公开(公告)号：US20240363579A1

公开(公告)日：2024-10-31

申请号：US18588268

申请日：2024-02-27

申请人： Samsung Electronics Co., Ltd.

发明人： Seungyeop OH ,  Youngja KIM

IPC分类号： H01L23/00 ,  B23K1/012 ,  B23K3/047 ,  B23K3/08 ,  B23K101/40 ,  H01L23/31

CPC分类号： H01L24/75 ,  B23K1/012 ,  B23K3/0471 ,  B23K3/087 ,  H01L24/16 ,  H01L24/81 ,  B23K2101/40 ,  H01L23/3121 ,  H01L2224/16227 ,  H01L2224/75272 ,  H01L2224/75651 ,  H01L2224/75652 ,  H01L2224/81815

摘要： A solder reflow apparatus may include a vapor generating chamber configured to accommodate a heat transfer fluid, a heater configured to heat the heat transfer fluid, a vertical transfer portion, and at least one substrate stage. The vertical transfer portion may include a vertical conveyer supported by a driving pulley and a driven pulley so as to be rotatable in an endless track, the vertical conveyer having a conveying route of a descending path and an ascending path in the vapor generating chamber, and at least one substrate stage fixedly fastened to one side of the vertical conveyor by a fastening portion so as to be raised and lowered in the vapor generating chamber by rotation of the vertical conveyor. The at least one substrate stage may be configured to support a substrate on which an electronic component may be mounted via a solder.

公开(公告)号：US10478911B2

公开(公告)日：2019-11-19

申请号：US15296123

申请日：2016-10-18

申请人： Jainagesh Sekhar

发明人： Jainagesh Sekhar

IPC分类号： B23K10/00 ,  B23K1/005 ,  B23K35/28 ,  B23K1/012 ,  B23K103/00

摘要： A method for the joining of material including metal and non-metals employing foil positioned between as well as structures produced thereby is provided. Such a method may employ thermal plasma as a means to produce the heat necessary for such joining methods. The method may also entail the treating of surfaces of objects by the positioning of materials, including foil, on a surface and subsequent application of thermal plasma.

公开(公告)号：US10157877B2

公开(公告)日：2018-12-18

申请号：US14878903

申请日：2015-10-08

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kazumasa Kido ,  Takashi Saitou ,  Kyouhei Fukuda ,  Shinji Tada ,  Fumihiko Momose ,  Yoshitaka Nishimura

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K35/26 ,  C22C13/02 ,  H01L21/52 ,  B23K1/008 ,  B23K1/012 ,  B23K1/20 ,  B23K35/02 ,  B23K1/19 ,  B23K103/00 ,  B23K101/42 ,  H01L23/051

摘要： A solder joint layer has a structure in which plural fine-grained second crystal sections (22) precipitate at crystal grain boundaries between first crystal sections (21) dispersed in a matrix. The first crystal sections (21) are Sn crystal grains containing tin and antimony in a predetermined proportion. The second crystal sections (22) are made up of a first portion containing a predetermined proportion of Ag atoms with respect to Sn atoms, or a second portion containing a predetermined proportion of Cu atoms with respect to Sn atoms, or both. The solder joint layer may have third crystal sections (23) which are crystal grains that contain a predetermined proportion of Sb atoms with respect to Sn atoms. As a result, solder joining is enabled at a low melting point, and a highly reliable solder joint layer having a substantially uniform metal structure can be formed.

公开(公告)号：US10095025B2

公开(公告)日：2018-10-09

申请号：US14473723

申请日：2014-08-29

申请人： FUJIFILM Corporation

发明人： Hiroyuki Iwane

IPC分类号： A61B1/00 ,  G02B27/00 ,  G02B23/24 ,  B23K1/002 ,  B23K1/008 ,  B23K1/012 ,  A61B1/05 ,  A61B1/06

摘要： An optical unit includes: a cylindrical member whose thickness varies in a circumferential direction; a transparent member disposed at one end, in an axial direction, of the cylindrical member; and a joining member which joins the transparent member to the cylindrical member and thereby seals the cylindrical member at the one end in the axial direction, and a portion, joining a side surface of the transparent member to an inner circumferential surface of the cylindrical member, of the joining member is thicker at a position where the cylindrical member is thick than at a position where the cylindrical member is thin.

公开(公告)号：US20180036820A1

公开(公告)日：2018-02-08

申请号：US15654019

申请日：2017-07-19

申请人： FANUC CORPORATION

发明人： Tetsuhisa TAKAZANE

IPC分类号： B23K3/08 ,  B23K1/012 ,  B23K37/04

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/012 ,  B23K37/04 ,  B23K2101/40

摘要： Provided is a soldering system that can raise the work efficiency related to the supply of a soldering target and soldering work, while decreasing the oxygen concentration by maintaining high airtightness in a space surrounding the soldering target. A soldering system includes a soldering device and a robot related to the soldering device, in which the soldering device is equipped with a container having an openable lid and accommodating a soldering target, and the robot performs conveying of the soldering target to the soldering device and opening/closing of the lid. In an embodiment of the soldering device, the container is a double structure in which an inner container is accommodated in an outer container, and a first nitrogen supply pipe and second nitrogen supply pipe, which are inert gas supply parts of separate systems, are respectively connected to the inner container and outer container.

公开(公告)号：US09837559B2

公开(公告)日：2017-12-05

申请号：US14775889

申请日：2013-03-13

申请人： China Sunergy (Nanjing) Co. Ltd.

发明人： Jun Lu ,  Jiyuan Zhang ,  Thowphock Chua ,  Jilei Wang ,  Aihua Wang ,  Jianhua Zhao

IPC分类号： B23K31/02 ,  H01L31/02 ,  B23K1/012 ,  B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K3/047 ,  B23K3/08 ,  H05K3/34 ,  H01L31/18 ,  B23K3/04 ,  F24H3/08 ,  B23K101/40

CPC分类号： H01L31/0201 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K1/19 ,  B23K3/04 ,  B23K3/0473 ,  B23K3/08 ,  B23K2101/40 ,  F24H3/081 ,  H01L31/188 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0405 ,  Y02E10/50

摘要： This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

公开(公告)号：US09681557B2

公开(公告)日：2017-06-13

申请号：US14292397

申请日：2014-05-30

申请人： Elwha LLC

发明人： Tom Driscoll ,  William D. Duncan ,  Roderick A. Hyde ,  Muriel Y. Ishikawa ,  Jordin T. Kare ,  Robert C. Petroski ,  Clarence T. Tegreene ,  David B. Tuckerman ,  Charles Whitmer ,  Lowell L. Wood, Jr. ,  Victoria Y. H. Wood

IPC分类号： B23K3/04 ,  H05K3/34 ,  B23K1/00 ,  F24J3/00 ,  B23K1/012

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K1/012 ,  F24V99/00 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/087 ,  H05K2203/304

摘要： A heating apparatus includes a gas supply for providing a base gas, a generator configured to excite the base gas to produce a metastable gas mixture that includes a metastable gas, and a housing. The housing includes a wall shaped to contain the metastable gas mixture and selectively enclose a reactive element of a target component. Interaction between the metastable gas and at least one of a coupling material and the reactive element transfers energy to selectively heat the at least one of the coupling material and the target component.

公开(公告)号：US09656353B2

公开(公告)日：2017-05-23

申请号：US14353495

申请日：2012-10-26

申请人： Hitachi Chemical Company, Ltd.

发明人： Kazuhiro Miyauchi ,  Naoya Suzuki ,  Nozomu Takano ,  Yukihiko Yamashita

IPC分类号： H01L23/00 ,  H01L23/498 ,  B23K35/362 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  B23K35/02 ,  H01L21/48 ,  H01L23/488 ,  H01L21/56 ,  H05K3/34 ,  B23K1/00 ,  B23K1/06 ,  B23K35/30 ,  B23K35/36 ,  B23K1/012 ,  B23K1/20 ,  B23K101/40 ,  B23K101/42

CPC分类号： B23K35/362 ,  B23K1/0016 ,  B23K1/012 ,  B23K1/06 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/11436 ,  H01L2224/11522 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/81075 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2224/8391 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

公开(公告)号：US09004343B2

公开(公告)日：2015-04-14

申请号：US13083413

申请日：2011-04-08

申请人： Hiroyuki Inoue ,  Tadayoshi Ohtashiro

发明人： Hiroyuki Inoue ,  Tadayoshi Ohtashiro

IPC分类号： B23K31/00 ,  B23K31/02 ,  B23K1/008 ,  G01N29/30 ,  B23K3/08 ,  B23K1/00 ,  G01N29/12 ,  G01R33/07 ,  G01N29/11 ,  B23K1/002 ,  B23K3/047 ,  B23K1/012 ,  H05K3/34

CPC分类号： B23K1/008 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/012 ,  B23K3/047 ,  B23K3/0475 ,  B23K3/08 ,  B23K2101/42 ,  G01N29/11 ,  G01N29/12 ,  G01N29/30 ,  G01R33/07 ,  H05K3/3494 ,  Y10T29/53022

摘要： In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.

摘要翻译： 在回流焊接装置中，由加热器加热的空气被风扇吹送到印刷电路板上。 控制加热器温度的温度控制器将其操作量提供给计算焊接装置的消耗电能的计算单元。 控制风扇转速的变频器为计算单元提供电流值。 控制单元将消耗的电能的系数提供给计算单元。 计算单元基于由此获得的操作量，电流值和消耗的电能的系数来计算回流焊装置的消耗电能的总量。 显示单元在操作画面上显示由计算单元计算出的回流焊接装置的消耗电能的总量。

公开(公告)号：US20110315746A1

公开(公告)日：2011-12-29

申请号：US13167272

申请日：2011-06-23

申请人： Jonathan M. Dautenhahn

发明人： Jonathan M. Dautenhahn

IPC分类号： B23K1/012 ,  B23K3/04 ,  B23K3/08

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  H05K3/3494

摘要： A reflow oven chamber assembly that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing disposed within the reflow oven chamber, one or more heating elements disposed in the chamber housing, and one or more compression box assemblies disposed in the chamber housing. The compression box assembly includes a compression box housing having an intake port located adjacent the heating element, an intake duct disposed in the compression box, and a diffuser plate disposed above the intake duct. The intake duct has an inlet opening in fluid communication with the intake port of the compression box housing and an outlet opening. The compression box assembly is configured to draw heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate. A method of distributing heated air within a reflow soldering oven is further disclosed.

摘要翻译： 构造成安装在回流炉的回流炉室内的回流炉室组件包括：设置在回流炉室内的室容腔，设置在室壳体中的一个或多个加热元件，以及一个或多个压缩箱组件， 在房间里。 压缩箱组件包括压缩箱壳体，其具有位于加热元件附近的进气口，设置在压缩箱中的进气管道和设置在进气管道上方的扩散板。 进气管具有与压缩箱壳体的进气口和出口开口流体连通的入口。 压缩箱组件被构造成将加热的空气从回流炉室通过进气口并且进入进气管道的入口并将排出空气从进气管道的出口开口排出到扩散板。 进一步公开了在回流焊炉中分配加热空气的方法。