公开(公告)号：US20240360046A1

公开(公告)日：2024-10-31

申请号：US18561043

申请日：2022-05-17

Applicant: ZEON CORPORATION

Inventor： Yasuyuki MURAKAMI

IPC: C04B41/45 ,  C04B35/10 ,  C04B35/634 ,  C04B41/00 ,  C04B41/91

CPC classification number: C04B41/4501 ,  C04B35/10 ,  C04B35/63444 ,  C04B41/0072 ,  C04B41/91 ,  C04B2235/3217 ,  C04B2237/343 ,  C04B2237/525 ,  C04B2237/704

Abstract: A method of producing a ceramic sheet includes: shaping a composition containing a resin and a ceramic material into a sheet-like form through pressure application to perform primary sheet shaping; stacking a plurality of the primary sheet in a thickness direction or performing folding or winding of the primary sheet to obtain a laminate; slicing the laminate at an angle of 45° or less relative to a stacking direction to obtain a secondary sheet; and firing the secondary sheet.

公开(公告)号：US20240343652A1

公开(公告)日：2024-10-17

申请号：US18643795

申请日：2024-04-23

Applicant: QuantumScape Battery, Inc.

Inventor： Oleh Karpenko ,  Gengfu Xu ,  Niall Donnelly ,  Sriram Iyer ,  Timothy Holme

IPC: C04B35/50 ,  B32B18/00 ,  B32B37/16 ,  C04B35/486 ,  C04B35/622 ,  C04B35/626 ,  C04B35/634 ,  C04B35/638 ,  C04B35/64 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0562

CPC classification number: C04B35/50 ,  B32B18/00 ,  B32B37/16 ,  C04B35/486 ,  C04B35/62218 ,  C04B35/6261 ,  C04B35/6264 ,  C04B35/634 ,  C04B35/6342 ,  C04B35/638 ,  C04B35/64 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0562 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3227 ,  C04B2235/3248 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5463 ,  C04B2235/6025 ,  C04B2235/608 ,  C04B2235/6584 ,  C04B2235/6588 ,  C04B2235/66 ,  C04B2235/764 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/562 ,  H01M2300/0068 ,  H01M2300/0071

Abstract: Set forth herein are processes and materials for making ceramic thin films by casting ceramic source powders and precursor reactants, binders, and functional additives into unsintered thin films and subsequently sintering the thin films under controlled atmospheres and on specific substrates.

公开(公告)号：US12084387B2

公开(公告)日：2024-09-10

申请号：US16734196

申请日：2020-01-03

Applicant: QuantumScape Battery, Inc.

Inventor： Oleh Karpenko ,  Gengfu Xu ,  Niall Donnelly ,  Sriram Iyer ,  Tim Holme

IPC: C04B35/50 ,  B32B18/00 ,  B32B37/16 ,  C04B35/486 ,  C04B35/622 ,  C04B35/626 ,  C04B35/634 ,  C04B35/638 ,  C04B35/64 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0562

CPC classification number: C04B35/50 ,  B32B18/00 ,  B32B37/16 ,  C04B35/486 ,  C04B35/62218 ,  C04B35/6261 ,  C04B35/6264 ,  C04B35/634 ,  C04B35/6342 ,  C04B35/638 ,  C04B35/64 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0562 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3227 ,  C04B2235/3248 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5463 ,  C04B2235/6025 ,  C04B2235/608 ,  C04B2235/6584 ,  C04B2235/6588 ,  C04B2235/66 ,  C04B2235/764 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/562 ,  H01M2300/0068 ,  H01M2300/0071

Abstract: Set forth herein are processes and materials for making ceramic thin films by casting ceramic source powders and precursor reactants, binders, and functional additives into unsintered thin films and subsequently sintering the thin films under controlled atmospheres and on specific substrates.

公开(公告)号：US12034092B2

公开(公告)日：2024-07-09

申请号：US18300897

申请日：2023-04-14

Applicant: MATERION CORPORATION

Inventor： Michael P. Newell ,  Zan Aslett ,  Robert Cuzziere ,  Andrew P. Houde ,  Derrick Brown

IPC: H01L31/0232 ,  C03C14/00 ,  C04B37/02 ,  G03B21/16 ,  G03B21/20 ,  H01L31/024 ,  H01L31/18 ,  H01L33/50 ,  H01L33/64

CPC classification number: H01L31/02327 ,  C03C14/006 ,  C04B37/026 ,  G03B21/16 ,  G03B21/204 ,  H01L31/024 ,  H01L31/18 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/84 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/644

Abstract: A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

公开(公告)号：US20240222179A1

公开(公告)日：2024-07-04

申请号：US18525387

申请日：2023-11-30

Applicant: SEMES CO., LTD.

Inventor： So Hyung JIONG ,  Hyung Joon KIM ,  Jong Gun LEE

IPC: H01L21/683 ,  C04B35/645 ,  C04B37/02

CPC classification number: H01L21/6833 ,  C04B35/6455 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/406

Abstract: A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.

公开(公告)号：US12020999B2

公开(公告)日：2024-06-25

申请号：US17308461

申请日：2021-05-05

Applicant: MATERION CORPORATION

Inventor： Ramesh Kothandapani

IPC: H01L23/10 ,  B23K1/00 ,  B32B3/06 ,  B32B3/26 ,  B32B9/00 ,  B32B9/04 ,  C04B37/02

CPC classification number: H01L23/10 ,  B23K1/00 ,  B32B3/06 ,  B32B3/266 ,  B32B9/005 ,  B32B9/041 ,  C04B37/026 ,  B32B2255/205 ,  B32B2439/00 ,  B32B2457/14 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/408 ,  C04B2237/592 ,  C04B2237/708 ,  C04B2237/86 ,  H01L2924/16195

Abstract: A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

公开(公告)号：US11958271B2

公开(公告)日：2024-04-16

申请号：US17312701

申请日：2019-12-05

Applicant: TDK Electronics AG

Inventor： Nele Reimer ,  Manfred Schweinzger

IPC: B32B18/00 ,  C04B37/00

CPC classification number: B32B18/00 ,  C04B37/001 ,  C04B2237/343 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368

Abstract: In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

公开(公告)号：US11909004B2

公开(公告)日：2024-02-20

申请号：US18166814

申请日：2023-02-09

Applicant: Ambri Inc.

Inventor： David J. Bradwell ,  Greg A. Thompson ,  Michael J. McNeley

IPC: H01M10/39 ,  B60L53/00 ,  B60L53/53 ,  B60L50/64 ,  H01M50/463 ,  H01M4/134 ,  H01M4/38 ,  H01M10/42 ,  C04B37/02 ,  C04B37/00 ,  H01M50/186 ,  H01M50/191 ,  H01M50/522 ,  H01M50/507 ,  H01M50/138

CPC classification number: H01M10/399 ,  B60L50/64 ,  B60L53/00 ,  B60L53/53 ,  C04B37/006 ,  C04B37/026 ,  H01M4/134 ,  H01M4/38 ,  H01M4/381 ,  H01M10/39 ,  H01M10/425 ,  H01M10/4207 ,  H01M50/186 ,  H01M50/191 ,  H01M50/463 ,  C04B2235/9607 ,  C04B2237/066 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/60 ,  C04B2237/72 ,  C04B2237/82 ,  H01M4/382 ,  H01M4/387 ,  H01M50/138 ,  H01M50/507 ,  H01M50/522 ,  H01M2220/20 ,  Y02T10/70 ,  Y02T10/7072 ,  Y02T90/14

Abstract: Provided herein are energy storage devices. In some cases, the energy storage devices are capable of being transported on a vehicle and storing a large amount of energy. An energy storage device is provided comprising at least one liquid metal electrode, an energy storage capacity of at least about 1 MWh and a response time less than or equal to about 100 milliseconds (ms).

公开(公告)号：US11840479B2

公开(公告)日：2023-12-12

申请号：US16230523

申请日：2018-12-21

Applicant: Schott AG

Inventor： Christian Mix ,  Ina Mitra ,  Ulf Dahlmann ,  Jens Suffner ,  Martun Hovhannisyan ,  Björn Ramdohr

IPC: B32B17/06 ,  C03C27/02 ,  C03B19/06 ,  C03C3/087 ,  C03C10/00 ,  C03C27/00 ,  C04B37/04 ,  C03C3/064 ,  C03C3/093 ,  B32B5/14 ,  C03C27/04

CPC classification number: C03C27/02 ,  B32B5/145 ,  B32B17/06 ,  C03B19/06 ,  C03C3/064 ,  C03C3/087 ,  C03C3/093 ,  C03C10/0036 ,  C03C10/0045 ,  C03C10/0054 ,  C03C27/00 ,  C03C27/044 ,  C04B37/042 ,  B32B17/061 ,  C04B2237/343 ,  C04B2237/348

Abstract: The disclosure relates to a bond produced with an at least partially crystallized glass, such as a metal-to-glass bond, in particular a metal-to-glass bond in a feed-through element or connecting element, and to a method for producing such a bond, in particular in a feed-through element or connecting element. The at least partially crystallized glass includes at least one crystal phase and pores which are distributed in the at least partially crystallized glass in a structured manner.

公开(公告)号：US11804383B2

公开(公告)日：2023-10-31

申请号：US18075559

申请日：2022-12-06

Applicant: Infineon Technologies AG

Inventor： Alexander Roth

IPC: H01L21/48 ,  C04B35/645 ,  C04B37/02 ,  H05K3/40 ,  C04B41/00 ,  C04B41/51 ,  C04B41/88 ,  H01L23/15 ,  H01L23/373 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02

CPC classification number: H01L21/486 ,  C04B35/6455 ,  C04B37/021 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  H01L21/4807 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49866 ,  H05K3/4061 ,  C04B2235/606 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  H05K1/0306 ,  H05K3/022

Abstract: A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.