公开(公告)号：US12030125B2

公开(公告)日：2024-07-09

申请号：US17434492

申请日：2020-03-02

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Kei Anai ,  Shinichi Yamauchi ,  Jung-Lae Jo ,  Takahiko Sakaue

IPC: B22F7/06 ,  B22F1/00 ,  B22F1/107 ,  H01L23/00

CPC classification number: B22F7/064 ,  B22F1/00 ,  B22F1/107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29147 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8384

Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.

公开(公告)号：US20240212930A1

公开(公告)日：2024-06-27

申请号：US18598301

申请日：2024-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi OHARA ,  Hideyasu ONISHI

IPC: H01G4/008 ,  B22F1/103 ,  B22F1/107 ,  B22F1/12 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/008 ,  B22F1/103 ,  B22F1/107 ,  B22F1/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  B22F2301/15 ,  B22F2302/25

Abstract: A conductive paste defining inner electrodes of a multilayer ceramic capacitor manufactured through a firing step, includes a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder. At least a portion of the ceramic powder is a powder of at least one oxide of ABO3 type with a specified ionic radius in which a ratio of a six-coordinate ionic radius of an A-site element in ABO3 to a six-coordinate ionic radius of a metal element in the conductive metal powder is about 0.97 or greater and about 1.04 or less. Preferably, when the conductive metal powder includes nickel, the at least one oxide of ABO3 type with the specified ionic radius is at least one of NiTiO3, MgTiO3, or MnTiO3.

公开(公告)号：US20240149340A1

公开(公告)日：2024-05-09

申请号：US18279012

申请日：2022-03-28

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Shinichi YAMAUCHI ,  Kei ANAI

IPC: B22F7/06 ,  B22F1/052 ,  B22F1/054 ,  B22F1/068 ,  B22F1/107 ,  B22F3/14 ,  B22F7/08 ,  B32B7/12 ,  B32B9/04 ,  B32B15/20 ,  H01L23/00

CPC classification number: B22F7/064 ,  B22F1/052 ,  B22F1/056 ,  B22F1/068 ,  B22F1/107 ,  B22F3/14 ,  B22F7/08 ,  B32B7/12 ,  B32B9/041 ,  B32B15/20 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  B22F2201/02 ,  B22F2301/10 ,  B22F2304/056 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/748 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/29147 ,  H01L2224/32221 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/8384

Abstract: A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.

公开(公告)号：US11905427B2

公开(公告)日：2024-02-20

申请号：US17347813

申请日：2021-06-15

Applicant: XEROX CORPORATION

Inventor： Guiqin Song ,  Sarah J. Vella ,  Barkev Keoshkerian

IPC: C09D11/52 ,  B22F9/24 ,  C09D11/38 ,  B22F1/054 ,  B22F1/107 ,  B82Y40/00 ,  B82Y30/00 ,  B22F1/068

CPC classification number: C09D11/52 ,  B22F1/054 ,  B22F1/056 ,  B22F1/107 ,  B22F9/24 ,  C09D11/38 ,  B22F1/068 ,  B22F2301/30 ,  B22F2303/01 ,  B22F2303/05 ,  B22F2304/054 ,  B22F2304/056 ,  B82Y30/00 ,  B82Y40/00 ,  B22F2999/00 ,  B22F1/107 ,  C22C1/0466 ,  C22C1/0483 ,  B22F1/054 ,  B22F1/056

Abstract: Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

公开(公告)号：US11896740B2

公开(公告)日：2024-02-13

申请号：US16760355

申请日：2018-11-27

Applicant: Northwestern University

Inventor： Adam E. Jakus ,  Ramille N. Shah ,  Nicholas R. Geisendorfer

IPC: A61L27/56 ,  A61L27/18 ,  A61L27/44 ,  C08J9/26 ,  C08L67/04

CPC classification number: A61L27/56 ,  A61L27/18 ,  A61L27/446 ,  C08J9/26 ,  C08L67/04 ,  C08J2201/03 ,  C08J2201/0444 ,  C08J2207/10 ,  C08J2367/04 ,  B22F2998/10 ,  B22F1/107 ,  B22F10/64 ,  B22F10/68 ,  B22F10/18

Abstract: Compositions for forming porous materials and three-dimensional objects, including fibers, films and coatings made from the materials are provided. Also provided are methods for forming the porous objects from the compositions. The compositions include a solvent, a polymer binder that is soluble in the solvent, and solid particles that are insoluble in the solvent. The solid particles include water-soluble salt particles that can be selectively dissolved from objects made from the compositions to render the resulting structures porous.

公开(公告)号：US20240029916A1

公开(公告)日：2024-01-25

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0245 ,  H05K2201/0133 ,  H05K1/189

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11877900B2

公开(公告)日：2024-01-23

申请号：US18082053

申请日：2022-12-15

Applicant: Ossiform ApS

Inventor： Morten Østergaard Andersen ,  Martin Bonde Jensen ,  Casper Slots

IPC: B29C64/10 ,  B29C64/106 ,  A61C13/00 ,  C04B35/563 ,  C04B28/00 ,  C04B35/468 ,  C04B35/583 ,  C04B35/01 ,  C04B28/04 ,  C04B35/505 ,  C04B35/632 ,  C04B35/495 ,  C04B35/16 ,  C04B35/58 ,  C04B35/50 ,  C04B35/457 ,  C04B28/34 ,  C04B35/56 ,  C04B35/111 ,  C04B35/515 ,  C04B35/486 ,  C04B35/636 ,  C04B33/04 ,  C04B35/447 ,  C04B35/565 ,  C04B35/453 ,  C04B35/46 ,  C04B35/49 ,  C04B35/634 ,  C04B35/08 ,  C04B35/14 ,  C04B35/553 ,  B29C64/165 ,  B29C64/188 ,  B29C64/112 ,  B29C64/124 ,  B29C64/118 ,  B22F1/107 ,  B33Y70/10 ,  B33Y40/20 ,  B22F10/20 ,  B28B1/00 ,  C09D11/033 ,  C09D11/037 ,  C09D11/32 ,  C09D11/36 ,  C09D11/38 ,  C09D11/52 ,  C04B111/00 ,  B29C64/153 ,  B29L31/00 ,  B22F10/18 ,  B22F10/64 ,  B22F10/60 ,  B29K105/00 ,  B22F10/16 ,  B22F10/12 ,  B22F10/14 ,  B22F10/28 ,  B22F10/10 ,  B33Y10/00

CPC classification number: A61C13/0013 ,  A61C13/00 ,  B22F1/107 ,  B22F10/20 ,  B28B1/001 ,  B29C64/112 ,  B29C64/118 ,  B29C64/124 ,  B29C64/165 ,  B29C64/188 ,  B33Y40/20 ,  B33Y70/10 ,  C04B28/006 ,  C04B28/04 ,  C04B28/34 ,  C04B33/04 ,  C04B35/01 ,  C04B35/08 ,  C04B35/111 ,  C04B35/14 ,  C04B35/16 ,  C04B35/447 ,  C04B35/453 ,  C04B35/457 ,  C04B35/46 ,  C04B35/4682 ,  C04B35/486 ,  C04B35/49 ,  C04B35/495 ,  C04B35/50 ,  C04B35/505 ,  C04B35/5152 ,  C04B35/553 ,  C04B35/563 ,  C04B35/565 ,  C04B35/5626 ,  C04B35/583 ,  C04B35/5805 ,  C04B35/58007 ,  C04B35/58014 ,  C04B35/58028 ,  C04B35/58085 ,  C04B35/58092 ,  C04B35/632 ,  C04B35/634 ,  C04B35/636 ,  C09D11/033 ,  C09D11/037 ,  C09D11/32 ,  C09D11/36 ,  C09D11/38 ,  C09D11/52 ,  B22F10/10 ,  B22F10/12 ,  B22F10/14 ,  B22F10/16 ,  B22F10/18 ,  B22F10/28 ,  B22F10/60 ,  B22F10/64 ,  B29C64/106 ,  B29C64/153 ,  B29K2105/0064 ,  B29L2031/753 ,  B29L2031/7532 ,  B29L2031/7534 ,  B29L2031/7536 ,  B33Y10/00 ,  C04B2111/00129 ,  C04B2111/00181 ,  C04B2235/6021 ,  C04B2235/6026 ,  C04B2235/658 ,  C04B2235/95 ,  Y02P10/25 ,  Y02P40/10 ,  C04B28/006 ,  C04B24/085 ,  C04B28/34 ,  C04B22/064 ,  C04B24/085 ,  C04B28/04 ,  C04B24/085

Abstract: The present invention relates to a suspension comprising 50-95% by weight of the total suspension (w/w) of at least one metallic material and/or ceramic material and/or polymeric material and/or solid carbon containing material; and at least 5% by weight of the total suspension of one or more fatty acids or derivatives thereof. In addition, the invention relates to uses of such suspension in 3D printing processes.

公开(公告)号：US20230373004A1

公开(公告)日：2023-11-23

申请号：US18029084

申请日：2020-10-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： JOHN SAMUEL DILIP JANGAM ,  THOMAS CRAIG ANTHONY ,  LIHUA ZHAO

IPC: B22F10/16 ,  B33Y70/10 ,  B22F1/105 ,  B22F1/107 ,  B22F10/64 ,  B33Y40/20 ,  B33Y10/00

CPC classification number: B22F10/16 ,  B33Y70/10 ,  B22F1/105 ,  B22F1/107 ,  B22F10/64 ,  B33Y40/20 ,  B33Y10/00 ,  B22F2302/30 ,  B22F2301/10 ,  B22F2998/10 ,  B22F2304/10

Abstract: The present disclosure is drawn to a three-dimensional printing kit and can include a particulate build material including from about 80 wt % to about 100 wt % metal particles, and a binding agent including water, from about 0.01 wt % to about 5 wt % organic compounds, and from about 20 wt % to about 60 wt % copper nitrate.

公开(公告)号：US11817398B2

公开(公告)日：2023-11-14

申请号：US17280256

申请日：2019-09-24

Applicant: NAMICS CORPORATION

Inventor： Masashi Kajita ,  Masahiro Kitamura ,  Takayuki Higuchi ,  Noritsuka Mizumura

IPC: H01L23/00 ,  B22F1/107 ,  B22F1/054 ,  B22F1/052

CPC classification number: H01L23/562 ,  B22F1/052 ,  B22F1/054 ,  B22F1/056 ,  B22F1/107 ,  H01L24/29 ,  H01L2224/29247 ,  H01L2924/15747 ,  H01L2924/3512 ,  B22F2999/00 ,  B22F1/05 ,  B22F2304/058 ,  C22C1/0425 ,  B22F2999/00 ,  B22F2304/056 ,  B22F1/054 ,  B22F1/056 ,  B22F2304/056 ,  B22F2304/054 ,  C22C1/0425

Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.

公开(公告)号：US20230340647A1

公开(公告)日：2023-10-26

申请号：US18209338

申请日：2023-06-13

Applicant: FUJITSU LIMITED

Inventor： Shinichi Hirose ,  Daiyu Kondo

IPC: C22C26/00 ,  B22F1/107 ,  B22F7/04 ,  B29C65/00

CPC classification number: C22C26/00 ,  B22F1/107 ,  B22F7/04 ,  B29C66/72143 ,  B29C66/742 ,  B22F2007/045 ,  H05K7/2039

Abstract: A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.