-
公开(公告)号：US20240306290A1
公开(公告)日：2024-09-12
申请号：US18663314
申请日：2024-05-14
发明人： Raymond P. Johnston , Kevin W. Gotrik , John J. Sullivan , Kenneth A.P. Meyer , Joseph C. Carls , Haiyan Zhang , Gregory L. Abraham , Matthew S. Stay
CPC分类号： H05K1/0296 , H01Q1/38 , H05K1/0353 , H05K3/0014 , H05K3/103 , H05K3/207 , H05K3/244 , H05K3/4644 , H05K2201/09118 , H05K2203/0108 , H05K2203/0152 , H05K2203/0156 , H05K2203/0723
摘要： A patterned conductive article includes a substrate having a first groove therein; a conductive seed layer disposed in the first groove; and a unitary conductive body disposed at least partially in the first groove. The conductive seed layer covers at least a majority of a bottom surface of the first groove, and the unitary conductive body covers the conductive seed layer and at least a majority of side surfaces of the first groove. In a plane through the unitary conductive body that is parallel to and separate from the conductive seed layer, the unitary conductive body has a lower first line edge roughness at a first interface with the side surfaces and the conductive seed layer has a higher second line edge roughness at an edge of the conductive seed layer.
-
公开(公告)号：US12089344B2
公开(公告)日：2024-09-10
申请号：US17642865
申请日：2020-09-23
申请人： Canatu Oy
发明人： Ilkka Varjos
IPC分类号： B32B7/12 , B32B27/08 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/36 , B32B37/10 , B32B38/00 , G06F3/041 , H05K1/02 , H05K1/03 , H05K3/20 , H05K3/22 , B32B27/38 , B32B27/40
CPC分类号： H05K3/22 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/325 , B32B27/36 , B32B27/365 , B32B37/1018 , B32B38/0004 , B32B38/145 , G06F3/041 , H05K1/0298 , H05K1/0313 , H05K3/20 , B32B27/38 , B32B27/40 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/20 , B32B2270/00 , B32B2307/412 , B32B2309/02 , B32B2323/04 , B32B2323/10 , B32B2327/06 , B32B2333/12 , B32B2367/00 , B32B2369/00 , B32B2379/08 , B32B2457/00 , G06F2203/04103 , H05K2203/1105 , H05K2203/1121
摘要： A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.
-
公开(公告)号：US12063749B2
公开(公告)日：2024-08-13
申请号：US17264957
申请日：2020-05-27
发明人： Fan Li , Jiangbo Chen
CPC分类号： H05K3/20 , H05K1/09 , H05K1/118 , H05K3/0058 , A61B5/263 , A61B2562/125 , A61N1/04 , H05K1/0346 , H05K3/002 , H05K2201/0154 , H05K2201/0323 , H05K2201/0367 , H05K2203/0147
摘要： The present application provides a method for manufacturing a microelectrode film. The method includes: forming at least one recess on the carrier substrate by isotropic etching; forming a microelectrode seed pattern in the recess; growing a microelectrode in the recess by using the microelectrode seed pattern; making a first substrate to be in contact with a side of the carrier substrate having the recess thereon; separating the microelectrode from the carrier substrate to transfer the microelectrode onto the first substrate.
-
公开(公告)号：US12035459B2
公开(公告)日：2024-07-09
申请号：US18521587
申请日：2023-11-28
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Parker Brown , Dongao Yang , Michael Lawrence Miller , Paul Henry Lego
CPC分类号： H05K1/0201 , H01M50/519 , H05K1/118 , H05K3/007 , H05K3/0073 , H05K3/06 , H05K3/20 , H05K3/281 , H05K3/4623 , H05K3/064 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2201/10037 , H05K2203/066 , Y02E60/10 , Y10T29/49156
摘要： A method of forming a flexible interconnect circuit is described. The method may comprise laminating a substrate to a conductive layer and patterning the conductive layer using a laser while the conductive layer remains laminated to the substrate thereby forming a first conductive portion and a second conductive portion of the conductive layer. The substrate maintains the orientation of the first conductive portion relative to the second conductive portion during and after patterning. The method may also comprise laminating a first insulator to the conductive layer and removing the substrate from the conductive layer such that the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed. The method may also comprise laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the substrate.
-
公开(公告)号：US20240155774A1
公开(公告)日：2024-05-09
申请号：US18549826
申请日：2022-03-16
发明人： Takayoshi NIRENGI , Akihiro OISHI , Tsutomu AISAKA , Daisuke MATSUSHITA , Jumpei IWANAGA , Tadashi TOJO
CPC分类号： H05K3/20 , C23C18/38 , H01L21/4846 , H05K3/108 , H05K3/18 , H05K2203/072 , H05K2203/0723
摘要： A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer on the base; an insulating layer covering the base with an opening above the plating base material layer; and a projecting structure formed on the insulating layer for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.
-
公开(公告)号：US20230292445A1
公开(公告)日：2023-09-14
申请号：US18198791
申请日：2023-05-17
IPC分类号： H05K3/20 , H05K3/38 , B41M1/12 , H01L31/0224 , H05K3/34 , H05K1/03 , H05K1/09 , H01L31/0216 , H01L31/0392 , H01L31/20
CPC分类号： H05K3/207 , B41M1/12 , H01L31/02167 , H01L31/022425 , H01L31/022433 , H01L31/03926 , H01L31/206 , H05K1/0393 , H05K1/092 , H05K3/3485 , H05K3/386 , H05K1/165 , H05K2201/0338 , H05K2201/10098 , H05K2203/0139 , H05K2203/1131 , H05K2203/1545
摘要： A method for applying an electrical conductor to an electrically insulating substrate, the method comprising providing a flexible membrane with a pattern of grooves formed on a first surface thereof, and loading the grooves with a composition comprising particles of a conductive material. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back surface of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded into the grooves adheres to the substrate. The membrane(s) may remain on the electrically insulating substrate. The electrically conductive particles in the composition can then be sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).
-
公开(公告)号：US11751336B2
公开(公告)日：2023-09-05
申请号：US17994551
申请日：2022-11-28
IPC分类号： H05K3/20 , H05K3/38 , B41M1/12 , H01L31/0224 , H05K3/34 , H05K1/03 , H05K1/09 , H01L31/0216 , H01L31/0392 , H01L31/20 , H05K1/16
CPC分类号： H05K3/207 , B41M1/12 , H01L31/02167 , H01L31/022425 , H01L31/022433 , H01L31/03926 , H01L31/206 , H05K1/0393 , H05K1/092 , H05K3/3485 , H05K3/386 , H05K1/165 , H05K2201/0195 , H05K2201/035 , H05K2201/0338 , H05K2201/0391 , H05K2201/10098 , H05K2203/0139 , H05K2203/1105 , H05K2203/1131 , H05K2203/1476 , H05K2203/1545 , Y02E10/50
摘要： An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises:
respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another,
a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated,
a cooling station for cooling the web after passage through the nip, and
a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.-
公开(公告)号：US11729904B2
公开(公告)日：2023-08-15
申请号：US16866153
申请日：2020-05-04
发明人： Eric J. Markvicka , Michael D. Bartlett , Carmel Majidi , Lining Yao , Guanyun Wang , Yi-Chin Lee , Gierad Laput
CPC分类号： H05K1/0283 , H05K1/038 , H05K1/0393 , H05K3/0026 , H05K3/20 , H05K2203/167
摘要： An efficient fabrication technique, including an optional design step, is used to create highly customizable wearable electronics. The method of fabrication utilizes rapid laser machining and adhesion-controlled soft materials. The method produces well-aligned, multi-layered materials created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.
-
公开(公告)号：US11716818B2
公开(公告)日：2023-08-01
申请号：US17569926
申请日：2022-01-06
申请人： LG CHEM, LTD.
发明人： Yong Goo Son , Kun Seok Lee , Jung Ok Moon , Kiseok Lee , Seung Heon Lee
CPC分类号： H05K3/386 , H05K1/0274 , H05K3/389 , H05K3/067 , H05K2203/1453
摘要： A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.
-
10.发明公开公开(公告)号：US20230234333A1
公开(公告)日：2023-07-27
申请号：US17926362
申请日：2021-06-08
CPC分类号： B32B7/12 , C09J9/02 , C09J7/38 , B32B27/18 , H05K3/20 , H05K1/09 , B32B2307/7376 , B32B2457/08 , B32B27/281
摘要： Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.
-
-
-
-
-
-
-
-
-
搜索结果
1842 条记录 (耗时 0.024 秒)
