公开(公告)号：US20240351148A1

公开(公告)日：2024-10-24

申请号：US18630257

申请日：2024-04-09

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Hiroaki KAWAMATA ,  Yuki FUJINO ,  Kazuya KITAZAWA ,  Keisuke SHINOZAKI

IPC分类号： B23K35/36 ,  B23K1/20 ,  B23K35/02 ,  B23K35/362

CPC分类号： B23K35/3612 ,  B23K1/203 ,  B23K35/025 ,  B23K35/362

摘要： A flux contains: a triol solvent (S1); a monoamide-based thixotropic agent; and at least one solvent (S2) selected from the group consisting of a monohydric solvent and a dihydric solvent, wherein the content of the monoamide-based thixotropic agent is 0.5% by mass or more and less than 15% by mass with respect to the total mass of the flux, and the content of the solvent (S2) is 50% by mass or more with respect to the total mass of the flux.

公开(公告)号：US11897051B2

公开(公告)日：2024-02-13

申请号：US17185372

申请日：2021-02-25

申请人： RTX Corporation

发明人： Grant O. Cook, III

IPC分类号： B23K20/00 ,  B23K20/16 ,  B23K20/02 ,  B23K35/36 ,  B32B15/01 ,  B23K20/233 ,  B23K103/16 ,  B23K101/00 ,  B23K103/00 ,  B23K101/34 ,  B23K103/18

CPC分类号： B23K20/16 ,  B23K20/02 ,  B23K20/233 ,  B23K35/3612 ,  B23K35/3613 ,  B32B15/01 ,  B23K2101/001 ,  B23K2101/34 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/42

摘要： A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.

公开(公告)号：US20180355487A1

公开(公告)日：2018-12-13

申请号：US15952406

申请日：2018-04-13

申请人： Tatsuta Electric Wire & Cable Co., Ltd.

发明人： Masaki HIRANO

IPC分类号： C23C24/04

CPC分类号： C23C24/08 ,  B23K35/0244 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/3612 ,  C23C24/082 ,  C23C24/087

摘要： Provided are: a film material for use in a cold spray device; and a cold spray method, each of the film material and the cold spray method enabling an improvement in rate of adhesion of a spray material to a base material. A film material for use in a cold spray device (100) and to be sprayed onto a base material (20) includes a spray material and flux powder.

公开(公告)号：US20180318967A1

公开(公告)日：2018-11-08

申请号：US15764628

申请日：2016-10-28

申请人： ZEPHYROS, INC.

发明人： Jeffrey R. APFEL

IPC分类号： B23K35/02 ,  B23K11/11 ,  B23K11/16 ,  B23K35/30 ,  B23K35/36 ,  C09J11/04

CPC分类号： B23K35/025 ,  B23K11/115 ,  B23K11/16 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/3053 ,  B23K35/3612 ,  B23K35/3613 ,  B23K2101/001 ,  C08K2003/0856 ,  C09J11/04 ,  C09J163/00

摘要： A weldable adhesive or sealant formulation comprising a plurality of discrete solid metallic portions within a material having a viscosity of greater than 10,000 Pa s in its green state and at room temperature.

公开(公告)号：US09931716B2

公开(公告)日：2018-04-03

申请号：US14442628

申请日：2014-08-28

申请人： HARIMA CHEMICALS, INCORPORATED

发明人： Kazuki Ikeda ,  Kosuke Inoue ,  Kazuya Ichikawa ,  Tadashi Takemoto

IPC分类号： C22C13/02 ,  B23K35/26 ,  C22C13/00 ,  B23K35/02 ,  B23K35/22 ,  B23K35/36 ,  H05K3/34 ,  B23K35/362 ,  B23K101/36 ,  B23K101/42

CPC分类号： B23K35/262 ,  B23K35/0205 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B23K35/3606 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3616 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/36 ,  B23K2101/42 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3484

摘要： A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.

公开(公告)号：US20180001388A9

公开(公告)日：2018-01-04

申请号：US15037943

申请日：2015-06-17

申请人： Shoei Chemical Inc.

发明人： Yuji Akimoto ,  Hideki Tanaka ,  Mineto Iwasaki ,  Akiko Matsuo

IPC分类号： B22F9/14 ,  C22C19/00 ,  B22F1/00 ,  H01G4/008 ,  C22C5/06 ,  C22C9/00 ,  B23K1/00 ,  H01F27/28 ,  B22F1/02 ,  B22F9/12 ,  B23K35/02 ,  C22C19/03 ,  B22F9/04 ,  B23K35/30 ,  B23K35/36 ,  H01F41/04 ,  H01G4/30 ,  H01G4/012

CPC分类号： B22F9/14 ,  B22F1/0003 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/0085 ,  B22F1/02 ,  B22F9/04 ,  B22F9/12 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/40 ,  B22F2302/40 ,  B22F2302/45 ,  B22F2303/40 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3033 ,  B23K35/3612 ,  B23K35/3613 ,  C22C5/06 ,  C22C9/00 ,  C22C19/002 ,  C22C19/03 ,  H01F27/2804 ,  H01F41/041 ,  H01F2027/2809 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/30 ,  B22F2202/13 ,  B22F2301/45

摘要： This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei.

公开(公告)号：US20170355042A1

公开(公告)日：2017-12-14

申请号：US15539301

申请日：2015-12-21

申请人： Senju Metal Industry Co., Ltd.

发明人： Mamoru Kakuishi ,  Kazuhiro Minegishi

IPC分类号： B23K35/02 ,  B23K35/36 ,  B23K35/362

CPC分类号： B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362

摘要： The invention has an object to provide a flux for rapid heating method used in the rapid heating method such as a laser reflow, the flux being able to suppress any scattering of the solder alloy, and a solder paste for the rapid heating method. The flux contains rosin, a glycol-ether-based solvent, an organic acid, and a thixotropic agent, wherein the solvent is a glycol-based solvent having a low boiling point that is not more than 200 degrees C., content of the solvent having the low boiling point is not less than 20 weight % to not more than 40 weight %. The solder paste is obtained by mixing this flux with solder alloy powder. When the solvent having a high boiling point that is more than 200 degrees C. is further contained, the solvent having the low boiling point of not less than 60 weight % in relation to the whole of the solvent is contained.

公开(公告)号：US20170304962A1

公开(公告)日：2017-10-26

申请号：US15646026

申请日：2017-07-10

申请人： Lincoln Global, Inc

发明人： Robert A. Howard

IPC分类号： B23K35/36 ,  B23K35/00 ,  B23K35/02 ,  B23K35/362

CPC分类号： B23K35/3605 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3601 ,  B23K35/3606 ,  B23K35/3607 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362

摘要： The invention described herein pertains generally to boric acid free flux composition in which boric acid and/or borax is substituted with a molar equivalent amount of potassium tetraborate tetrahydrate. In some embodiments, a phthalocyanine pigment is used to effect a color change at activation temperature.

公开(公告)号：US20170266767A1

公开(公告)日：2017-09-21

申请号：US15500029

申请日：2016-03-10

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： SHINNOSUKE AKIYAMA ,  KIYOHIRO HINE ,  AKIO FURUSAWA

IPC分类号： B23K35/36 ,  C22C13/00 ,  B23K35/26 ,  B23K35/362

CPC分类号： B23K35/3613 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/362 ,  C22C13/00

摘要： Provided is a flux for soldering that can suppress a crack in a flux residue even if the flux for soldering is exposed to a cooling and heating cycle at the highest temperature of 150° C. such as the inside of an engine room of automobiles for a long period of time, and a soldering paste composition including the flux for soldering. The flux for soldering includes a synthetic resin, an activator, an organic solvent, and a thixotropic agent, in which synthetic resin contains a triblock copolymer of methacrylic acid ester with acrylic acid ester configured of a linear alkyl moiety having 3 to 6 carbon atoms. In addition, a soldering paste composition including the flux for soldering is used.

公开(公告)号：US09751159B2

公开(公告)日：2017-09-05

申请号：US15390861

申请日：2016-12-27

申请人： Alpha Assembly Solutions Inc.

发明人： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC分类号： B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  C08L93/04 ,  C08K11/00 ,  H05K3/34 ,  B23K101/42

CPC分类号： B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

摘要： Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.