Electroadhesion device with voltage control module

    公开(公告)号:US12107519B2

    公开(公告)日:2024-10-01

    申请号:US18080589

    申请日:2022-12-13

    发明人: Denis Koci

    IPC分类号: B25J9/16 H02N13/00

    CPC分类号: H02N13/00

    摘要: Disclosed embodiments include electroadhesion devices for securing smartphones and other consumer devices to target surfaces. In various embodiments, the electroadhesion device may include a digital switch for adjusting the output voltage generated by a voltage converter. The digital switch may enable safe operation of the electroadhesion device by ensuring the output voltage generated by the voltage converter is compatible with the target surface. To determine a compatible output voltage, the electroadhesion device may include one or more sensors that may measure one or more characteristics of the target surface including conductivity, porosity, hardness, smoothness, and the like.

    Electrostatic Chuck Having Extended Lifetime

    公开(公告)号:US20240258940A1

    公开(公告)日:2024-08-01

    申请号:US18103600

    申请日:2023-01-31

    发明人: Mitsutoshi FUKADA

    IPC分类号: H02N13/00 B23Q3/15

    CPC分类号: H02N13/00 B23Q3/15

    摘要: Embodiments of substrate supports for use in process chambers are provided herein. In some embodiments, a substrate support includes: an electrostatic chuck (ESC) having an upper surface and a plurality of mesas extending upward from the upper surface and a plurality of trenches extending downward from the upper surface and into the ESC, wherein the ESC includes a plurality of backside gas openings extending through the ESC and terminating within at least some of the plurality of trenches; and one or more chucking electrodes disposed in the ESC.

    ELECTROSTATIC CHUCK
    6.
    发明公开
    ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号:US20240195332A1

    公开(公告)日:2024-06-13

    申请号:US18552282

    申请日:2022-03-01

    发明人: Kenichi AKABANE

    IPC分类号: H02N13/00 B23Q3/15

    CPC分类号: H02N13/00 B23Q3/15

    摘要: An electrostatic chuck includes a ceramic substrate, a base plate, and an embedded member. The ceramic substrate includes a first surface on which a to-be-treated object is placed, a second surface opposite to the first surface, and a first channel penetrating through the first surface and the second surface. The base plate is bonded to the second surface of the ceramic substrate and includes a through hole at least at a position corresponding to the first channel. The embedded member is located in the through hole and includes a porous body facing the first channel and a second channel communicating with the first channel via the porous body. The first channel and the second channel are located apart from each other in a plane perspective view.