公开(公告)号：US20190212604A1

公开(公告)日：2019-07-11

申请号：US16358164

申请日：2019-03-19

申请人： LG Display Co., Ltd.

发明人： Kaoru FURUTA

IPC分类号： G02F1/1345 ,  G02F1/1333

CPC分类号： G02F1/13452 ,  G02F1/13336 ,  H05K1/189 ,  H05K3/3463 ,  H05K2201/10128

摘要： A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

公开(公告)号：US20180088388A1

公开(公告)日：2018-03-29

申请号：US15717760

申请日：2017-09-27

申请人： LG Display Co., Ltd.

发明人： Kaoru FURUTA

IPC分类号： G02F1/1345 ,  G02F1/1333

摘要： A display device, a display system, and a method of installing an electronic component are disclosed. In one embodiment, the electronic component is junctioned to a display panel of the display device using an auto-agglutination solder. The installation method includes positioning the electronic component having an electronic component side line connection part at a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder.

公开(公告)号：US20190391435A1

公开(公告)日：2019-12-26

申请号：US16563465

申请日：2019-09-06

申请人： LG Display Co., Ltd.

发明人： Kaoru FURUTA

IPC分类号： G02F1/1345 ,  G02F1/1333

摘要： A display device, a display system, and a method of installing an electronic component are disclosed. In one embodiment, the electronic component is junctioned to a display panel of the display device using an auto-agglutination solder. The installation method includes positioning the electronic component having an electronic component side line connection part at a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder.

公开(公告)号：US20180088389A1

公开(公告)日：2018-03-29

申请号：US15717769

申请日：2017-09-27

申请人： LG Display Co., Ltd

发明人： Kaoru FURUTA

IPC分类号： G02F1/1345 ,  G02F1/1333

CPC分类号： G02F1/13452 ,  G02F1/13336 ,  H05K1/189 ,  H05K3/3463 ,  H05K2201/10128

摘要： A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.