公开(公告)号：US12016129B2

公开(公告)日：2024-06-18

申请号：US17837942

申请日：2022-06-10

Applicant: ZF CV Systems Europe BV

Inventor： Marcin Calka

IPC: H05K3/12 ,  H05K3/10

CPC classification number: H05K3/1216 ,  H05K3/108 ,  H05K2203/167

Abstract: The disclosure is directed to a printed circuit board for mechanical support and electrical connection of electrical or electronic components. The printed circuit board has conductive tracks and contact pads carved away or etched from at least one sheet layer of copper laminated onto a non-conductive substrate and has a label attached to the printed circuit board at an intended position before the assembly process. Soldering defects often occur due to the deposition of excessive amounts of solder paste on the contact pads of components adjacent to the label. To prevent soldering defects caused by incorrect solder paste application quantities by simple and inexpensive means, the printed circuit board provides the intended position of the label as a depression with respect to the surroundings thereof.

公开(公告)号：US11958284B2

公开(公告)日：2024-04-16

申请号：US16958653

申请日：2017-12-27

Applicant: APPLIED MATERIALS ITALIA S.R.L.

Inventor： Davide Colla ,  Luigi De Santi

IPC: B41M1/12 ,  B41F15/08 ,  B41F15/42 ,  B41F15/46 ,  H01L31/18 ,  H05K3/12

CPC classification number: B41F15/0818 ,  B41F15/423 ,  B41F15/46 ,  B41M1/12 ,  H01L31/18 ,  H05K3/1216 ,  H05K3/1233

Abstract: A method for screen printing of a material on a substrate is provided. The method includes moving a process head assembly having at least one deposition device from a first position to a second position to perform a stroke, wherein the stroke includes at least a first phase for material processing of a material on a screen device using the at least one deposition device and a second phase for a material transfer from the screen device to the substrate. The at least one deposition device moves in a first direction in the first phase. At least one device moves in a second direction perpendicular to the first direction in the first phase. The at least one deposition device and the at least one device simultaneously move during at least a part of the first phase. The at least one device is selected from the group including the at least one deposition device, a material processing device, the screen device, and a substrate support.

公开(公告)号：US20240015892A1

公开(公告)日：2024-01-11

申请号：US17877474

申请日：2022-07-29

Applicant: Primax Electronics Ltd.

Inventor： Yi-Te Chou ,  Lei-Lung Tsai ,  Chin-Sung Pan

IPC: H05K3/12 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K3/1216 ,  H05K3/207 ,  H05K3/4664 ,  H05K3/4679 ,  H05K3/4673

Abstract: A manufacturing method of a membrane circuit board includes the following steps. Firstly, a screen plate, a first substrate body and a second substrate body are provided. Then, a conductive paste and a first circuit pattern are formed on the screen plate. Then, the conductive paste and the first circuit pattern are simultaneously printed on the first substrate body by a screen printing process. The first substrate body, the first circuit pattern and the conductive paste are collaboratively formed as a first membrane substrate. Then, a second circuit pattern is formed on the screen plate. Then, the second circuit pattern is printed on the second substrate body by the screen printing process. The second substrate body and the second circuit pattern are collaboratively formed as a second membrane substrate. Then, the second membrane substrate is aligned with the first membrane substrate.

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC classification number: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11711895B2

公开(公告)日：2023-07-25

申请号：US17538410

申请日：2021-11-30

Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

Inventor： Akitoshi Sakaue ,  Kenji Matsumoto

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K3/12 ,  H05K3/18 ,  H01L21/8234 ,  H01L23/66 ,  G06F3/041 ,  G06F3/044 ,  H05K3/10 ,  H05K1/09

CPC classification number: H05K3/107 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1283

Abstract: Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

公开(公告)号：US20230180396A1

公开(公告)日：2023-06-08

申请号：US18102060

申请日：2023-01-26

Applicant: Board of Regents, The University of Texas System

Inventor： Romil Modi ,  Jonathan Reeder ,  Gregory T. Ellson ,  Walter E. Voit ,  Alexandra Joshi Imre

IPC: H05K3/40 ,  H05K3/12 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06

CPC classification number: H05K3/4007 ,  H05K3/1216 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0041 ,  H05K3/048 ,  H05K3/064 ,  H05K3/067 ,  H05K3/1225 ,  H05K3/3463

Abstract: An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

公开(公告)号：US11647594B2

公开(公告)日：2023-05-09

申请号：US17072801

申请日：2020-10-16

Applicant: NCC NANO, LLC

Inventor： Rob Jacob Hendriks

IPC: H05K3/34 ,  B23K1/005 ,  H05K3/00 ,  H05K3/10 ,  B23K1/00 ,  H05K3/12 ,  B23K101/42 ,  B23K103/00 ,  H05K1/02 ,  H01L23/00 ,  H05K3/02

CPC classification number: H05K3/3494 ,  B23K1/005 ,  B23K1/0016 ,  H05K3/0082 ,  H05K3/10 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3489 ,  B23K2101/42 ,  B23K2103/40 ,  B23K2103/42 ,  H01L24/82 ,  H05K1/0274 ,  H05K3/02 ,  H05K3/125 ,  H05K2201/0112 ,  H05K2201/2054 ,  H05K2203/107

Abstract: A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

公开(公告)号：US20190191565A1

公开(公告)日：2019-06-20

申请号：US16283858

申请日：2019-02-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Oka ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami ,  Yukio Yamamoto ,  Kensuke Otake

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H05K1/11 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/18 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/10795 ,  H05K2201/1081

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

公开(公告)号：US20180317314A1

公开(公告)日：2018-11-01

申请号：US15770114

申请日：2016-10-24

Applicant: Universität des Saarlandes

Inventor： Simon Olberding ,  Jürgen Steimle

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  G06T19/00 ,  G06F3/044

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F3/0488 ,  G06F2203/0339 ,  G06F2203/04102 ,  G06T19/00 ,  G06T2219/021 ,  G09F9/301 ,  H03K17/962 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0005 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.

公开(公告)号：US20180228033A1

公开(公告)日：2018-08-09

申请号：US15878063

申请日：2018-01-23

Applicant: Yazaki Corporation

Inventor： Mizuki Shirai ,  Hiroki Kondo

IPC: H05K3/40 ,  H01R12/52 ,  H01R4/04 ,  H05K1/11 ,  H05K3/12 ,  H05K1/09

CPC classification number: H05K3/4038 ,  H01R4/04 ,  H01R12/52 ,  H05K1/092 ,  H05K1/115 ,  H05K3/1216 ,  H05K3/361 ,  H05K3/4053 ,  H05K2201/041 ,  H05K2201/09236 ,  H05K2201/09563 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.