公开(公告)号：US11986899B2

公开(公告)日：2024-05-21

申请号：US17983447

申请日：2022-11-09

申请人： ERSA GmbH

发明人： Lothar Endreß ,  Benedict Fleischmann ,  Lukas Thanhäuser

IPC分类号： B23K1/00 ,  B23K1/012 ,  H05K3/34

CPC分类号： B23K1/012 ,  H05K3/3494

摘要： A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.

公开(公告)号：US20230347437A1

公开(公告)日：2023-11-02

申请号：US18030165

申请日：2021-08-25

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Tsutomu HIYAMA

IPC分类号： B23K3/04 ,  B23K1/012 ,  B23K3/08

CPC分类号： B23K3/04 ,  B23K1/012 ,  B23K3/08

摘要： Provided is a soldering device in which gas is drawn through suction ports in a first plate more uniformly than in a conventional device. A soldering device according to the present disclosure is a soldering device for performing soldering and includes a blower unit for supplying gas to an object. The blower unit includes: a first plate in which a plurality of suction ports for drawing of the gas outside the blower unit are formed; a second plate that has a plate surface facing the plurality of suction ports; a plurality of nozzles; and a fan for supplying the gas drawn through the plurality of suction ports to the plurality of nozzles. A flow path through which the gas flows and which extends from the plurality of suction ports to go through a heater and the fan and to reach the plurality of nozzles is formed in the blower unit. A part of the flow path surrounds at least a part of the second plate in directions in which the plate surface extends.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

申请人： Alpha Assembly Solutions Inc.

发明人： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC分类号： B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC分类号： B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

摘要： A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US20230234152A1

公开(公告)日：2023-07-27

申请号：US18007168

申请日：2021-07-27

申请人： Siegfried Hofmann GmbH

发明人： Daniel Feseker ,  Michael Deuerling ,  Michael Förste ,  Kai Furhmann ,  Johannes Günther ,  Benedikt Bechmann ,  Heinz Nolden

IPC分类号： B23K1/008 ,  B23K3/08 ,  B23K37/047 ,  H01L21/67 ,  H01L21/677 ,  B23K1/012 ,  B23K3/04

CPC分类号： B23K1/008 ,  B23K3/08 ,  B23K37/047 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6776 ,  B23K1/012 ,  B23K3/04

摘要： Device (1) for displacing at least one assembly (2, 2′) between a provisioning zone (3) and a working zone (4) of at least one process chamber (5) of a process chamber apparatus (6) for soldering, in particular for reflow soldering, comprising at least one displacement device (7), wherein the at least one assembly (2, 2′) carries out, at least in sections, a displacement movement (9), or such a displacement movement (9) can be carried out, such that the at least one assembly (2, 2′) is displaced by means of a force (8), in particular pushing force, which is transmitted or generated by the displacement device (7), in particular directly, and acts on the assembly (2, 2′).

公开(公告)号：US20190123463A1

公开(公告)日：2019-04-25

申请号：US15789449

申请日：2017-10-20

申请人： ARRIS Enterprises LLC

发明人： Jui-Feng Lee ,  Liang Kun Chang

IPC分类号： H01R12/70 ,  H01R4/02 ,  H01R12/71

CPC分类号： H01R12/7082 ,  B23K1/0016 ,  B23K1/012 ,  B23K2101/38 ,  H01R4/02 ,  H01R12/716

摘要： A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For example, the standoff region has a depth or height of approximately 0.3 mm, a length of approximately 15.1 mm, and a width of approximately 4.95 mm. The standoff region can also have a depth or height in a range of 0.3 mm to 0.5 mm. The connector structure is a single or dual port connector structure with the standoff region configured as a void or gap proximate to the connector pins, which creates a reflow air convection gate way across a surface of the connector structure during PIP soldering.

公开(公告)号：US20180015558A1

公开(公告)日：2018-01-18

申请号：US15551620

申请日：2015-02-25

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Katsunori TANAKA ,  Tsuyoshi HAMANE

IPC分类号： B23K3/00 ,  B23K1/012 ,  H05K3/34

CPC分类号： B23K3/00 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0607 ,  B23K3/0669 ,  B23K2101/42 ,  H05K3/34 ,  H05K3/3447 ,  H05K2203/0475 ,  H05K2203/049

摘要： A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

公开(公告)号：US20170232562A1

公开(公告)日：2017-08-17

申请号：US15503093

申请日：2015-07-14

申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

发明人： Kazuhiro MAENO

IPC分类号： B23K35/26 ,  H01L23/00 ,  B23K35/30 ,  B23K1/20 ,  B23K35/02

CPC分类号： B23K35/262 ,  B23K1/012 ,  B23K1/20 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/30 ,  B23K35/302 ,  B23K2101/40 ,  H01L23/4827 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05173 ,  H01L2224/05655 ,  H01L2224/2712 ,  H01L2224/29083 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83055 ,  H01L2224/83065 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2924/01327 ,  H01L2924/351 ,  H05K3/341 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05155 ,  H01L2924/01028

摘要： A bonding structure bonds a Cu wiring line and a device electrode with each other. The bonding structure is arranged between the Cu wiring line and the device electrode, and comprises a first intermetallic compound (IMC) layer (a layer of an intermetallic compound of Cu and Sn) formed on the interface with the Cu wiring line, a second intermetallic compound (IMC) layer (a layer of an intermetallic compound of Cu and Sn) formed on the interface with the device electrode, and an intermediate layer that is present between the intermetallic compound layers. In the intermediate layer, a network-like IMC (a network-like intermetallic compound of Cu and Sn) is present in Sn.

公开(公告)号：US20170203394A1

公开(公告)日：2017-07-20

申请号：US15416451

申请日：2017-01-26

申请人： Vacuumschmelze GmbH & Co. KG

发明人： Thomas HARTMANN ,  Dieter NUETZEL

IPC分类号： B23K35/30 ,  B23K1/012 ,  B23K35/02 ,  B23K1/008 ,  F28F21/08 ,  B23K1/00

CPC分类号： B23K35/304 ,  B23K1/0012 ,  B23K1/008 ,  B23K1/012 ,  B23K35/0233 ,  B23K35/025 ,  B23K35/30 ,  B23K2101/14 ,  B23K2103/05 ,  F28F21/089 ,  F28F2275/04 ,  F28F2275/045 ,  Y10T428/12937 ,  Y10T428/26 ,  Y10T428/31678

摘要： The invention provides a process for brazing two or three parts. A braze with a composition consisting of NiresCraBbPcSid with 20 atomic percent

公开(公告)号：US20170173745A1

公开(公告)日：2017-06-22

申请号：US14978690

申请日：2015-12-22

申请人： International Business Machines Corporation

发明人： Victor Alvarez ,  Pierre Y. Beaulieu ,  Kang-Wook Lee ,  Jae-Woong Nah ,  Lavanya Turlapati

IPC分类号： B23K35/36 ,  H01L23/00 ,  H01L21/56 ,  B23K1/00 ,  B23K35/362

CPC分类号： B23K35/3612 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K35/362 ,  H01L21/563 ,  H01L23/293 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/06 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107

摘要： A flux formulation includes an activator and a protic solvent. The activator may be glutaric acid, levulinic acid, 2-ketobutyric acid, 2-oxovaleric acid, or mixtures thereof. Suitable protic solvents include alkanediol, alkoxy propanol and alkoxy ethanol. The flux formulation may be a no-clean flux formulation that may be used in the soldering of electronic circuit board assemblies, for example, in conjunction with a support fixture having a planar back surface that minimizes vibrations during processing that might otherwise cause misalignment between a chip and a substrate prior to solder reflow.

公开(公告)号：US20170135161A1

公开(公告)日：2017-05-11

申请号：US15080724

申请日：2016-03-25

申请人： PACE, INC.

发明人： Thomas Wayne Miller ,  Ramgopal Nair

IPC分类号： H05B6/10 ,  B23K1/012

CPC分类号： H05B6/108 ,  B23K1/0016 ,  B23K1/012 ,  B23K1/018 ,  B23K3/0475 ,  B23K2101/36

摘要： An induction heater having inner and outer chamber cylinders connected in an air tight manner to a base and cover with an inner chamber being formed within the inner chamber cylinder and an outer chamber being formed between the inner and outer chamber cylinders, a heat exchange core disposed in the inner chamber, and an induction heater coil disposed in the outer chamber extending around the inner chamber cylinder. A flow path is provided from a cool air inlet in the base, along the outer chamber, into the inner chamber and through the inner chamber and core to a heated air outlet in the base in a counterflow direction relative to the flow along the outer chamber. The heater is especially well suited for use in convective soldering and rework apparatus.