摘要:
A method of producing a neutron absorbing plate constructed of a boron carbide aluminum matrix composite material is disclosed. The method includes mixing a 30-50 micron average particle size B4C powder with an aqueous organic binder component to form a slurry; then drying the slurry at a temperature from about 20 to about 90 degrees Celsius until a dried cake comprising 1-20 percent organic binder of the total weight of said dry cake is formed; then granulating said dried cake to yield a granule size from about 0.5 mm to about 3 mm; then compressing said granules under pressure to create a particulate preform having an interior open porosity; and finally infiltrating the preform under pressure with a liquid metal, to form a metal matrix composite with uniform B4C particle loading.
摘要:
A shock absorbing member 50 having a ceramic bonded body 15 having: a plurality of first sheet-like members 5 each having a ceramic containing 60 mass % or more of boron carbide and each having a thickness of 0.1 to 50 mm; and a bonding layer arranged between the first sheet-like members 5 adjacent to each other, the bonding layer bonding surfaces to be bonded facing each other of the first sheet-like members adjacent to each other, wherein the bonding layer has a bonding material containing at least one metal selected from the group consisting of aluminum, copper, silver, and gold.
摘要:
In a power-module substrate unit, a circuit layer is structured by a plurality of small circuit layers; a ceramic substrate layer is structured by at least one plate; the small circuit layers are formed to have a layered structure having a first aluminum layer bonded on one surface of the ceramic substrate layer and a first copper layer bonded on the first aluminum layer by solid diffusion; a radiation plate is made of copper or copper alloy; the metal layer and the radiation plate are bonded by solid diffusion.
摘要:
A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.
摘要:
A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.
摘要:
A method including applying layers of multiple constituents where the constituents are capable of producing a non-equilibrium condition on the contacting surfaces of a ceramic matrix composite component and a gas turbine engine component where one outer coating includes a first constituent and the other outer coating includes a second constituent; forming a component assembly with the ceramic matrix composite component coupled to the gas turbine engine component with contact between the outer coatings; adding an energy to facilitate an equilibrium reaction between the first constituent of the first outer coating and the second constituent of the second outer coating; and as a result of adding the energy, forming a bond structure in the component assembly with a product of the equilibrium reaction where the bond structure affixes the ceramic matrix composite component to the gas turbine engine component between the first constituent and the second constituent.
摘要:
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.
摘要:
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu—P—Sn-based brazing filler material and a Ti material, wherein a Cu—Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and an intermetallic compound layer which is positioned between the Cu member and the Cu—Sn layer and contains P and Ti, are formed at a bonded interface between the ceramic member and the Cu member.
摘要:
In a step (a), a ceramic substrate 12, a brazing material 56including a metal having a large thermal expansion coefficient, a porous body 54 having a smaller thermal expansion coefficient than the brazing material 56, and a feeding terminal 40 are placed on a joint surface 13 in such a way that a joint surface 43 of the feeding terminal 40 faces a joint surface 13 of the ceramic substrate 12. In a step (b), the brazing material 56 is fused to allow the brazing material 56 to penetrate into, the pores of the porous body 54. In this manner, a joint layer containing the brazing material 56 and the porous body 54 is formed, and the joint surface 13 of the ceramic substrate 12 and the joint stir face 43 of the feeding terminal 40 are joined to each other through the joint layer.
摘要:
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.