公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC分类号： H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US20240123555A1

公开(公告)日：2024-04-18

申请号：US18377543

申请日：2023-10-06

申请人： Hobart Brothers LLC

发明人： Jon Eric Snyder ,  Joseph Clark Bundy ,  Jake Bradley Zwayer

IPC分类号： B23K35/40 ,  B23K35/02 ,  B23K35/365

CPC分类号： B23K35/404 ,  B23K35/0261 ,  B23K35/365

摘要： The present disclosure is generally directed to a high temperature lubricant for use in a preheated welding wire system. The lubricant may comprise one or more high melting point materials in a concentration from 0.5 to 30 wt % by weight of the lubricant. The high melting point materials may comprise graphite, molybdenum disulfide, tungsten disulfide, or boron nitride. The lubricant is configured to remain on a welding wire electrode that has been coated with the lubricant without melting when a preheater heats the welding wire electrode to an elevated temperature (e.g., between 500 and 900 degrees Celsius). The lubricant may be a powder or a liquid. When the lubricant is a liquid, it may further comprise a solvent such as 2-proponal or water.

公开(公告)号：US20230398645A1

公开(公告)日：2023-12-14

申请号：US18169204

申请日：2023-02-14

申请人： ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINERRING CO., LTD.

发明人： Weimin LONG ,  Guanxing ZHANG ,  Yong LI ,  Yongtao JIU ,  Yinyin PEI ,  Junlan HUANG ,  Hongwei DONG ,  Hangyan XUE

IPC分类号： B23K35/365 ,  B23K35/30 ,  B23K35/36 ,  B23K35/40

CPC分类号： B23K35/365 ,  B23K35/3033 ,  B23K35/3607 ,  B23K35/404 ,  B23K35/3602 ,  B23K35/3601

摘要： A braze coating material with a nickel core and a coating, a preparation method thereof, and a braze coating method are provided. The braze coating material with a nickel core and a coating requires no binder and has strong adhesion ability, and includes the nickel core, a coating layer, a hardened layer, and a protective layer sequentially from inside to outside. The nickel core is metallic nickel having a surface subjected to a roughening treatment. The coating layer is a first brazing flux layer including hard particles, a first brazing flux, and a brazing filler metal powder. The hardened layer contains a second brazing flux and is covered with the protective layer mainly composed of a silicate.

公开(公告)号：US20230373038A1

公开(公告)日：2023-11-23

申请号：US18031264

申请日：2020-08-21

申请人： VERDICIO SOLUTIONS A.I.E.

发明人： Alvaro MANJON FERNANDEZ ,  Sivasambu BOHM ,  Marcos PEREZ RODRIGUEZ ,  Roberto SUAREZ SANCHEZ

IPC分类号： B23K35/365 ,  B23K9/02

CPC分类号： B23K35/365 ,  B23K9/0213

摘要： A method for the manufacture of a welded joint have the following successive steps: I. the provision of at least two metallic substrates wherein at least one metallic substrate is a steel substrate having a thickness of at least 50 mm and being delimited by at least one sidewall, wherein said sidewall is at least partially coated with a pre-coating having a titanate and a nanoparticulate oxide selected from the group consisting of TiO2, SiO2, ZrO2, Y2O3, Al2O3, MoO3, CrO3, CeO2, La2O3 and mixtures thereof, and II. the welding of the at least two metallic substrates along the at least partially coated sidewall by narrow gap welding.

公开(公告)号：US11825612B2

公开(公告)日：2023-11-21

申请号：US16615551

申请日：2017-10-02

申请人： KOKI Company Limited

发明人： Mitsuyasu Furusawa

IPC分类号： B23K35/365 ,  H05K3/34 ,  B23K35/36

CPC分类号： H05K3/3485 ,  B23K35/365 ,  B23K35/3618

摘要： A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

公开(公告)号：US20220251711A1

公开(公告)日：2022-08-11

申请号：US17603373

申请日：2020-04-16

申请人： ArcelorMittal

发明人： Marcos PEREZ RODRIGUEZ ,  Alvaro MANJON FERNANDEZ ,  Miguel PEREZ PIQUERAS ,  José LOPEZ FRESNO ,  Sivasambu BOHM

IPC分类号： C23C28/00 ,  B23K26/18 ,  B23K26/60 ,  B23K35/365 ,  C23C26/02 ,  B23K26/12

摘要： A pre-coated metallic substrate wherein a bare metallic substrate having a reflectance higher or equal to 60% at all wavelengths between 0.5 and 5.0 μm is coated with a pre-coating including at least one titanate and at least one nanoparticle; a method for the manufacture of this pre-coated metallic substrate; a method for the manufacture of a coated metallic substrate and a coated metallic substrate.

公开(公告)号：US10786876B2

公开(公告)日：2020-09-29

申请号：US15962899

申请日：2018-04-25

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Teppei Kojio ,  Koji Motomura ,  Hiroki Maruo

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L23/48 ,  B23K35/36 ,  H01L23/00 ,  B23K35/365 ,  B23K35/362 ,  H01L23/31

摘要： The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

公开(公告)号：US10688603B2

公开(公告)日：2020-06-23

申请号：US16304099

申请日：2017-12-27

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Motohiro Onitsuka ,  Yoko Kurasawa ,  Toshihisa Kugi ,  Hiroyoshi Kawasaki

IPC分类号： B23K35/36 ,  B23K35/362 ,  B23K35/02 ,  B23K35/26 ,  B23K35/365 ,  B23K35/368 ,  B23K35/40

摘要： A flux for a resin flux cored solder or a flux coated solder, in which scattering of flux and solder in using the solder is suppressed, and a resin flux cored solder or a flux coated solder including such a flux are provided. The flux for a resin flux cored solder can include a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.

公开(公告)号：US20200187363A1

公开(公告)日：2020-06-11

申请号：US16615551

申请日：2017-10-02

申请人： KOKI COMPANY LIMITED

发明人： Mitsuyasu FURUSAWA

IPC分类号： H05K3/34 ,  B23K35/365 ,  B23K35/36

摘要： A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

公开(公告)号：US10375825B2

公开(公告)日：2019-08-06

申请号：US15289453

申请日：2016-10-10

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo ,  Kimihito Nishikawa ,  Yoshirou Kuromitsu

IPC分类号： H05K1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/32 ,  C22C5/06 ,  C22C14/00 ,  C22C16/00 ,  C22C21/00 ,  C22C27/00 ,  C22C27/02 ,  C22C28/00 ,  C22F1/08 ,  H01L23/373 ,  B23K1/00 ,  B23K35/36 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/38 ,  H05K13/04 ,  C04B37/02 ,  C04B35/632 ,  B23K35/26 ,  B23K35/365 ,  C22C30/04 ,  G01B15/02 ,  G01N23/203 ,  B23K101/42

摘要： This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.