公开(公告)号：US20240337006A1

公开(公告)日：2024-10-10

申请号：US18747743

申请日：2024-06-19

申请人： Lam Research Corporation

发明人： Willem Cornelis Lambert Hopman ,  Jan Matthijn Dekkers

IPC分类号： C23C14/06 ,  C04B35/581 ,  C04B35/645 ,  C23C8/24 ,  C23C14/28

CPC分类号： C23C14/0641 ,  C04B35/581 ,  C04B35/645 ,  C23C8/24 ,  C23C14/28 ,  C04B2235/3224

摘要： The invention relates to a method for producing a scandium aluminum nitride (ScAlN) target body for pulsed laser deposition (PLD), which includes the steps of: providing a scandium aluminum alloy body; pulverizing the scandium aluminum alloy body into scandium aluminum particles; nitridizing the scandium aluminum particles into scandium aluminum nitride particles; and hot pressing the scandium aluminum nitride particles into a scandium aluminum nitride target body.

公开(公告)号：US20240177974A1

公开(公告)日：2024-05-30

申请号：US18432159

申请日：2024-02-05

申请人： FERROTEC MATERIAL TECHNOLOGIES CORPORATION

发明人： Wataru YAMAGISHI ,  Kazumasa MORI ,  Hitoshi KOUNO ,  Shunichi ETO

IPC分类号： H01J37/32 ,  C04B35/48 ,  C04B35/581 ,  C04B35/583 ,  C04B35/584 ,  H01L21/683

CPC分类号： H01J37/32477 ,  C04B35/48 ,  C04B35/581 ,  C04B35/583 ,  C04B35/584 ,  H01J37/32715 ,  H01L21/6833 ,  C04B2235/3244 ,  C04B2235/3826 ,  C04B2235/386 ,  C04B2235/3865 ,  C04B2235/3873 ,  C04B2235/94

摘要： A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.

公开(公告)号：US11964919B2

公开(公告)日：2024-04-23

申请号：US17054978

申请日：2019-08-14

申请人： ZONE INFINITY CO., LTD.

发明人： Inchul Cho

IPC分类号： B28B11/08 ,  C04B35/581 ,  C04B35/584 ,  C04B35/587 ,  C04B35/622 ,  C04B35/63 ,  C04B35/634 ,  C04B35/638 ,  C04B35/64 ,  C04B37/02

CPC分类号： C04B37/023 ,  B28B11/0818 ,  C04B35/581 ,  C04B35/587 ,  C04B35/62218 ,  C04B35/6303 ,  C04B35/6342 ,  C04B35/638 ,  C04B35/64 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3865 ,  C04B2235/3878 ,  C04B2235/6025 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6582 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/52 ,  C04B2237/60

摘要： A method for manufacturing active metal-brazed a nitride ceramics substrate having excellent joining strength, includes: a step of preparing a mixed raw material; a step of forming a green sheet of the mixed raw material by a tape casting method; a step of removing a binder by performing degreasing; a step of performing sintering; a step of forming an aluminum nitride sintered substrate by performing gradual cooling; and a step of printing a conductive wiring pattern with active metal paste on the aluminum nitride sintered substrate.

公开(公告)号：US11939267B2

公开(公告)日：2024-03-26

申请号：US17734416

申请日：2022-05-02

申请人： NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY

发明人： Toru Ujihara ,  Yukihisa Takeuchi ,  Daishi Shiojiri ,  Masaki Matsumoto ,  Hiroshi Saito ,  Ikuo Hayashi

IPC分类号： C30B29/38 ,  C04B35/581 ,  C30B29/62

CPC分类号： C04B35/581 ,  C30B29/38 ,  C30B29/62

摘要： A method and apparatus for producing AlN whiskers includes reduced incorporation of metal particles, an AlN whisker body, AlN whiskers, a resin molded body, and a method for producing the resin molded body. The method for producing AlN whiskers includes heating an Al-containing material in a material accommodation unit to thereby generate Al gas; and introducing the Al gas into a reaction chamber through a communication portion while introducing nitrogen gas into the reaction chamber through a gas inlet port, to thereby grow AlN whiskers on the surface of an Al2O3 substrate placed in the reaction chamber.

公开(公告)号：US11884596B2

公开(公告)日：2024-01-30

申请号：US17256114

申请日：2019-06-24

申请人： TOKUYAMA CORPORATION

发明人： Hironobu Fujimoto ,  Tsuyoshi Ikeda

IPC分类号： C04B35/626 ,  C04B35/581 ,  B01D1/18 ,  B01J2/04

CPC分类号： C04B35/62695 ,  C04B35/581 ,  C04B35/62625 ,  B01D1/18 ,  B01J2/04 ,  C04B2235/5436

摘要： The present invention aims to provide a method for producing granules for ceramic production, the method having high productivity and making it possible to obtain a ceramic which, when produced by press molding the granules and firing the resulting press molded product, has physical properties kept from lowering. The present invention is characterized by including: a slurry preparation step of preparing a slurry including a mixture containing a powder of an inorganic compound, a binder, and a solvent; a granulation step of introducing the slurry into a spray drying device to form a granulated substance containing the inorganic compound; an exhaust step of exhausting an atmospheric gas within the spray drying device via a cyclone having a surface made of ceramic; and a step of mixing a fine powder, which has been recovered by the cyclone during the exhaust step, with the granulated substance obtained in the granulation step.

公开(公告)号：US20240007023A1

公开(公告)日：2024-01-04

申请号：US18467882

申请日：2023-09-15

申请人： NGK INSULATORS, LTD.

发明人： Yusuke OGISO

IPC分类号： H02N13/00 ,  C04B35/581 ,  C04B41/00 ,  C04B41/53 ,  B23K26/352

CPC分类号： H02N13/00 ,  C04B35/581 ,  C04B41/0036 ,  C04B41/5346 ,  B23K26/352 ,  C04B2235/3865 ,  C04B2235/3225

摘要： A member for semiconductor manufacturing apparatus of the present invention includes an AlN ceramic substrate with a surface provided with projections for wafer placement. At least part of an area, provided with no projection, of the AlN ceramic substrate has a surface layer region from the surface to a predetermined depth, and a base material region below the surface layer region. The predetermined depth is 5 μm or less. The oxygen content rate of the surface layer region is higher than the oxygen content rate of the base material region.

公开(公告)号：US20230395321A1

公开(公告)日：2023-12-07

申请号：US18235607

申请日：2023-08-18

申请人： Qorvo US, Inc.

发明人： Tarak A. Railkar ,  Deepukumar M. Nair ,  Jeffrey Dekosky

IPC分类号： H01F41/04 ,  B32B18/00 ,  C04B35/581 ,  C04B35/47 ,  C04B35/468 ,  C04B35/10 ,  B22F7/04 ,  C04B41/50 ,  C04B41/87 ,  H01L29/94 ,  B22F1/10

CPC分类号： H01F41/046 ,  B32B18/00 ,  C04B35/581 ,  C04B35/47 ,  C04B35/468 ,  H01F17/0006 ,  B22F7/04 ,  C04B41/5036 ,  C04B41/87 ,  H01L29/945 ,  B22F1/10 ,  C04B35/10

摘要： The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

公开(公告)号：US20230382814A1

公开(公告)日：2023-11-30

申请号：US18232174

申请日：2023-08-09

申请人： Nissan Motor Co., Ltd.

发明人： Yuka Suzuki ,  Yutaka Mabuchi

IPC分类号： C04B38/00 ,  C04B35/48 ,  C04B35/581 ,  C04B38/06 ,  C23C28/04 ,  F02B77/11

CPC分类号： C04B38/0074 ,  C04B35/48 ,  C04B35/581 ,  C04B38/0625 ,  C23C28/042 ,  F02B77/11

摘要： A manufacturing method of a heat shield component includes a mixing step of mixing sol including a ceramic precursor with heat-expandable microspheres having an outer shell formed of thermoplastic resin and encapsulating a foaming agent so as to obtain a mixed solution, a coating step of applying the mixed solution to a substrate to obtain a coated product, and a heating step of heating the coated product to form a base body including a ceramic from the ceramic precursor, and leading the heat-expandable microspheres to foam so as to form a ceramic porous layer including closed pores in the base body. The ceramic porous layer has a porosity in a range of 40% to 70%.

公开(公告)号：US11783998B2

公开(公告)日：2023-10-10

申请号：US16543078

申请日：2019-08-16

申请人： Qorvo US, Inc.

发明人： Tarak A. Railkar ,  Deepukumar M. Nair ,  Jeffrey Dekosky

IPC分类号： H01F41/04 ,  B32B18/00 ,  C04B35/581 ,  C04B35/47 ,  C04B35/468 ,  C04B35/10 ,  B22F7/04 ,  C04B41/50 ,  C04B41/87 ,  H01L29/94 ,  B22F1/10 ,  H01F17/00 ,  H01G4/12 ,  B22F1/054 ,  B05D5/12 ,  B05D7/00 ,  B05D3/02

CPC分类号： H01F41/046 ,  B22F1/10 ,  B22F7/04 ,  B32B18/00 ,  C04B35/10 ,  C04B35/468 ,  C04B35/47 ,  C04B35/581 ,  C04B41/5036 ,  C04B41/87 ,  H01L29/945 ,  B05D3/0254 ,  B05D5/12 ,  B05D7/54 ,  B22F1/054 ,  H01F17/0006 ,  H01G4/12

摘要： The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

公开(公告)号：US20190233334A1

公开(公告)日：2019-08-01

申请号：US16306266

申请日：2017-05-23

申请人： BASF SE

发明人： Bjoern STUHRMANN ,  Wolfgang SCHROF ,  Kris SCHMIDT

IPC分类号： C04B35/14 ,  C04B35/626 ,  C04B35/634 ,  B29C64/124 ,  B33Y10/00 ,  B33Y70/00

CPC分类号： C04B35/14 ,  B29C64/124 ,  B29K2509/02 ,  B33Y10/00 ,  B33Y70/00 ,  C04B35/111 ,  C04B35/26 ,  C04B35/453 ,  C04B35/46 ,  C04B35/486 ,  C04B35/505 ,  C04B35/565 ,  C04B35/58071 ,  C04B35/581 ,  C04B35/584 ,  C04B35/622 ,  C04B35/62625 ,  C04B35/62685 ,  C04B35/632 ,  C04B35/63424 ,  C04B2235/3418 ,  C04B2235/5436 ,  C04B2235/5463 ,  C04B2235/6026 ,  C04B2235/61 ,  G03F7/0037 ,  G03F7/0047 ,  G03F7/029 ,  G03F7/031 ,  G03F7/38

摘要： The present invention relates to a method for the production of a photocurable formulation (F) for the use in an additive manufacturing process. In this method a ceramic dispersion (CD) comprising at least one ceramic material, at least one first acrylate and at least one dispersant is mixed with a solution (S) which comprises at least one second acrylate and at least one photoinitiator to obtain the photocurable formulation (F). The present invention furthermore relates to the photocurable formulation (F) obtainable by the inventive method and to a method for the production of a molding in an additive manufacturing process by curing the photocurable formulation (F). Moreover, the present invention relates to the use of the photocurable formulation (F) in an additive manufacturing process.