公开(公告)号：US12034092B2

公开(公告)日：2024-07-09

申请号：US18300897

申请日：2023-04-14

Applicant: MATERION CORPORATION

Inventor： Michael P. Newell ,  Zan Aslett ,  Robert Cuzziere ,  Andrew P. Houde ,  Derrick Brown

IPC: H01L31/0232 ,  C03C14/00 ,  C04B37/02 ,  G03B21/16 ,  G03B21/20 ,  H01L31/024 ,  H01L31/18 ,  H01L33/50 ,  H01L33/64

CPC classification number: H01L31/02327 ,  C03C14/006 ,  C04B37/026 ,  G03B21/16 ,  G03B21/204 ,  H01L31/024 ,  H01L31/18 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/84 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/644

Abstract: A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

公开(公告)号：US20240222179A1

公开(公告)日：2024-07-04

申请号：US18525387

申请日：2023-11-30

Applicant: SEMES CO., LTD.

Inventor： So Hyung JIONG ,  Hyung Joon KIM ,  Jong Gun LEE

IPC: H01L21/683 ,  C04B35/645 ,  C04B37/02

CPC classification number: H01L21/6833 ,  C04B35/6455 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/406

Abstract: A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.

公开(公告)号：US12020999B2

公开(公告)日：2024-06-25

申请号：US17308461

申请日：2021-05-05

Applicant: MATERION CORPORATION

Inventor： Ramesh Kothandapani

IPC: H01L23/10 ,  B23K1/00 ,  B32B3/06 ,  B32B3/26 ,  B32B9/00 ,  B32B9/04 ,  C04B37/02

CPC classification number: H01L23/10 ,  B23K1/00 ,  B32B3/06 ,  B32B3/266 ,  B32B9/005 ,  B32B9/041 ,  C04B37/026 ,  B32B2255/205 ,  B32B2439/00 ,  B32B2457/14 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/408 ,  C04B2237/592 ,  C04B2237/708 ,  C04B2237/86 ,  H01L2924/16195

Abstract: A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

公开(公告)号：US11964919B2

公开(公告)日：2024-04-23

申请号：US17054978

申请日：2019-08-14

Applicant: ZONE INFINITY CO., LTD.

Inventor： Inchul Cho

IPC: B28B11/08 ,  C04B35/581 ,  C04B35/584 ,  C04B35/587 ,  C04B35/622 ,  C04B35/63 ,  C04B35/634 ,  C04B35/638 ,  C04B35/64 ,  C04B37/02

CPC classification number: C04B37/023 ,  B28B11/0818 ,  C04B35/581 ,  C04B35/587 ,  C04B35/62218 ,  C04B35/6303 ,  C04B35/6342 ,  C04B35/638 ,  C04B35/64 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3865 ,  C04B2235/3878 ,  C04B2235/6025 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6582 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/52 ,  C04B2237/60

Abstract: A method for manufacturing active metal-brazed a nitride ceramics substrate having excellent joining strength, includes: a step of preparing a mixed raw material; a step of forming a green sheet of the mixed raw material by a tape casting method; a step of removing a binder by performing degreasing; a step of performing sintering; a step of forming an aluminum nitride sintered substrate by performing gradual cooling; and a step of printing a conductive wiring pattern with active metal paste on the aluminum nitride sintered substrate.

公开(公告)号：US11958271B2

公开(公告)日：2024-04-16

申请号：US17312701

申请日：2019-12-05

Applicant: TDK Electronics AG

Inventor： Nele Reimer ,  Manfred Schweinzger

IPC: B32B18/00 ,  C04B37/00

CPC classification number: B32B18/00 ,  C04B37/001 ,  C04B2237/343 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368

Abstract: In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

公开(公告)号：US11909004B2

公开(公告)日：2024-02-20

申请号：US18166814

申请日：2023-02-09

Applicant: Ambri Inc.

Inventor： David J. Bradwell ,  Greg A. Thompson ,  Michael J. McNeley

IPC: H01M10/39 ,  B60L53/00 ,  B60L53/53 ,  B60L50/64 ,  H01M50/463 ,  H01M4/134 ,  H01M4/38 ,  H01M10/42 ,  C04B37/02 ,  C04B37/00 ,  H01M50/186 ,  H01M50/191 ,  H01M50/522 ,  H01M50/507 ,  H01M50/138

CPC classification number: H01M10/399 ,  B60L50/64 ,  B60L53/00 ,  B60L53/53 ,  C04B37/006 ,  C04B37/026 ,  H01M4/134 ,  H01M4/38 ,  H01M4/381 ,  H01M10/39 ,  H01M10/425 ,  H01M10/4207 ,  H01M50/186 ,  H01M50/191 ,  H01M50/463 ,  C04B2235/9607 ,  C04B2237/066 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/60 ,  C04B2237/72 ,  C04B2237/82 ,  H01M4/382 ,  H01M4/387 ,  H01M50/138 ,  H01M50/507 ,  H01M50/522 ,  H01M2220/20 ,  Y02T10/70 ,  Y02T10/7072 ,  Y02T90/14

Abstract: Provided herein are energy storage devices. In some cases, the energy storage devices are capable of being transported on a vehicle and storing a large amount of energy. An energy storage device is provided comprising at least one liquid metal electrode, an energy storage capacity of at least about 1 MWh and a response time less than or equal to about 100 milliseconds (ms).

公开(公告)号：US11804383B2

公开(公告)日：2023-10-31

申请号：US18075559

申请日：2022-12-06

Applicant: Infineon Technologies AG

Inventor： Alexander Roth

IPC: H01L21/48 ,  C04B35/645 ,  C04B37/02 ,  H05K3/40 ,  C04B41/00 ,  C04B41/51 ,  C04B41/88 ,  H01L23/15 ,  H01L23/373 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02

CPC classification number: H01L21/486 ,  C04B35/6455 ,  C04B37/021 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  H01L21/4807 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49866 ,  H05K3/4061 ,  C04B2235/606 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  H05K1/0306 ,  H05K3/022

Abstract: A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

公开(公告)号：US20230269879A1

公开(公告)日：2023-08-24

申请号：US18003866

申请日：2021-06-28

Applicant: BYD COMPANY LIMITED

Inventor： Wei ZHOU ,  Qiang XU ,  Caicai XIE

IPC: H05K3/02 ,  H05K3/38 ,  H05K1/03 ,  C04B37/02

CPC classification number: H05K3/022 ,  C04B37/023 ,  H05K1/0306 ,  H05K3/385 ,  C04B2237/122 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/525 ,  C23C22/52 ,  H05K2203/0786 ,  H05K2203/1105

Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

公开(公告)号：US20190202746A1

公开(公告)日：2019-07-04

申请号：US16079562

申请日：2017-02-24

Applicant: KYOCERA Corporation

Inventor： Kiyotaka NAKAMURA ,  Masayuki MORIYAMA

IPC: C04B37/00 ,  B32B18/00

CPC classification number: C04B37/003 ,  B32B18/00 ,  C04B35/581 ,  C04B37/005 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3865 ,  C04B2235/442 ,  C04B2235/95 ,  C04B2235/96 ,  C04B2237/064 ,  C04B2237/366 ,  C04B2237/58 ,  C04B2237/595 ,  C04B2237/708 ,  C04B2237/78 ,  C04B2237/80 ,  C04B2237/88

Abstract: A ceramic bonded body may include a first member, a second member, a joining layer between the first member and the second member, and a covering layer which covers the joining layer and is located over the first member and the second member. The first member and the second member may include aluminum nitride-based ceramic. The joining layer and the covering layer may include at least aluminum, calcium, yttrium, and oxygen where, in 100 mass % of all of the constituents configuring the joining layer and the covering layer, the aluminum is 21 mass % or more converted to oxides, the calcium is 21 mass % or more converted to oxides, and the sum of the aluminum and the calcium converted to oxides is 86 mass % or more. The covering layer has a content of yttrium converted to oxides greater than that of the joining layer.

公开(公告)号：US20190196254A1

公开(公告)日：2019-06-27

申请号：US16091832

申请日：2017-04-07

Applicant: VALEO COMFORT AND DRIVING ASSISTANCE

Inventor： Jean-François BISSON ,  Delphine LE-GUYADER ,  Renan LEON ,  Laurent VIVET

IPC: G02F1/1333 ,  G02B27/01 ,  C01F5/02

CPC classification number: G02F1/133385 ,  C01F5/02 ,  C01P2006/32 ,  C01P2006/60 ,  C04B37/02 ,  C04B37/028 ,  C04B37/04 ,  C04B37/047 ,  C04B2237/34 ,  C04B2237/366 ,  C04B2237/40 ,  C04B2237/704 ,  G02B27/01 ,  G02B27/0149 ,  G02F2001/133302 ,  G02F2001/133331

Abstract: An image generating device comprises a light source producing a light beam and a screen (5) traversed by the light beam and designed to modify the light beam so as to form an image. The screen (5) comprises a transparent element (150) traversed by the light beam and designed to evacuate the heat generated at the level of the screen (5). Said transparent element (150) is made of sintered transparent ceramic. Also described are a head-up display comprising such a device, and a method for manufacturing an image generating device.