公开(公告)号：US20240090127A1

公开(公告)日：2024-03-14

申请号：US18273772

申请日：2021-10-22

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Yonglin CHEN ,  Yunhan XIAO ,  Hongjin HU ,  Jiaxiang ZHANG ,  Kun ZUO ,  Mingqiang WANG ,  Jiuyuan BAI

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K1/0283 ,  H05K1/0298 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/305 ,  H05K3/3463 ,  H05K2201/10128

摘要： Provided is a flexible circuit board. The flexible circuit board includes a circuit substrate; wherein the circuit substrate is a multilayer flexible circuit board, wherein at least two layers of the multilayer flexible circuit board include plated sublayers, and a plurality of grooves are disposed in a first surface of the multilayer flexible circuit board, a depth of the groove being not less than a depth of the plated sublayer closest to the first surface in the multilayer flexible circuit board.

公开(公告)号：US11850685B2

公开(公告)日：2023-12-26

申请号：US16290401

申请日：2019-03-01

申请人： FUJI ELECTRIC CO., LTD.

发明人： Hirohiko Watanabe ,  Shunsuke Saito ,  Yoshihiro Kodaira

IPC分类号： B23K35/02 ,  C22C13/02 ,  B23K35/26 ,  B23K1/20 ,  B23K1/00 ,  H01L23/00 ,  H01L21/48 ,  H05K3/34 ,  B23K101/42 ,  B23K35/362

CPC分类号： B23K35/0222 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  C22C13/02 ,  H01L21/4853 ,  H01L24/00 ,  H01L24/29 ,  H01L24/48 ,  B23K35/362 ,  B23K2101/42 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3463 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/29111 ,  H01L2924/01051 ,  H01L2224/29111 ,  H01L2924/01047 ,  H01L2224/29111 ,  H01L2924/01028 ,  H01L2224/29111 ,  H01L2924/01032 ,  H01L2224/29111 ,  H01L2924/01015 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/83455 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012

摘要： A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

申请人： Alpha Assembly Solutions Inc.

发明人： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC分类号： B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC分类号： B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

摘要： A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US20190212604A1

公开(公告)日：2019-07-11

申请号：US16358164

申请日：2019-03-19

申请人： LG Display Co., Ltd.

发明人： Kaoru FURUTA

IPC分类号： G02F1/1345 ,  G02F1/1333

CPC分类号： G02F1/13452 ,  G02F1/13336 ,  H05K1/189 ,  H05K3/3463 ,  H05K2201/10128

摘要： A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

公开(公告)号：US20190193210A1

公开(公告)日：2019-06-27

申请号：US16290401

申请日：2019-03-01

申请人： FUJI ELECTRIC CO., LTD.

发明人： Hirohiko WATANABE ,  Shunsuke Saito ,  Yoshihiro Kodaira

IPC分类号： B23K35/02 ,  B23K1/20 ,  B23K35/26 ,  C22C13/02 ,  H01L21/48 ,  H01L23/00

CPC分类号： B23K35/0222 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/42 ,  C22C13/02 ,  H01L21/4853 ,  H01L24/00 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/29211 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/3463 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

公开(公告)号：US20180318969A1

公开(公告)日：2018-11-08

申请号：US15802963

申请日：2017-11-03

申请人： International Business Machines Corporation

发明人： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC分类号： B23K35/362 ,  B23K35/30 ,  B23K35/02 ,  H05K3/34 ,  B23K35/36 ,  B23K35/28 ,  B23K35/26 ,  B23K101/42

CPC分类号： B23K35/362 ,  B23K35/0227 ,  B23K35/025 ,  B23K35/262 ,  B23K35/268 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  H05K3/3463 ,  H05K2203/176

摘要： A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

公开(公告)号：US20180199445A1

公开(公告)日：2018-07-12

申请号：US15735726

申请日：2016-06-17

申请人： Nippon Telegraph and Telephone Corporation

发明人： Mitsuo Usui ,  Kiyofumi Kikuchi ,  Ken Tsuzuki ,  Hiroshi Fukuda ,  Shuichiro Asakawa ,  Shin Kamei ,  Shunichi Soma ,  Takashi Saida

IPC分类号： H05K3/36 ,  H05K3/34 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC分类号： H05K3/363 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K1/189 ,  H05K3/3463 ,  H05K3/36

摘要： In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.

公开(公告)号：US09972597B2

公开(公告)日：2018-05-15

申请号：US14800613

申请日：2015-07-15

申请人： HYUNDAI MOTOR COMPANY

发明人： Kyoung-Kook Hong ,  Hyun Woo Noh ,  Youngkyun Jung ,  Dae Hwan Chun ,  Jong Seok Lee ,  Su Bin Kang

IPC分类号： B23K31/00 ,  B23K35/00 ,  H01L23/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K20/02 ,  B23K20/16 ,  B23K20/233 ,  H05K3/34 ,  B23K101/42 ,  B23K103/16

CPC分类号： H01L24/83 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K35/025 ,  B23K35/264 ,  B23K35/3006 ,  B23K2101/42 ,  B23K2103/166 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/13294 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/29294 ,  H01L2224/29313 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/32505 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81825 ,  H01L2224/8184 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2924/00015 ,  H01L2924/10272 ,  H01L2924/201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10166 ,  H05K2203/1131 ,  H01L2224/29388 ,  H01L2924/00014 ,  H01L2224/13388 ,  H01L2924/00012

摘要： A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of silver particles and a plurality of bismuth particles. The method further includes disposing the semiconductor on the substrate and forming a bonding layer by heating the silver paste, wherein the semiconductor and the substrate are bonded to each other by the bonding layer.

公开(公告)号：US20170374743A1

公开(公告)日：2017-12-28

申请号：US15699570

申请日：2017-09-08

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Arata KISHI ,  Hironori MUNAKATA ,  Koji MOTOMURA ,  Hiroki MARUO

IPC分类号： H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US09764430B2

公开(公告)日：2017-09-19

申请号：US15120937

申请日：2015-02-19

申请人： KOKI Company Limited

发明人： Atsushi Irisawa ,  Rie Wada

IPC分类号： H01L23/14 ,  B23K35/36 ,  B23K35/26 ,  B23K35/02 ,  C22C13/02 ,  H05K3/34 ,  H01L23/00 ,  B23K101/40

CPC分类号： B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/36 ,  B23K2101/40 ,  C22C13/02 ,  H01L24/16 ,  H01L2224/13611 ,  H01L2224/1362 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2924/01032 ,  H01L2924/014 ,  H05K3/3463

摘要： Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.