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公开(公告)号：US11701727B2
公开(公告)日：2023-07-18
申请号：US17509442
申请日：2021-10-25
发明人： Xi Peng Nie , Can Bin Liu
CPC分类号： B23K1/002 , B23K1/0008 , B23K3/0475 , B23K3/08 , B23K2101/36
摘要： A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.
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公开(公告)号：US20190217409A1
公开(公告)日：2019-07-18
申请号：US16302929
申请日：2017-05-05
发明人： Steven KIRKHAM
CPC分类号： B23K1/0012 , B23K1/002 , B23K1/008 , B23K3/087 , B23K2101/14 , B23K2103/10 , B23P15/26 , F28D1/05316 , F28D7/0066 , F28F1/12 , F28F9/02 , F28F2275/045
摘要： A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.
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公开(公告)号：US20180356368A1
公开(公告)日：2018-12-13
申请号：US15616105
申请日：2017-06-07
CPC分类号： G01N29/223 , B23K1/002 , G01K11/265 , G01L1/165 , G01L3/00 , G01L19/147 , G01N29/2462 , H01L24/28
摘要： A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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公开(公告)号：US20180304390A1
公开(公告)日：2018-10-25
申请号：US15767185
申请日：2016-10-07
发明人： Tomoyuki HIRAYAMA , Yuichi KIKUCHI , Tatsunori AKIMOTO , Kazuhito SEKI , Akihiro MOGI , Takao OTAKI
CPC分类号： B23K1/0012 , B23K1/00 , B23K1/002 , B23K1/19 , B23K35/0244 , B23K35/28 , B23K35/286 , C22C21/00 , C22C21/02 , C22C21/08 , C22C21/14 , C22F1/00 , C22F1/05 , H01M10/613 , H01M10/625 , H01M10/651 , H01M10/653 , H01M10/6554 , H01M10/6556 , H01M10/6568
摘要： Provided is a manufacturing method for a cooler, including brazing: a cooling plate (10) made of an aluminum alloy containing 0.35 mass % to 0.9 mass % of Mg and 0.2 mass % to 0.9 mass % of Si and having a substantially flat rectangular cross section; first and second refrigerant introduction members (20, 30) each made of an aluminum alloy, which are connected to end portions of the cooling plate (10); and a refrigerant supply pipe (26) and a refrigerant discharge pipe (28) each made of an aluminum alloy, which are connected to a refrigerant supply port (25) and a refrigerant discharge port (27), respectively, the refrigerant supply port (25) and the refrigerant discharge port (27) being arranged in one of the first and second refrigerant introduction members (20, 30), to each other, wherein the brazing includes subjecting a connecting portion of the cooling plate (10), the first and second refrigerant introduction members (20, 30), the refrigerant supply pipe (26), and the refrigerant discharge pipe (28) to high-frequency brazing with an aluminum alloy brazing filler metal containing 27 mass % to 37 mass % of Cu and 5 mass % to 10 mass % of Si, with the balance being Al and inevitable impurities, and a fluoride-based flux containing 11 mass % or more of CsF as a solid content through heating with a high-frequency heating coil.
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公开(公告)号：US20180214963A1
公开(公告)日：2018-08-02
申请号：US15747486
申请日：2016-07-27
发明人： Takefumi HOSONO , Akira YANAGIDA , Takeshi IGUCHI , Haruki SHINGO , Naoki SATOU
CPC分类号： B23K1/19 , B23K1/0012 , B23K1/002 , B23K1/14 , B23K31/02 , B23K35/0222 , B23K2101/06 , B23K2101/14 , B23K2103/10 , B23K2103/12 , F25B39/00 , F28D1/047 , F28D1/0477 , F28F9/26 , F28F21/084 , F28F21/085 , F28F2275/04 , F28F2275/045
摘要： A heat exchanger includes multiple aluminum heat transfer tubes through which a heat medium flows, and multiple aluminum connection pipes brazed to end portions of the heat transfer tubes. A heat equalizing member formed of a heat conductor is disposed to be in contact with at least two of the connection pipes and be capable of transferring heat therebetween. A method for producing the heat exchanger includes brazing the heat transfer tubes to the connection pipes in a state where the heat equalizing member is in contact with the at least two of the connection pipes.
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公开(公告)号：US20180065201A1
公开(公告)日：2018-03-08
申请号：US15561488
申请日：2016-03-25
申请人： AND Co., Ltd.
发明人： Mitsuo EBISAWA
CPC分类号： B23K1/002 , B23K3/02 , B23K3/0315 , B23K3/06 , B23K3/0615 , B23K3/063 , H05K3/34
摘要： In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).
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公开(公告)号：US09821396B2
公开(公告)日：2017-11-21
申请号：US14885325
申请日：2015-10-16
申请人： Kent Winter
发明人： Kent Winter
IPC分类号： B23K1/002 , E02F3/815 , B23K1/00 , B23K1/20 , B23K1/19 , B23K31/02 , E01H5/06 , B23K1/008 , B23K35/02 , C22C38/00 , C22C38/02 , C22C38/04 , C22C38/22 , C22C38/32 , B23K101/00 , B23K103/04 , B23K103/00 , B23K103/18
CPC分类号： B23K1/002 , B23K1/0008 , B23K1/008 , B23K1/19 , B23K1/20 , B23K1/203 , B23K31/02 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K2101/00 , B23K2103/04 , B23K2103/18 , B23K2103/50 , B23K2103/52 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/22 , C22C38/32 , E01H5/061 , E02F3/8152
摘要： The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.
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公开(公告)号：US20170312841A1
公开(公告)日：2017-11-02
申请号：US15654130
申请日：2017-07-19
申请人： GlobalFoundries Inc.
CPC分类号： B23K1/002 , B23K1/0016 , H05K3/3436 , H05K3/3494 , H05K2203/101 , Y10T29/49144 , Y10T29/53178
摘要： Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.
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公开(公告)号：US09776270B2
公开(公告)日：2017-10-03
申请号：US14043047
申请日：2013-10-01
申请人： GLOBALFOUNDRIES INC.
CPC分类号： B23K1/002 , B23K1/0016 , H05K3/3436 , H05K3/3494 , H05K2203/101 , Y10T29/49144 , Y10T29/53178
摘要： Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.
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公开(公告)号：US20170252872A1
公开(公告)日：2017-09-07
申请号：US15508769
申请日：2015-08-18
发明人： Thomas HARTMANN
IPC分类号： B23K35/22 , B23K1/002 , F16L41/08 , C22C19/07 , B32B15/01 , B29C65/78 , C22C19/05 , C22C45/00 , F16L41/02
CPC分类号： B23K35/22 , B23K1/0012 , B23K1/002 , B23K1/20 , B23K3/0475 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/025 , B23K35/0255 , B23K35/30 , B23K35/302 , B23K35/3033 , B23K35/3046 , B23K35/3053 , B23K2101/04 , B23K2103/05 , B23K2103/26 , B29C65/7847 , B32B15/01 , C22C19/05 , C22C19/07 , C22C45/008 , F16L41/02 , F16L41/026 , F16L41/08 , F16L41/084 , F16L58/185
摘要： A method for brazing is provided, in which an amorphous or partially amorphous brazing foil, having a composition with a metalloid content of 10 to 30 at. %, is arranged at a joining point of two or more parts. The brazing foil is in the form of a wound ring-shaped strip which has a short-circuited current path between at least two layers lying one on top of the other. The brazing foil inductively heated, melted and a brazed connection of the parts is produced.
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