公开(公告)号：US12028000B2

公开(公告)日：2024-07-02

申请号：US18132617

申请日：2023-04-10

Applicant: ASML Netherlands B.V.

Inventor： Jan-Gerard Cornelis Van Der Toorn ,  Jeroen Gertruda Antonius Huinck ,  Han Willem Hendrik Severt ,  Allard Eelco Kooiker ,  Michael Johannes Christiaan Ronde ,  Arno Maria Wellink ,  Shibing Liu ,  Ying Luo ,  Yixiang Wang ,  Chia-Yao Chen ,  Bohang Zhu ,  Jurgen Van Soest

IPC: H02N13/00 ,  G03F7/00

CPC classification number: H02N13/00 ,  G03F7/70708 ,  G03F7/70716

Abstract: Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

公开(公告)号：US11637512B2

公开(公告)日：2023-04-25

申请号：US17351181

申请日：2021-06-17

Applicant: ASML Netherlands B.V.

Inventor： Jan-Gerard Cornelis Van Der Toorn ,  Jeroen Gertruda Antonius Huinck ,  Han Willem Hendrik Severt ,  Allard Eelco Kooiker ,  Michaël Johannes Christiaan Ronde ,  Arno Maria Wellink ,  Shibing Liu ,  Ying Luo ,  Yixiang Wang ,  Chia-Yao Chen ,  Bohang Zhu ,  Jurgen Van Soest

IPC: H02N13/00 ,  G03F7/20

Abstract: Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

公开(公告)号：US12051562B2

公开(公告)日：2024-07-30

申请号：US17753298

申请日：2020-08-25

Applicant: ASML Netherlands B.V.

Inventor： Yixiang Wang ,  Shibing Liu ,  Shanhui Cao ,  Kangsheng Qiu ,  Juying Dou ,  Ying Luo ,  Yinglong Li ,  Qiang Li ,  Ronald Van Der Wilk ,  Jan-Gerard Cornelis Van Der Toorn

IPC: H01J37/20 ,  H01L21/683

CPC classification number: H01J37/20 ,  H01L21/6833 ,  H01J2237/0044

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.