公开(公告)号：US11658252B2

公开(公告)日：2023-05-23

申请号：US17574994

申请日：2022-01-13

申请人： Materion Corporation

发明人： Michael P. Newell ,  Zan Aslett ,  Robert Cuzziere ,  Andrew P. Houde ,  Derrick Brown

IPC分类号： H01L31/0232 ,  H01L31/024 ,  H01L31/18 ,  C03C14/00 ,  C04B37/02 ,  G03B21/20 ,  G03B21/16 ,  H01L33/64 ,  H01L33/50

CPC分类号： H01L31/02327 ,  C03C14/006 ,  C04B37/026 ,  G03B21/16 ,  G03B21/204 ,  H01L31/024 ,  H01L31/18 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/84 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/644

摘要： A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

公开(公告)号：US09931717B2

公开(公告)日：2018-04-03

申请号：US14440736

申请日：2013-10-28

申请人： ENDRESS+HAUSER GMBH+CO. KG ,  FRIEDRICH-SCHILLER-UNIVERSITÄT

发明人： Andreas Rossberg ,  Elke Schmidt ,  Markus Rettenmayr ,  Peter Siegmund

IPC分类号： B23K35/32 ,  C04B37/00 ,  C22C16/00 ,  B23K35/40 ,  B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B32B18/00 ,  G01L9/00

CPC分类号： B23K35/32 ,  B23K1/0008 ,  B23K1/19 ,  B23K1/20 ,  B23K35/325 ,  B23K35/40 ,  B23K2035/408 ,  B32B18/00 ,  C04B37/006 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/592 ,  C04B2237/708 ,  C04B2237/72 ,  C22C16/00 ,  G01L9/0041

摘要： An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 μm, and an average composition CK with a liquidus temperature Tl(CK), wherein the composition CK has a coefficient of thermal expansion α(CK), wherein α(CK)=m·α(K), wherein m≤1.5, especially m≤1.3 and preferably m≤1.2, wherein α(K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition CB with a liquidus temperature Tl(CB), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature Tl(CK) of the average composition CK of the core volume.

公开(公告)号：US20180009043A1

公开(公告)日：2018-01-11

申请号：US15542763

申请日：2015-12-21

申请人： SANDVIK INTELLECTUAL PROPERTY AB

发明人： Emmanuel DAVID ,  Camille SANDALDJIAN

IPC分类号： B23C5/10 ,  C04B37/02 ,  B23C5/00 ,  B23C5/18

CPC分类号： B23C5/10 ,  B23C5/006 ,  B23C5/18 ,  B23C2210/02 ,  B23C2210/03 ,  B23C2222/28 ,  B23C2226/18 ,  B23C2240/08 ,  B23C2240/32 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/76 ,  C04B2237/86

摘要： A milling device is rotatable in one direction around a longitudinal center axis defining a forward direction and an opposite rearward direction, and includes a front part and a rear part. The front part has cutting edges, each having a longitudinal extension, and chip flutes, each having a longitudinal extension. The front part is made of a monolithic piece of ceramic. The rear part is configured to be fixed in a rotatable tool body or a rotatable chuck. The rear part is also made of a monolithic piece of cemented carbide. A front end surface of the rear part has a smaller area than a rear end surface of the front part. The front end surface of the rear part and a rear end surface of the front part are permanently bonded or brazed to each other by a joint.

公开(公告)号：US09579739B2

公开(公告)日：2017-02-28

申请号：US14768041

申请日：2014-02-28

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Tomoya Oohiraki ,  Sotaro Oi ,  Kimihito Nishikawa ,  Hiromasa Hayashi

IPC分类号： B23K31/02 ,  H01L23/48 ,  B23K1/00 ,  C04B35/645 ,  C04B37/02 ,  H01L21/48 ,  H01L23/373 ,  H05K1/02 ,  H05K3/20

CPC分类号： B23K1/0016 ,  B23K31/02 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4882 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K3/202 ,  H05K3/207 ,  H05K2203/04 ,  H05K2203/06 ,  H01L2924/00

摘要： A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

摘要翻译： 一种制造功率模块基板的方法，在通过将铜电路板30之间的陶瓷板21分隔在铜电路板30之间的陶瓷板21上，间隔地连接在具有陶瓷基板的区域的陶瓷板21上， 在陶瓷板21上形成有与铜电路板30的外形相同形状的活性金属钎焊材料的接合材料层71; 包含聚乙二醇作为主要成分的temporal棒材料72扩散在铜电路板30上，接合材料层71和铜电路板30以层压定位的状态临时固定在陶瓷板21上 通过temporal棒材料72; 并且其层压组件在层叠方向上加压并加热，使得陶瓷板和铜电路板接合。

公开(公告)号：US20170034905A1

公开(公告)日：2017-02-02

申请号：US15289453

申请日：2016-10-10

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo ,  Kimihito Nishikawa ,  Yoshirou Kuromitsu

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  G01B15/02 ,  G01N23/203 ,  C04B37/02 ,  B23K35/26 ,  C22C14/00 ,  C22C5/06 ,  C22C30/04 ,  C22C16/00 ,  C22C21/00 ,  C22C27/02 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/32 ,  B23K35/365 ,  H05K1/03

CPC分类号： H05K1/0271 ,  B23K1/0008 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/32 ,  B23K35/36 ,  B23K35/365 ,  B23K2101/42 ,  C04B35/632 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/44 ,  C04B2237/08 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C22C5/06 ,  C22C14/00 ,  C22C16/00 ,  C22C21/00 ,  C22C27/00 ,  C22C27/02 ,  C22C28/00 ,  C22C30/04 ,  C22F1/08 ,  G01B15/02 ,  G01N23/203 ,  G01N2223/633 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/01322 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/18 ,  H05K1/181 ,  H05K3/388 ,  H05K13/0465 ,  H05K2201/0175 ,  Y10T428/12542 ,  H01L2924/00

摘要： This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.

摘要翻译： 该功率模块基板包括由铜或铜合金形成并层叠在陶瓷基板11的表面上的铜板; 形成在陶瓷基板11的铜板与陶瓷基板11之间的表面上的氮化物层31; 以及形成在氮化物层和铜板之间的厚度为15μm以下的Ag-Cu共晶结构层32。

公开(公告)号：US09504144B2

公开(公告)日：2016-11-22

申请号：US14374092

申请日：2013-02-01

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo ,  Kimihito Nishikawa ,  Yoshirou Kuromitsu

IPC分类号： B23K31/02 ,  H05K1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/32 ,  C22C5/06 ,  C22C14/00 ,  C22C16/00 ,  C22C21/00 ,  C22C27/00 ,  C22C27/02 ,  C22C28/00 ,  C22F1/08 ,  H01L23/373 ,  B23K1/00 ,  B23K35/36 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/38 ,  H05K13/04 ,  C04B37/02

CPC分类号： H05K1/0271 ,  B23K1/0008 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/32 ,  B23K35/36 ,  B23K35/365 ,  B23K2101/42 ,  C04B35/632 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/44 ,  C04B2237/08 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C22C5/06 ,  C22C14/00 ,  C22C16/00 ,  C22C21/00 ,  C22C27/00 ,  C22C27/02 ,  C22C28/00 ,  C22C30/04 ,  C22F1/08 ,  G01B15/02 ,  G01N23/203 ,  G01N2223/633 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/01322 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/18 ,  H05K1/181 ,  H05K3/388 ,  H05K13/0465 ,  H05K2201/0175 ,  Y10T428/12542 ,  H01L2924/00

摘要： This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.

摘要翻译： 该功率模块基板包括由铜或铜合金形成并层叠在陶瓷基板11的表面上的铜板; 形成在陶瓷基板11的铜板与陶瓷基板11之间的表面上的氮化物层31; 以及形成在氮化物层和铜板之间的厚度为15μm以下的Ag-Cu共晶结构层32。

公开(公告)号：US20160304405A1

公开(公告)日：2016-10-20

申请号：US15102951

申请日：2014-11-28

申请人： ROGERS GERMANY GMBH

发明人： Andreas Meyer ,  Fabian Hierstetter

IPC分类号： C04B35/645 ,  H01L23/498 ,  H01L21/48 ,  C04B37/02 ,  H01L23/373

CPC分类号： C04B35/6455 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  C04B2237/064 ,  C04B2237/068 ,  C04B2237/08 ,  C04B2237/083 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/592 ,  C04B2237/595 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  C04B2237/84 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/022 ,  H05K3/388 ,  H05K2203/04 ,  H01L2924/00

摘要： The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer. Subsequently, the metal layers forming the metal container with the at least one ceramic layer received in the container interior are hot isostatically pressed together in a treatment chamber at a gas pressure between 500 and 2000 bar and at a process temperature between 300° C. and the melting temperature of the metal layers for producing a preferably flat connection of at least one of the metal layers and the at least one ceramic layer, and at least the projecting free edge sections, which are connected to each other, of the metal layers for forming the first and second metallization are subsequently removed.

摘要翻译： 本发明涉及一种用于制造包括第一和第二金属化的金属陶瓷衬底的方法以及结合在第一和第二金属化之间的至少一个陶瓷层。 有利的是，第一和第二金属层和至少一个陶瓷层被叠置在一起，并且使得第一和第二金属层的自由边缘部分分别突出超过至少一个陶瓷层的边缘，并且 第一和第二金属层在突出的自由边缘部分的区域中彼此变形并且彼此直接连接，以形成封闭容器内部的气密密封的金属容器，用于容纳至少一个陶瓷层 。 随后，形成具有容纳在容器内部中的至少一个陶瓷层的金属容器的金属层在500-2000巴之间的气体压力和在300℃和200℃之间的过程温度下被热等静压在处理室中 金属层的熔融温度，用于产生金属层和至少一个陶瓷层中的至少一个的优选平坦连接，以及至少彼此连接的突出的自由边缘部分，用于 随后除去形成第一和第二金属化。

公开(公告)号：US20160214907A1

公开(公告)日：2016-07-28

申请号：US15005790

申请日：2016-01-25

申请人： Rolls-Royce Corporation ,  Rolls-Royce High Temperature Composites, Inc.

发明人： Sungbo Shim ,  Robert Wesley Thibault ,  Robert Shinavski ,  Kang N. Lee

IPC分类号： C04B41/45 ,  C04B41/50 ,  C04B41/89 ,  C04B41/85 ,  C04B41/81 ,  C04B41/52

CPC分类号： C04B41/89 ,  B33Y10/00 ,  C04B35/573 ,  C04B35/62625 ,  C04B35/62655 ,  C04B35/80 ,  C04B35/806 ,  C04B41/009 ,  C04B41/52 ,  C04B2235/612 ,  C04B2235/616 ,  C04B2235/77 ,  C04B2235/945 ,  C04B2235/95 ,  C04B2237/062 ,  C04B2237/08 ,  C04B2237/083 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/16 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/38 ,  C04B2237/61 ,  C04B35/565 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/4578 ,  C04B41/5059 ,  C04B41/53 ,  C04B41/4523 ,  C04B41/4556 ,  C04B41/4558

摘要： The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.

摘要翻译： 本公开描述了用于使用铸件形成包括CMC的制品的表面层的技术。 在一些实例中，表面层包括三维表面特征，其可增加CMC与CMC上的涂层之间的粘附。 在一些实例中，表面层可以包括在CMC上具有或不具有三维表面特征的多余材料。 可以加工多余的材料以除去一些多余的材料，并且有助于使制品符合尺寸公差，例如将制品装配到另一部件上。 多余的材料可能会降低CMC（例如CMC中的增强材料）被机械加工损坏的可能性。

公开(公告)号：US20160192503A1

公开(公告)日：2016-06-30

申请号：US14911064

申请日：2014-03-12

申请人： HITACHI METALS, LTD.

发明人： Nobuhiko CHIWATA

IPC分类号： H05K3/06 ,  H05K3/38 ,  H05K3/26

CPC分类号： H05K3/067 ,  C04B35/584 ,  C04B37/026 ,  C04B41/91 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/6025 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  H01L21/4846 ,  H01L23/12 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/26 ,  H05K3/38 ,  H05K3/388 ,  H05K2201/0355 ,  H05K2203/0789 ,  H01L2924/00

摘要： A method for producing a ceramic circuit board comprising the steps of bonding a metal sheet to a ceramic substrate via a brazing material containing Ag to form a bonded body; etching the bonded metal sheet to form a circuit pattern; and removing an unnecessary brazing material from the substrate provided with the circuit pattern, by etching with an acidic solution comprising carboxylic acid and/or carboxylate and hydrogen peroxide.

摘要翻译： 一种陶瓷电路板的制造方法，其特征在于，包括：通过含有Ag的钎料将金属板与陶瓷基板接合而形成接合体的工序; 蚀刻接合的金属片以形成电路图案; 并且通过用包含羧酸和/或羧酸盐和过氧化氢的酸性溶液进行蚀刻，从设置有电路图案的基板去除不必要的钎焊材料。

公开(公告)号：US20160013073A1

公开(公告)日：2016-01-14

申请号：US14775819

申请日：2014-03-17

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki TERASAKI ,  Yoshiyuki NAGATOMO

IPC分类号： H01L21/48

CPC分类号： H01L21/4853 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/127 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225

摘要： A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

摘要翻译： 电源模块用基板的制造方法包括：层叠步骤，通过活性金属材料和熔点为710℃以下的填充金属层叠陶瓷构件和铜构件;以及加热处理工序， 陶瓷构件和铜构件层叠在一起。