公开(公告)号：US20190194078A1

公开(公告)日：2019-06-27

申请号：US16169938

申请日：2018-10-24

申请人： COMPONENT RE-ENGINEERING COMPANY, INC.

发明人： Brent Elliot ,  Dennis George Rex ,  Guleid Hussen ,  Michael Parker ,  Jason Stephens

IPC分类号： C04B37/02 ,  B32B1/08 ,  B32B15/04 ,  B32B15/20 ,  H02G3/22

CPC分类号： C04B37/021 ,  B32B1/08 ,  B32B15/04 ,  B32B15/20 ,  B32B2457/00 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/60 ,  C04B2237/74 ,  C04B2237/84 ,  G21C13/028 ,  G21C17/116 ,  H02G3/22

摘要： An electrical termination unit or feedthrough which may be used for routing electrical conductors through a chamber wall, or otherwise across a barrier between isolated atmospheric conditions. The electrical termination unit may have aluminum as the interface material to the chamber interface and may utilize a ceramic insulator. The electrical termination unit may have the aluminum used as the interface brazed directly to a ceramic surface of the insulator. The aluminum that forms the chamber interface may be formed within a hollow ceramic tube in the same process step that brazes the aluminum to the ceramic tube with a hermetic joint. Machining subsequent to the brazing of the aluminum to the ceramic insulator may allow for achievement of the final form desired. A method for manufacturing such an electrical termination unit.

公开(公告)号：US20180346387A1

公开(公告)日：2018-12-06

申请号：US15778694

申请日：2016-11-08

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo

IPC分类号： C04B37/02 ,  H01L23/13 ,  H01L23/373 ,  H01L23/40 ,  H05K1/03 ,  H05K1/05

CPC分类号： C04B37/02 ,  B23K1/0016 ,  B23K35/0233 ,  B23K35/025 ,  B23K35/286 ,  B23K2103/10 ,  B23K2103/172 ,  B23K2103/52 ,  C04B35/584 ,  C04B35/645 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/96 ,  C04B2237/08 ,  C04B2237/121 ,  C04B2237/128 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/52 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C22C21/00 ,  C22C21/02 ,  C22C29/16 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/40 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/05

摘要： A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.

公开(公告)号：US20180190568A1

公开(公告)日：2018-07-05

申请号：US15742829

申请日：2016-06-01

申请人： KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

发明人： Takayuki NABA ,  Hiromasa KATO ,  Noboru KITAMORI

IPC分类号： H01L23/373 ,  H01L23/15 ,  H01L23/492 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  C04B2237/88 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/32245

摘要： The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate through respective bonding layers, wherein a metal film is provided on a surface of one metal plate bonded to one surface of the ceramic substrate; and at least a part of another metal plate bonded to another surface of the ceramic substrate is not provided with the metal film. Preferably, a protruding portion is formed as a portion of the bonding layer so as to protrude from a side surface of each of the metal plates. According to the above-described configuration, it is possible to provide a ceramic circuit board which is easy to use according to the parts to be bonded and is excellent in heat-cycle resistance characteristics.

公开(公告)号：US09870902B2

公开(公告)日：2018-01-16

申请号：US14782969

申请日：2014-04-28

申请人： KOBELCO RESEARCH INSTITUTE, INC.

发明人： Yuichi Taketomi ,  Moriyoshi Kanamaru ,  Shintaro Yoshida

IPC分类号： C23C14/35 ,  H01J37/34 ,  C04B35/01 ,  C04B35/447 ,  C04B35/645 ,  C04B37/02 ,  C23C14/34 ,  C23C14/08

CPC分类号： H01J37/3417 ,  C04B35/01 ,  C04B35/447 ,  C04B35/645 ,  C04B37/026 ,  C04B2235/3203 ,  C04B2235/3275 ,  C04B2235/6565 ,  C04B2235/72 ,  C04B2235/721 ,  C04B2235/96 ,  C04B2235/963 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/402 ,  C04B2237/407 ,  C23C14/082 ,  C23C14/085 ,  C23C14/3407 ,  C23C14/3414 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/3491

摘要： Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.

公开(公告)号：US20180002239A1

公开(公告)日：2018-01-04

申请号：US15706692

申请日：2017-09-16

申请人： IXYS Semiconductor GmbH

发明人： Heiko Knoll

IPC分类号： C04B37/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373

CPC分类号： C04B37/021 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/665 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A method of joining a metal-ceramic substrate having metalization on at least one side to a metal body by using a metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm, and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

公开(公告)号：US09790130B2

公开(公告)日：2017-10-17

申请号：US13482685

申请日：2012-05-29

申请人： Heiko Knoll

发明人： Heiko Knoll

IPC分类号： B23K31/00 ,  C04B37/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373

CPC分类号： C04B37/021 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/665 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

公开(公告)号：US09642247B2

公开(公告)日：2017-05-02

申请号：US14428839

申请日：2013-09-16

申请人： CURAMIK ELECTRONICS GMBH

发明人： Karsten Schmidt ,  Andreas Meyer ,  Alexander Legath ,  Martina Schmirler

IPC分类号： C04B37/02 ,  C04B35/119 ,  H05K1/03 ,  H05K1/09 ,  C04B35/111

CPC分类号： H05K1/0306 ,  C04B35/111 ,  C04B35/119 ,  C04B37/021 ,  C04B37/023 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5248 ,  C04B2235/5436 ,  C04B2235/786 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H05K1/09 ,  H05K2201/0175 ,  H05K2201/032 ,  H05K2201/062 ,  Y10T156/10 ,  Y10T428/26 ,  Y10T428/266

摘要： The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallization, wherein the ceramic material forming the ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminum oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminum oxide used is between 2 and 8 micrometers and the ratio of the length of the grain boundaries of the aluminum oxide grains to the total length of all the grain boundaries is greater than 0.6.

公开(公告)号：US09597734B2

公开(公告)日：2017-03-21

申请号：US14534574

申请日：2014-11-06

申请人： Applied Materials, Inc.

发明人： Jennifer Sun ,  Sumanth Banda ,  Ren-Guan Duan

IPC分类号： B23B31/28 ,  B23Q3/00 ,  B05B1/14 ,  B23B31/02 ,  B32B15/08 ,  C04B35/626 ,  C04B35/634 ,  C04B37/00 ,  C04B37/02 ,  H01L21/683

CPC分类号： B23B31/28 ,  B05B1/14 ,  B23B31/02 ,  B23Q3/00 ,  B32B15/08 ,  C04B35/6269 ,  C04B35/63424 ,  C04B37/005 ,  C04B37/006 ,  C04B37/008 ,  C04B37/025 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/604 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/62 ,  H01L21/6831 ,  Y10T156/10 ,  Y10T279/23

摘要： Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

公开(公告)号：US09586868B2

公开(公告)日：2017-03-07

申请号：US14912321

申请日：2014-08-15

申请人： United Technologies Corporation

发明人： Grant O. Cook, III ,  Kevin W. Schlichting ,  Venkatarama K. Seetharaman

IPC分类号： B23K20/00 ,  B23K31/00 ,  C04B37/00 ,  B23K20/16

CPC分类号： B23K20/16 ,  B23K20/00 ,  B23K35/3053 ,  B23K35/32 ,  B23K35/327 ,  B23K35/3601 ,  B23K35/3602 ,  B23K35/3606 ,  B32B15/01 ,  C04B37/001 ,  C04B37/003 ,  C04B37/006 ,  C04B37/023 ,  C04B37/026 ,  C04B2235/5224 ,  C04B2235/524 ,  C04B2235/5244 ,  C04B2235/5248 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/16 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/38 ,  C04B2237/40 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/595 ,  C04B2237/60 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/72 ,  F01D5/12 ,  F01D5/288 ,  F05D2220/32 ,  F05D2230/23 ,  F05D2230/236 ,  F05D2240/35 ,  F05D2300/21 ,  F05D2300/2112 ,  F05D2300/2118 ,  F05D2300/22 ,  F05D2300/224 ,  F05D2300/2261 ,  F05D2300/2263 ,  F05D2300/2283 ,  F05D2300/2284 ,  F05D2300/5023 ,  F05D2300/5024 ,  F05D2300/6032 ,  F05D2300/6033

摘要： A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.

摘要翻译： 用于连接发动机部件的方法包括将第一多个热保护结构定位在第一热保护表面和第二热保护表面之间的热保护空间上。 第一和第二发动机部件通过在第一热保护表面和第二热保护表面之间形成第一多个瞬态液相（TLP）或部分瞬时液相（PTLP）键， 热保护面。 第二热保护表面由与第一热保护表面的第一表面材料不同的第二表面材料形成。

公开(公告)号：US20170062305A1

公开(公告)日：2017-03-02

申请号：US15119547

申请日：2015-01-30

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo

IPC分类号： H01L23/373 ,  H05K1/18 ,  B23K35/30 ,  H01L23/15 ,  C04B37/02 ,  B23K1/00

CPC分类号： H01L23/3735 ,  B23K1/0016 ,  B23K35/302 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/15 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/83101 ,  H05K1/181 ,  H05K2201/10378

摘要： There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 μm to 3 μm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at % to 15 at %.

摘要翻译： 提供了一种本发明的接合体，其中由含有Al的陶瓷和由Cu或Cu合金形成的Cu构件形成的陶瓷构件彼此结合，其中在陶瓷构件和 在陶瓷构件侧的接合部分上形成Cu构件，由含有活性金属的化合物形成的活性金属化合物区域，并且从所述陶瓷构件侧的一个表面的厚度范围为0.5μm至3μm的接合部分的Al浓度 在Cu元件侧朝向Cu元件侧的活性金属化合物区域在0.5at％至15at％的范围内。