公开(公告)号：US20240278360A1

公开(公告)日：2024-08-22

申请号：US18568943

申请日：2022-06-21

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Yutaka HASHIMOTO ,  Mutsuki KANEKO

IPC分类号： B23K35/36 ,  B23K35/26 ,  C08L93/04

CPC分类号： B23K35/3613 ,  B23K35/262 ,  C08L93/04

摘要： A flux and a solder paste capable of minimizing the time-dependent changes in viscosity when stored at 30° C. and minimizing the coloration of flux residues while having favorable reflow properties and favorable cleanability of flux residues are provided. As such a flux, a flux containing a rosin, a thixotropic agent, an activator, and a solvent is adopted. The rosin includes one or more selected from the group consisting of an acid-modified rosin, a hydrogenated rosin, and an acid-modified hydrogenated rosin, and the thixotropic agent includes a compound represented by General Formula (1). In General Formula (1), R11 and R12 each independently represent a hydrocarbon group which has 1 to 3 carbon atoms and may have a substituent, or a single bond. R21 and R22 each independently represent a hydrocarbon group which has 7 to 29 carbon atoms and may have a substituent. R13 represents a substituent. n represents an integer of 0 to 4.

公开(公告)号：US20240227089A9

公开(公告)日：2024-07-11

申请号：US18271531

申请日：2022-01-20

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Hidefumi YASUI ,  Kiyoto MATSUSHITA

IPC分类号： B23K35/36 ,  B23K35/02 ,  C08G59/24 ,  C08G59/42 ,  C08G59/68 ,  H01L23/00 ,  H05K3/34 ,  H05K3/36

CPC分类号： B23K35/3613 ,  B23K35/025 ,  C08G59/245 ,  C08G59/4238 ,  C08G59/688 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H05K3/3436 ,  H05K3/3489 ,  H05K3/368 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/0568 ,  H01L2224/05684 ,  H01L2224/1369 ,  H01L2224/27422 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/0665 ,  H05K2203/0485

摘要： Provided is a non-electroconductive flux capable of enhancing productivity and impact resistance of a connected structure to be obtained and suppressing occurrence of solder flash. The non-electroconductive flux according to the present invention contains an epoxy compound, an acid anhydride curing agent, and an organophosphorus compound.

公开(公告)号：US20240058889A1

公开(公告)日：2024-02-22

申请号：US17891345

申请日：2022-08-19

申请人： General Electric Company

发明人： Justin John Gambone, JR. ,  Thomas C. Adcock

IPC分类号： B23K20/00 ,  B23K35/00 ,  B23K35/36 ,  C04B37/00

CPC分类号： B23K20/00 ,  B23K35/001 ,  B23K35/3613 ,  C04B37/008

摘要： A joined part comprises a first portion and a second portion. The first portion comprises a guide slot at least partially defined by a porous structure. A joint material is disposed within the porous structure. The second portion is disposed within the guide slot and contacts the porous structure and the joint material disposed therein to form an interfacial joint between the first portion and the second portion. A method of manufacturing the joined part includes disposing a joint material into a porous structure of a guide slot of a first portion, inserting a second portion into the guide slot, and contacting the porous structure and the joint material disposed therein to form an interfacial joint between the first portion and the second portion.

公开(公告)号：US20240024991A1

公开(公告)日：2024-01-25

申请号：US18039090

申请日：2021-12-22

申请人： KOKI COMPANY LIMITED

发明人： Akane TANAKA ,  Takeshi YAHAGI

IPC分类号： B23K35/36 ,  B23K35/02

CPC分类号： B23K35/3613 ,  B23K35/025

摘要： A method of producing a solder material is provided. The method includes mixing a flux containing a solvent, a rosin-based resin, and an activator, with aggregated cellulose. The aggregated cellulose includes massive cellulose in which fibrous cellulose having a length of from 1 μm or more to less than 1 mm, and fibrous cellulose having a length of from 1 nm or more to less than 1 μm. The resulting mixture is mixed with a solder alloy to produce a solder material.

公开(公告)号：US20240001492A1

公开(公告)日：2024-01-04

申请号：US18039077

申请日：2021-12-22

申请人： KOKI COMPANY LIMITED

发明人： Takeshi YAHAGI ,  Ryo KAMIO

IPC分类号： B23K35/36 ,  B23K35/362

CPC分类号： B23K35/3613 ,  B23K35/362

摘要： An aggregated cellulose is provided that includes massive cellulose and fibrous cellulose mixed together. The massive cellulose is fibrous and has a length of from 1 μm or more to less than 1 mm. The fibrous cellulose has a length of from 1 nm or more to less than 1 μm. The aggregated cellulose can contain from 400 ppm or more to 10,000 ppm or less of the massive cellulose. The aggregated cellulose can contain a solvent, a rosin-based resin, and an activator.

公开(公告)号：US11858072B2

公开(公告)日：2024-01-02

申请号：US17623668

申请日：2021-02-01

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Yoko Kurasawa ,  Hiroaki Iseki ,  Kenta Nakajima

IPC分类号： B23K35/36 ,  B23K35/362 ,  B23K35/365 ,  B23K35/368

CPC分类号： B23K35/3613 ,  B23K35/362 ,  B23K35/365 ,  B23K35/368

摘要： A flux according to the present invention contains a rosin methyl ester in which the flux is a solid or solid-like flux at 25° C., and is used for an inside of a flux-cored solder or an exterior of a flux-coated solder.

公开(公告)号：US11833620B2

公开(公告)日：2023-12-05

申请号：US16957537

申请日：2019-01-16

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Yutaka Hashimoto ,  Kazuyori Takagi ,  Tomoko Nagai ,  Nanako Miyagi ,  Kazuya Kitazawa ,  Akiko Takaki ,  Kazuhiro Minegishi ,  Teppei Otsuki ,  Rina Horikoshi ,  Ryuichi Tsuda ,  Hiroyoshi Kawasaki ,  Masato Shiratori

IPC分类号： B23K35/36 ,  B23K35/02 ,  B23K35/26 ,  C08K5/3492 ,  C08L93/04 ,  C22C13/00

CPC分类号： B23K35/3613 ,  B23K35/025 ,  B23K35/262 ,  C08K5/34924 ,  C08L93/04 ,  C22C13/00

摘要： Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

申请人： Alpha Assembly Solutions Inc.

发明人： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC分类号： H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

摘要： A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11772208B2

公开(公告)日：2023-10-03

申请号：US16957827

申请日：2018-12-28

申请人： Senju Metal Industry Co., Ltd.

发明人： Hiroyoshi Kawasaki ,  Masato Shiratori ,  Hiroyuki Yamasaki

IPC分类号： B23K35/362 ,  C08L93/04 ,  C08K5/092 ,  B23K35/26 ,  C22C13/00 ,  B23K35/36

CPC分类号： B23K35/362 ,  B23K35/262 ,  B23K35/3613 ,  C08K5/092 ,  C08L93/04 ,  C22C13/00

摘要： Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent.

公开(公告)号：US20180169961A1

公开(公告)日：2018-06-21

申请号：US15380298

申请日：2016-12-15

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： Matthew P. Simonin ,  Charles E. Jensen ,  Joseph M. Polewarczyk

IPC分类号： B29C65/48 ,  B29C65/02

CPC分类号： B29C66/742 ,  B23K11/115 ,  B23K11/16 ,  B23K11/166 ,  B23K11/20 ,  B23K35/3613 ,  B23K2101/006 ,  B23K2101/18 ,  B23K2101/34 ,  B23K2103/16 ,  B23K2103/20 ,  B29C65/4835 ,  B29C66/112 ,  B29C66/131 ,  B29C66/21 ,  B29C66/54 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/73941 ,  B29L2031/30 ,  B29L2031/3002 ,  C09J5/06 ,  C09J5/10 ,  B29K2307/04 ,  B29K2309/08

摘要： A system and method for bonding structures includes a method of bonding a first panel to a second panel. An adhesive material is applied to at least one of the first panel and the second panel and is disposed between the first panel and the second panel. A welding device having at least a first electrode and a second electrode is configured to receive and position the first panel and second panel between the first and second electrodes. The welding device generates an electric current with the first and second electrodes to apply to the first panel and the second panel. The electric current generates thermal energy having a first temperature that cures the adhesive material positioned between the first and second electrodes to bond the first panel with the second panel.