公开(公告)号：US20240238871A1

公开(公告)日：2024-07-18

申请号：US18440289

申请日：2024-02-13

Applicant: VIRGINIA COMMONWEALTH UNIVERSITY

Inventor： Hong ZHAO ,  Radhika BARUA ,  Ravi L. HADIMANI ,  Lilly BALDERSON

IPC: B22F10/22 ,  B22F1/105 ,  B22F1/107 ,  B22F5/10 ,  B22F10/50 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  H01F1/01 ,  B22F3/10

CPC classification number: B22F10/22 ,  B22F1/105 ,  B22F1/107 ,  B22F5/10 ,  B22F10/50 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  H01F1/015 ,  B22F3/1021 ,  B22F2202/05 ,  B22F2301/355

Abstract: A polymer-assisted 3D printing method and ink compositions are used to manufacture magnetocaloric devices having many applications including in heat pumps, refrigerators, etc. The ink compositions and printing methods can produce compositionally graded, anisotropically aligned magnetocaloric architectures with designed pores and channels, to bring forth significant improvement in heat exchange efficiency.

公开(公告)号：US20230415236A1

公开(公告)日：2023-12-28

申请号：US18178771

申请日：2023-03-06

Applicant: The Boeing Company

Inventor： Jonathan D. Embler ,  William E. O'Connor ,  Tobias Schaedler ,  Eric C. Clough ,  Raymond Nguyen ,  Sonia Zacher

IPC: B22F10/43 ,  B22F10/38 ,  B22F10/60

CPC classification number: B22F10/43 ,  B22F10/38 ,  B22F10/60 ,  B22F2301/205 ,  B22F2303/05 ,  B22F2303/40

Abstract: A multi-material structure includes a refractory portion with a metal or metal alloy of at least one of niobium (Nb), molybdenum (Mo), tantalum (Ta), tungsten (W), rhenium (Re), iridium (Ir), vanadium (V), and ruthenium (Ru). A structural portion is metallurgically joined with the refractory portion. The structural portion includes a titanium (Ti) alloy. At least one of the refractory and structural portions is additively manufactured.

公开(公告)号：US20230210635A1

公开(公告)日：2023-07-06

申请号：US17883390

申请日：2022-08-08

Applicant: Align Technology, Inc.

Inventor： Robert LISKA ,  Christian GORSCHE ,  Gyorgy HARAKALY ,  Markus KURY ,  Jurgen STAMPFL ,  Peter DORFINGER ,  Yan CHEN ,  Chunhua LI ,  Srinivas KAZA

IPC: A61C7/08 ,  C08G18/44 ,  C08G18/32 ,  C08G18/81 ,  B22F10/12 ,  C08J5/00 ,  C08G18/10 ,  A61C7/10 ,  C08G18/73 ,  C08G18/34 ,  C08G18/75 ,  B22F10/20 ,  B22F10/60 ,  B22F10/38

CPC classification number: A61C7/08 ,  C08G18/44 ,  C08G18/3212 ,  C08G18/815 ,  B22F10/12 ,  C08J5/00 ,  C08G18/10 ,  A61C7/10 ,  C08G18/73 ,  C08G18/348 ,  C08G18/3206 ,  C08G18/755 ,  B22F10/20 ,  B22F10/60 ,  B22F10/38 ,  C08J2375/04

Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, a method of producing crosslinked polymers using said curable compositions, crosslinked polymers thus produced, and orthodontic appliances comprising the crosslinked polymers.

公开(公告)号：US20220226903A1

公开(公告)日：2022-07-21

申请号：US17605136

申请日：2020-04-24

Applicant: RENA Technologies Austria GmbH

Inventor： Wolfgang HANSAL ,  Selma HANSAL ,  Martin PFAFFENEDER-KMEN ,  Gabriela SIRBU ,  Martina HALMDIENST

IPC: B22F10/40 ,  B33Y10/00 ,  B33Y40/20 ,  B22F10/28 ,  B22F10/60

Abstract: A process for the manufacture of a metal component, wherein, in a first step, a raw metal component (A) with auxiliary structures (E) is produced by additive manufacture by applying metal powder to a building board (D) in an installation space, the metal powder being made into the raw metal component (A) by selective laser or electron beam melting, wherein the raw metal component (A) is attached to the building board (D) by means of anchor structures (B), wherein, in a second step, the raw metal component (A) attached to the building board (D) with the anchor structures (B) is subsequently removed from the installation space and then the raw metal component (A) attached to the building board (D) by means of anchor structures (B) is subjected to a chemical, electrochemical or chemical and electrochemical post-treatment to remove the auxiliary structures, whereupon the anchor structures (B) are mechanically removed in a third step.

公开(公告)号：US20210251726A1

公开(公告)日：2021-08-19

申请号：US17252419

申请日：2018-06-15

Applicant: NARAYAMA LIMITED LIABILITY COMPANY

Inventor： Ivan Anatolievich FADEEV ,  Aleksei Sergeevich DIURIAGIN ,  Vasily Sergeevich DIURIAGIN ,  Vasily Sergeevich ORLOV ,  Alexei Vyacheslavovich DENISOV

IPC: A61C8/00 ,  A61C13/00 ,  A61L27/32 ,  A61L27/06 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  B22F10/28 ,  B22F10/60 ,  C23C14/02 ,  C23C14/08 ,  C23C14/34

Abstract: This invention relates to the field of medical technology, and can be used in dentistry and traumatology, in particular when creating dental implants. Namely, the invention relates to the development and creation of a method for producing a dental implant characterized by high strength, as well as increased ability to activate the process of osteogenesis and osseointegration. The implant obtained by this method is characterized by high biocompatibility, bactericidal properties (reduces pronounced dystrophic and necrotic processes of living tissue), and an increased level of implant surface strength.

公开(公告)号：US20240325117A1

公开(公告)日：2024-10-03

申请号：US18735815

申请日：2024-06-06

Applicant: Align Technology, Inc.

Inventor： Robert LISKA ,  Christian GORSCHE ,  Gyorgy HARAKALY ,  Markus KURY ,  Jurgen STAMPFL ,  Peter DORFINGER ,  Yan CHEN ,  Chunhua LI ,  Srinivas KAZA

IPC: A61C7/08 ,  A61C7/10 ,  B22F10/12 ,  B22F10/20 ,  B22F10/38 ,  B22F10/60 ,  C08G18/10 ,  C08G18/32 ,  C08G18/34 ,  C08G18/44 ,  C08G18/73 ,  C08G18/75 ,  C08G18/81 ,  C08J5/00

CPC classification number: A61C7/08 ,  A61C7/10 ,  B22F10/12 ,  C08G18/10 ,  C08G18/3206 ,  C08G18/3212 ,  C08G18/348 ,  C08G18/44 ,  C08G18/73 ,  C08G18/755 ,  C08G18/815 ,  C08J5/00 ,  B22F10/20 ,  B22F10/38 ,  B22F10/60 ,  C08J2375/04

Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, a method of producing crosslinked polymers using said curable compositions, crosslinked polymers thus produced, and orthodontic appliances comprising the crosslinked polymers.

公开(公告)号：US12103083B2

公开(公告)日：2024-10-01

申请号：US17165069

申请日：2021-02-02

Applicant: SEIKO EPSON CORPORATION

Inventor： Eiji Okamoto ,  Masaya Ishida ,  Hiroshi Wada ,  Toshimitsu Hirai

IPC: B33Y40/00 ,  B22F7/00 ,  B22F10/16 ,  B22F10/43 ,  B22F10/47 ,  B22F10/60 ,  B28B1/00 ,  B29C35/08 ,  B29C64/40 ,  B32B18/00 ,  B33Y10/00 ,  B33Y80/00 ,  B22F12/30 ,  B22F12/55 ,  B29K105/16

CPC classification number: B22F7/006 ,  B22F10/43 ,  B22F10/47 ,  B28B1/001 ,  B29C35/0805 ,  B29C64/40 ,  B32B18/00 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y80/00 ,  B22F10/16 ,  B22F10/60 ,  B22F12/30 ,  B22F12/55 ,  B22F2999/00 ,  B29C2035/0838 ,  B29K2105/16 ,  C04B2235/6026 ,  C04B2235/77 ,  C04B2235/9615 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/68 ,  Y02P10/25 ,  B22F2999/00 ,  B22F10/47 ,  B22F2207/17 ,  B22F3/1121 ,  B22F2003/1128

Abstract: A three-dimensional shaped article production method for producing a three-dimensional shaped article by stacking layers to form a stacked body includes a constituent layer formation step of forming a constituent layer which corresponds to a constituent region of the three-dimensional shaped article, a support layer formation step of forming a support layer which is in contact with the constituent layer and supports the constituent layer, and a sintering step of sintering the constituent layer, wherein the support layer is configured such that as compared with the volume decrement accompanying the sintering step of a space surrounded by the constituent layer from at least two directions, the volume decrement accompanying the sintering step of the support layer which supports the constituent layer in the space is larger.

公开(公告)号：US20240300021A1

公开(公告)日：2024-09-12

申请号：US18597983

申请日：2024-03-07

Applicant: Kenichiroh HASHIMOTO ,  Kenji SUGIURA ,  Toshiyuki MUTOH

Inventor： Kenichiroh HASHIMOTO ,  Kenji SUGIURA ,  Toshiyuki MUTOH

IPC: B22F10/60 ,  B22F10/14 ,  B28B1/00 ,  B33Y10/00 ,  B33Y30/00

CPC classification number: B22F10/60 ,  B28B1/001 ,  B33Y10/00 ,  B33Y30/00 ,  B22F10/14

Abstract: A drying device includes a housing section and a drying section. The housing section is configured to house a powder bound object. The drying section is configured to dry the powder bound object housed in the housing section. The housing section includes a bottom. The bottom includes a periphery. The bottom includes an air vent inside of the periphery.

公开(公告)号：US12042353B2

公开(公告)日：2024-07-23

申请号：US17883390

申请日：2022-08-08

Applicant: Align Technology, Inc.

Inventor： Robert Liska ,  Christian Gorsche ,  Gyorgy Harakaly ,  Markus Kury ,  Jurgen Stampfl ,  Peter Dorfinger ,  Yan Chen ,  Chunhua Li ,  Srinivas Kaza

IPC: A61C7/08 ,  A61C7/10 ,  B22F10/12 ,  B22F10/20 ,  B22F10/38 ,  B22F10/60 ,  C08G18/10 ,  C08G18/32 ,  C08G18/34 ,  C08G18/44 ,  C08G18/73 ,  C08G18/75 ,  C08G18/81 ,  C08J5/00

CPC classification number: A61C7/08 ,  A61C7/10 ,  B22F10/12 ,  C08G18/10 ,  C08G18/3206 ,  C08G18/3212 ,  C08G18/348 ,  C08G18/44 ,  C08G18/73 ,  C08G18/755 ,  C08G18/815 ,  C08J5/00 ,  B22F10/20 ,  B22F10/38 ,  B22F10/60 ,  C08J2375/04

Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, a method of producing crosslinked polymers using said curable compositions, crosslinked polymers thus produced, and orthodontic appliances comprising the crosslinked polymers.

公开(公告)号：US11969788B1

公开(公告)日：2024-04-30

申请号：US18101447

申请日：2023-01-25

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Jean L. Kubwimana ,  Alexander D. Johnson ,  Jacob Tamasy ,  James F. Fung ,  Matthew J. Ney

IPC: B22F10/40 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: B22F10/40 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  H01Q1/48 ,  H01Q9/0407

Abstract: A method of manufacturing an antenna assembly includes additively manufacturing an element that is a monolithic structure and that includes (i) a ground plane including one or more aperture slots, (ii) a patch antenna above the ground plane, and (iii) a sacrificial support feature to support the patch antenna above the ground plane. The method further includes applying a dielectric material between the ground plane and the patch antenna. In an example, applying the dielectric material between the ground plane and the patch antenna includes providing a dielectric foam between the ground plane and the patch antenna, where the dielectric foam at least in part supports the patch antenna above the ground plane. The method further includes removing at least a section of the sacrificial support feature, such that any remnant of the support feature does not physically couple the ground plane to the patch antenna.