公开(公告)号：US12109640B2

公开(公告)日：2024-10-08

申请号：US17418888

申请日：2019-12-26

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa Yuasa ,  Takahiro Nakamura ,  Koji Nishimura

IPC: B23K1/00 ,  B22F1/05 ,  C04B37/02 ,  H01L23/373 ,  H05K1/03 ,  H05K1/09 ,  H05K3/06 ,  B23K101/42 ,  B23K103/00 ,  B23K103/12

CPC classification number: B23K1/0016 ,  C04B37/023 ,  H01L23/3735 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/06 ,  B22F1/05 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/52 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/52 ,  H05K2201/0355 ,  H05K2203/1126

Abstract: A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°.

公开(公告)号：US11845700B2

公开(公告)日：2023-12-19

申请号：US16768340

申请日：2018-11-21

Applicant: Rogers Germany GmbH

Inventor： Maximilian Engel ,  Xinhe Tang ,  Stefan Britting

IPC: C04B37/02 ,  B32B9/00

CPC classification number: C04B37/021 ,  B32B9/005 ,  C04B2237/407 ,  C04B2237/54

Abstract: A method for producing a semi-finished metal product (2), in particular a semi-finished copper product, for a metal-copper substrate, in particular for a copper-ceramic substrate, including:



providing a first metal layer (11), in particular a first copper layer, and a second metal layer (12), in particular a second copper layer,
joining the first metal layer (11) and the second metal layer (12) to form the semi-finished metal product (2), wherein, chronologically before the first metal layer (11) is joined to the second metal layer (12) by means of different temperature treatments, a grain growth in the first metal layer (11) and/or the second metal layer (12) is initiated in such a way that in the produced semi-finished metal product (2), in particular in the produced metal-copper substrate, a first grain size in the first metal layer (11) differs from a second grain size in the second metal layer (12).

公开(公告)号：US20230365471A1

公开(公告)日：2023-11-16

申请号：US18246082

申请日：2021-09-28

Applicant: Denka Company Limited

Inventor： Yusuke WAKUDA ,  Yoshitaka MINAKATA ,  Shinya SAKAGUCHI ,  Tomoya YAMAGUCHI ,  Koki IKARASHI ,  Koji NISHIMURA

IPC: C04B37/02 ,  B32B9/04 ,  B32B9/00 ,  B32B37/18 ,  B32B15/20 ,  C04B35/583 ,  C04B38/00 ,  C04B41/83 ,  C04B41/48 ,  C04B41/00 ,  H01L23/373

CPC classification number: C04B37/028 ,  B32B9/041 ,  B32B9/005 ,  B32B37/18 ,  B32B15/20 ,  C04B35/583 ,  C04B38/0054 ,  C04B41/83 ,  C04B41/4853 ,  C04B41/0072 ,  H01L23/3735 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/748 ,  B32B2307/306 ,  B32B2315/02 ,  B32B2311/12 ,  B32B2250/02 ,  B32B2305/07 ,  B32B2305/026 ,  C04B2235/3856 ,  C04B2235/386 ,  C04B2237/407 ,  C04B2237/361 ,  C04B2237/61

Abstract: One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the curing rate of the resin is 10 to 70%.

公开(公告)号：US10037928B2

公开(公告)日：2018-07-31

申请号：US15537684

申请日：2016-01-23

Applicant: KYOCERA Corporation

Inventor： Narutoshi Ogawa ,  Kensou Ochiai ,  Noritaka Niino ,  Shinichi Kooriyama ,  Masashi Konagai

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/14 ,  H01L23/473

CPC classification number: H01L23/367 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  C04B2237/86 ,  C04B2237/88 ,  H01L23/12 ,  H01L23/142 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49833 ,  H05K1/05 ,  H05K7/20 ,  H05K7/209

Abstract: A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.

公开(公告)号：US20180190568A1

公开(公告)日：2018-07-05

申请号：US15742829

申请日：2016-06-01

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

Inventor： Takayuki NABA ,  Hiromasa KATO ,  Noboru KITAMORI

IPC: H01L23/373 ,  H01L23/15 ,  H01L23/492 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/3735 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  C04B2237/88 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/32245

Abstract: The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate through respective bonding layers, wherein a metal film is provided on a surface of one metal plate bonded to one surface of the ceramic substrate; and at least a part of another metal plate bonded to another surface of the ceramic substrate is not provided with the metal film. Preferably, a protruding portion is formed as a portion of the bonding layer so as to protrude from a side surface of each of the metal plates. According to the above-described configuration, it is possible to provide a ceramic circuit board which is easy to use according to the parts to be bonded and is excellent in heat-cycle resistance characteristics.

公开(公告)号：US09980384B2

公开(公告)日：2018-05-22

申请号：US14407405

申请日：2013-06-21

Applicant: KYOCERA Corporation

Inventor： Yoshio Ohashi ,  Kunihide Shikata

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/38 ,  C04B37/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

公开(公告)号：US09870902B2

公开(公告)日：2018-01-16

申请号：US14782969

申请日：2014-04-28

Applicant: KOBELCO RESEARCH INSTITUTE, INC.

Inventor： Yuichi Taketomi ,  Moriyoshi Kanamaru ,  Shintaro Yoshida

IPC: C23C14/35 ,  H01J37/34 ,  C04B35/01 ,  C04B35/447 ,  C04B35/645 ,  C04B37/02 ,  C23C14/34 ,  C23C14/08

CPC classification number: H01J37/3417 ,  C04B35/01 ,  C04B35/447 ,  C04B35/645 ,  C04B37/026 ,  C04B2235/3203 ,  C04B2235/3275 ,  C04B2235/6565 ,  C04B2235/72 ,  C04B2235/721 ,  C04B2235/96 ,  C04B2235/963 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/402 ,  C04B2237/407 ,  C23C14/082 ,  C23C14/085 ,  C23C14/3407 ,  C23C14/3414 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/3491

Abstract: Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.

公开(公告)号：US20180002239A1

公开(公告)日：2018-01-04

申请号：US15706692

申请日：2017-09-16

Applicant: IXYS Semiconductor GmbH

Inventor： Heiko Knoll

IPC: C04B37/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373

CPC classification number: C04B37/021 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/665 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of joining a metal-ceramic substrate having metalization on at least one side to a metal body by using a metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm, and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

公开(公告)号：US09790130B2

公开(公告)日：2017-10-17

申请号：US13482685

申请日：2012-05-29

Applicant: Heiko Knoll

Inventor： Heiko Knoll

IPC: B23K31/00 ,  C04B37/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373

CPC classification number: C04B37/021 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/665 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

公开(公告)号：US09780011B2

公开(公告)日：2017-10-03

申请号：US14127476

申请日：2012-07-02

Applicant: Hisayuki Imamura ,  Suguru Fujita ,  Junichi Watanabe

Inventor： Hisayuki Imamura ,  Suguru Fujita ,  Junichi Watanabe

IPC: H01L23/34 ,  B23K35/30 ,  B22F7/06 ,  B23K35/36 ,  B23K35/02 ,  C22C1/04 ,  C22C5/06 ,  C22C5/08 ,  C04B37/02 ,  H01L23/15 ,  H01L23/373 ,  B22F9/02 ,  B23K101/40 ,  H05K1/03 ,  H05K3/38

CPC classification number: H01L23/34 ,  B22F7/062 ,  B22F9/023 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K2101/40 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/6581 ,  C04B2235/96 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/597 ,  C04B2237/704 ,  C04B2237/706 ,  C22C1/0466 ,  C22C5/06 ,  C22C5/08 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  Y10T428/12014 ,  Y10T428/249969 ,  H01L2924/00

Abstract: To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.