35/02 ,  H05K3/34 ,  B23K35/36 ,  B23K35/28 ,  B23K35/26 ,  B23K101/42

CPC分类号： B23K35/362 ,  B23K35/0227 ,  B23K35/025 ,  B23K35/262 ,  B23K35/268 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  H05K3/3463 ,  H05K2203/176

摘要： A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

公开(公告)号：US20180199445A1

公开(公告)日：2018-07-12

申请号：US15735726

申请日：2016-06-17

申请人： Nippon Telegraph and Telephone Corporation

发明人： Mitsuo Usui ,  Kiyofumi Kikuchi ,  Ken Tsuzuki ,  Hiroshi Fukuda ,  Shuichiro Asakawa ,  Shin Kamei ,  Shunichi Soma ,  Takashi Saida

IPC分类号： H05K3/36 ,  H05K3/34 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC分类号： H05K3/363 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K1/189 ,  H05K3/3463 ,  H05K3/36

摘要： In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.

公开(公告)号：US09972597B2

公开(公告)日：2018-05-15

申请号：US14800613

申请日：2015-07-15

申请人： HYUNDAI MOTOR COMPANY

发明人： Kyoung-Kook Hong ,  Hyun Woo Noh ,  Youngkyun Jung ,  Dae Hwan Chun ,  Jong Seok Lee ,  Su Bin Kang

IPC分类号： B23K31/00 ,  B23K35/00 ,  H01L23/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K20/02 ,  B23K20/16 ,  B23K20/233 ,  H05K3/34 ,  B23K101/42 ,  B23K103/16

CPC分类号： H01L24/83 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K35/025 ,  B23K35/264 ,  B23K35/3006 ,  B23K2101/42 ,  B23K2103/166 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/13294 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/29294 ,  H01L2224/29313 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/32505 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81825 ,  H01L2224/8184 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2924/00015 ,  H01L2924/10272 ,  H01L2924/201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10166 ,  H05K2203/1131 ,  H01L2224/29388 ,  H01L2924/00014 ,  H01L2224/13388 ,  H01L2924/00012

摘要： A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of silver particles and a plurality of bismuth particles. The method further includes disposing the semiconductor on the substrate and forming a bonding layer by heating the silver paste, wherein the semiconductor and the substrate are bonded to each other by the bonding layer.

公开(公告)号：US20170374743A1

公开(公告)日：2017-12-28

申请号：US15699570

申请日：2017-09-08

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Arata KISHI ,  Hironori MUNAKATA ,  Koji MOTOMURA ,  Hiroki MARUO

IPC分类号： H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US09764430B2

公开(公告)日：2017-09-19

申请号：US15120937

申请日：2015-02-19

申请人： KOKI Company Limited

发明人： Atsushi Irisawa ,  Rie Wada

IPC分类号： H01L23/14 ,  B23K35/36 ,  B23K35/26 ,  B23K35/02 ,  C22C13/02 ,  H05K3/34 ,  H01L23/00 ,  B23K101/40

CPC分类号： B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/36 ,  B23K2101/40 ,  C22C13/02 ,  H01L24/16 ,  H01L2224/13611 ,  H01L2224/1362 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2924/01032 ,  H01L2924/014 ,  H05K3/3463

摘要： Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.

公开(公告)号：US09761552B2

公开(公告)日：2017-09-12

申请号：US15271744

申请日：2016-09-21

申请人： FUJITSU LIMITED

发明人： Kozo Shimizu ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20170182600A1

公开(公告)日：2017-06-29

申请号：US15116275

申请日：2014-02-04

申请人： Senju Metal Industry Co., Ltd.

发明人： Hiroyoshi Kawasaki ,  Takahiro Roppongi ,  Daisuke Soma ,  Isamu Sato

IPC分类号： B23K35/02 ,  C22F1/10 ,  B23K35/30 ,  C22C19/03 ,  B22F1/00 ,  B22F9/08 ,  C22F1/08 ,  C22C9/00

CPC分类号： B23K35/0244 ,  B22F1/0003 ,  B22F1/0048 ,  B22F1/025 ,  B22F9/08 ,  B22F9/082 ,  B22F9/14 ,  B22F2009/0848 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0623 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/42 ,  C22C9/00 ,  C22C19/03 ,  C22F1/08 ,  C22F1/10 ,  H01L23/49816 ,  H01L23/556 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13117 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13149 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13172 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13179 ,  H01L2224/1318 ,  H01L2224/13181 ,  H01L2224/13183 ,  H01L2224/13184 ,  H01L2224/132 ,  H01L2224/13211 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13323 ,  H01L2224/13324 ,  H01L2224/13338 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13363 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1337 ,  H01L2224/13371 ,  H01L2224/13372 ,  H01L2224/13373 ,  H01L2224/13376 ,  H01L2224/13378 ,  H01L2224/13379 ,  H01L2224/1338 ,  H01L2224/13381 ,  H01L2224/13383 ,  H01L2224/13384 ,  H01L2224/1339 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1369 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81011 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  B22F2202/13 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01051 ,  H01L2924/01032 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01033 ,  H01L2924/00014 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/01016 ,  H01L2924/01013 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/0106 ,  H01L2924/01071 ,  H01L2924/01069 ,  H01L2924/01021 ,  H01L2924/01068 ,  H01L2924/01059 ,  H01L2924/01067 ,  H01L2924/01066 ,  H01L2924/01065 ,  H01L2924/01064 ,  H01L2924/01061 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/0107 ,  H01L2924/01058 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01052 ,  H01L2924/01076 ,  H01L2924/01072 ,  H01L2924/01043 ,  H01L2924/01004

摘要： Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.

公开(公告)号：US09527167B2

公开(公告)日：2016-12-27

申请号：US14005948

申请日：2012-03-28

申请人： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

发明人： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

IPC分类号： B23K35/00 ,  B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  B32B15/01 ,  H05K3/34 ,  H01L23/00

CPC分类号： B23K35/0244 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B32B15/018 ,  C22C13/00 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/2076 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/207 ,  H01L2924/00014

摘要： A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.

摘要翻译： 一种用于BGA或CSP电极的无铅焊球，其包含0.5-1.1质量％的Ag，0.7-0.8质量％的Cu，0.05-0.08质量％的Ni和余量的Sn。 即使焊接有焊锡球的印刷电路板具有Cu电极或镀Au或Pd / Ni的Ni电极，焊球也具有良好的耐跌落冲击能力。 组合物还可以含有0.003〜0.1质量％的总量为0.003〜0.1质量％的Fe，Co，Pt中的至少一种元素，或选自Bi，In，Sb，P，Ge中的至少一种元素，总量为0.003 -0.1质量％。