公开(公告)号：US12048119B2

公开(公告)日：2024-07-23

申请号：US17685388

申请日：2022-03-03

申请人： AMULAIRE THERMAL TECHNOLOGY, INC.

发明人： Chi-An Chen ,  Tze-Yang Yeh

IPC分类号： H05K7/20 ,  F28F3/02 ,  F28F21/04 ,  F28F21/08

CPC分类号： H05K7/203 ,  F28F3/022 ,  F28F21/04 ,  F28F21/084 ,  H05K7/20409

摘要： An immersion-type liquid cooling heat dissipation sink is provided. The immersion-type liquid cooling heat dissipation sink includes a heat dissipation substrate layer and a surface film layer. The surface film layer is formed on the heat dissipation substrate layer. The heat dissipation substrate layer is a porous substrate that is immersed in an immersion-type coolant. A contact angle between the surface film layer and the immersion-type coolant is less than a contact angle between the heat dissipation substrate layer and the immersion-type coolant. A thickness of the surface film layer is less than an effective thickness of 5 μm.

公开(公告)号：US20230384044A1

公开(公告)日：2023-11-30

申请号：US17825690

申请日：2022-05-26

申请人： Hamilton Sundstrand Corporation

发明人： John Joseph Gangloff ,  Paul Sheedy ,  Justin B. Alms ,  Kathryn L. Kirsch ,  Thomas M. Yun ,  Daniel A. Mosher ,  John E. Holowczak ,  Ram Ranjan

IPC分类号： F28F21/04 ,  C03B19/06 ,  C03B19/02 ,  C03C14/00

CPC分类号： F28F21/04 ,  C03B19/063 ,  C03B19/025 ,  C03C14/002 ,  C03C2214/20 ,  C03C2214/02 ,  C03C2214/34 ,  C03C2214/30

摘要： A method of manufacturing a heat exchanger core from glass ceramic matrix composite includes placing one or more reinforcing fibers around one or more mandrels into a mold cavity. A glass matrix material infiltrates the one or more reinforcing fibers to produce an infiltrated core and the one or more mandrels is removed to create one or more passages passing through the infiltrated core.

公开(公告)号：US20230221083A1

公开(公告)日：2023-07-13

申请号：US18153782

申请日：2023-01-12

申请人： Maxwell Labs Inc

发明人： Jacob A. Balma

IPC分类号： F28F3/04 ,  F28F3/08 ,  H01S5/125 ,  H01S5/024 ,  F28F21/04

CPC分类号： F28F3/04 ,  F28F3/08 ,  F28F21/04 ,  H01S5/125 ,  H01S5/02438 ,  H05K7/20481

摘要： A radiative heatsink includes a cold plate, a radiator mounted to the cold plate and a thermal compound located between and coupling the heat source to the cold plate. The thermal compound converts a portion of a first phononic thermal energy from the heat source into a first photonic near-field and a first photonic far-field thermal radiation and transfers the first photonic near-field, the first photonic far-field and the remaining of the first phononic thermal energy to the cold plate. The cold plate combines the first photonic near-field, the first photonic far-field and the remaining first phononic thermal energy into a second phononic thermal energy and provides the second phononic thermal energy to the radiator. The radiator converts the second phononic thermal energy into a second photonic near-field and a second photonic far-field and emits the second photonic near-field or the second photonic far-field such that cold plate is regenerated.

公开(公告)号：US11591950B2

公开(公告)日：2023-02-28

申请号：US16418227

申请日：2019-05-21

申请人： NGK INSULATORS, LTD.

发明人： Tatsuo Kawaguchi ,  Takeshi Sakuma ,  Daisuke Kimura ,  Yutaro Fumoto

IPC分类号： F01P3/14 ,  F28D7/16 ,  F28F19/01 ,  F28F1/40 ,  F28D7/10 ,  F28F21/04

摘要： A heat exchanging member including a hollow pillar shaped honeycomb structure having partition walls defining cells, the cells penetrating from a first end face to a second end face to form flow paths for a first fluid, an inner peripheral wall, and an outer peripheral wall; and a covering member being configured to cover the outer peripheral wall of the pillar shaped honeycomb structure. The heat exchanging member is configured to perform heat exchange between the first fluid and a second fluid flowing through an outer side of the covering member. In the heat exchanging member, in a cross section of the pillar shaped honeycomb structure perpendicular to a flow path direction of the first fluid, the cells are radially provided, and each of the inner peripheral wall and the outer peripheral wall has a thickness larger than that of each of the partition walls.

公开(公告)号：US20230052246A1

公开(公告)日：2023-02-16

申请号：US17887412

申请日：2022-08-12

申请人： CENTRAL SOUTH UNIVERSITY

发明人： Qiuping WEI ,  Kechao ZHOU ,  Li MA ,  Xi WANG

IPC分类号： F28D15/04 ,  F28F21/08 ,  F28F21/04 ,  B22F7/06

摘要： A composite VC heat sink containing a copper/diamond composite wick structure and a method for preparing the same are provided. The VC heat sink includes a lower shell plate. The lower shell plate is provided with a recess at a center position of an inner surface and provided with a boss with a same plane size as the recess at a center position of an outer surface, and a surface of the boss or a surface of the recess is provided with a copper/diamond composite plate. The copper/diamond composite wick structure has a three-dimensional porous structure and uses a copper/diamond sintered body as a matrix, a surface of the matrix is provided with a diamond layer, and a surface of the diamond layer is provided with a metal hydrophilic layer. The heat dissipation performance of the composite VC heat sink is maximized under the cooperation of structure and materials.

公开(公告)号：US20220390180A1

公开(公告)日：2022-12-08

申请号：US17821239

申请日：2022-08-22

申请人： NGK Insulators, Ltd.

发明人： Shuhei KUNO ,  Satoshi NAGAMOTO

IPC分类号： F28D7/10 ,  F28F21/04 ,  F28F1/40

摘要： A heat exchange member including: a honeycomb structure body including: partition walls extending from a first end surface to a second end surface to define cells forming flow passages for a first fluid; and an outer peripheral wall; and a covering member configured to cover the outer peripheral wall of the honeycomb structure body. The partition walls and the outer peripheral wall contain ceramic as a main component, and the outer peripheral wall surface has a peak count RPc according to JIS B 0601:2013 set to 55 pks/cm or larger.

公开(公告)号：US11508641B2

公开(公告)日：2022-11-22

申请号：US16265513

申请日：2019-02-01

申请人： Toyota Motor Engineering & Manufacturing North America, Inc.

发明人： Michael Paul Rowe

IPC分类号： B22F7/02 ,  H01L23/373 ,  B22F7/00 ,  B22F3/24 ,  H01L21/48 ,  F28F21/04 ,  F28F21/08 ,  H05K3/00

摘要： A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

公开(公告)号：US11466937B2

公开(公告)日：2022-10-11

申请号：US16215645

申请日：2018-12-11

申请人： ASIA VITAL COMPONENTS CO., LTD.

发明人： Kuei-Feng Chiang

IPC分类号： F28D15/04 ,  H05K7/20 ,  C25D1/00 ,  C23C18/31 ,  F28D15/02 ,  C25D7/00 ,  C23C24/08 ,  H01L23/427 ,  B23P15/26 ,  F28D15/06 ,  F28F21/04 ,  H01L23/373 ,  F28F21/08

摘要： A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

公开(公告)号：US20220055153A1

公开(公告)日：2022-02-24

申请号：US17521170

申请日：2021-11-08

申请人： The Research Foundation for The State University of New York

发明人： Scott N. Schiffres ,  Arad Azizi

IPC分类号： B23K26/342 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/283 ,  H01L23/367 ,  H01L23/373 ,  B33Y80/00 ,  F28F21/02 ,  B32B7/12 ,  F28D15/00 ,  B32B15/01 ,  F28F21/00 ,  F28F21/04 ,  F28F21/08

摘要： A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

公开(公告)号：US11137217B2

公开(公告)日：2021-10-05

申请号：US16091288

申请日：2017-04-05

申请人： Arvos Ljungstrom LLC

发明人： Jeffrey O'Boyle

IPC分类号： F28D19/04 ,  F28D17/02 ,  F28F21/04

摘要： A rotor for a high temperature rotary pre-heater includes a hub that has an exterior surface thereon. The rotor includes an annular rim positioned around and coaxially with the hub. The annular rim has an interior surface. A plurality of partitions extend between the hub and the annular rim. Each of the partitions is located in a predetermined circumferential position by one or more alignment features. The exterior surface, the interior surface and/or the partitions have one or more of the alignment features thereon.