公开(公告)号：US12220770B2

公开(公告)日：2025-02-11

申请号：US17783709

申请日：2020-12-10

Applicant: POSCO

Inventor： Jae-Yik Lee

IPC: B32B3/00 ,  B21D1/00 ,  B21D1/02 ,  B23K9/04 ,  B23K9/235 ,  B23K26/00 ,  B23K26/34 ,  B23K26/60 ,  B23K31/00 ,  B23K33/00 ,  B32B3/02 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/26 ,  B32B3/30 ,  B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  B23K101/18 ,  B23K101/28 ,  B23K103/04

Abstract: The present disclosure provides a pre-stressed steel sheet comprising: a base material; and a plurality of weld lines formed on the base materials, wherein the average spacing between each pair of the weld lines is equal to or greater than five times the width of the weld lines and equal to or less than half the width of the steel sheet.

公开(公告)号：US12212091B2

公开(公告)日：2025-01-28

申请号：US17802723

申请日：2021-03-04

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Takuya Yamashita ,  Tatsuo Hirabayashi

IPC: H01R13/504 ,  B23K26/50 ,  B23K26/57 ,  B29C65/16 ,  H01R12/55 ,  H01R12/72 ,  H01R13/40 ,  H01R13/405 ,  H01R13/52 ,  H01R43/02 ,  H01R43/24 ,  B23K26/00 ,  B23K26/60 ,  B29C65/00 ,  B29C65/02 ,  B29C65/14 ,  H01R12/50 ,  H01R12/51 ,  H01R12/57 ,  H01R12/58 ,  H01R12/71 ,  H01R13/50 ,  H01R13/502 ,  H01R43/00 ,  H01R43/20

Abstract: Provided is a connector apparatus including: a circuit board; a connector; and a mold resin portion, wherein the circuit board includes a conductor path, the connector includes a housing with a cylindrical shape and made of a resin, and a terminal projecting outward in an axial direction of the housing from inside the housing, the terminal being configured to connect to the conductor path, the mold resin portion collectively covers the circuit board, the terminal located outside the housing, and a portion of the housing; the housing and the mold resin portion include a welded portion formed by welding together constituent materials of the housing and the mold resin portion, and the welded portion is provided around an entire periphery of the housing and has a difference between a maximum width and a minimum width along a circumferential direction of the housing of 30% or less of the maximum width.

公开(公告)号：US20240383073A1

公开(公告)日：2024-11-21

申请号：US17631772

申请日：2021-01-18

Applicant: BEIJING UNIVERSITY OF TECHNOLOGY

Inventor： SHIKAI WU ,  ENYU QI ,  XUJIAN CUI ,  JUNCHONG ZHANG ,  WENBIN QIN

IPC: B23K26/211 ,  B23K26/10 ,  B23K26/14 ,  B23K26/60 ,  B23K101/18 ,  B23K103/10

Abstract: An oscillating laser welding with filler wires for jointing aluminum alloy sheets with a large gap therebetween, including the following steps: providing two aluminum alloy sheets first, and reserving a gap (2) and keeping the gap with a constant width between opposite surfaces of the two aluminum alloy sheets to be jointed; providing a laser welding head (1), a wire feeding nozzle (3), and a protective gas nozzle (4) above the gap; presetting a welding start guiding plate (5) at a welding starting end of the gap, forming a molten pool on the welding start guiding plate by a laser beam, and guiding the molten pool to the welding starting end of the gap; and enabling the wire feeding nozzle and the laser welding head to correspond to the gap and travel in the same direction. The aluminum alloy welding wires fill the whole gap after being heated and molten by the laser beam, and the welding of the two aluminum alloy sheets is completed. The melting amount of the aluminum alloy sheets by the laser beam can be reduced as much as possible, so that a dilution rate of a welding joint and generation of a metallurgical reaction brittle phase can be reduced, and the porosity of the joint can further be reduced. Welding of conventional aluminum alloys, aluminum matrix composite materials, and additive-manufactured aluminum alloy sheets can be realized.

公开(公告)号：US20240217034A1

公开(公告)日：2024-07-04

申请号：US18395202

申请日：2023-12-22

Applicant: ESS TECH, INC.

Inventor： Nathan Imholt ,  Brady Thompson

IPC: B23K26/362 ,  B23K26/352 ,  B23K26/60 ,  B23K26/70 ,  H01M8/026 ,  H01M8/18

CPC classification number: B23K26/362 ,  B23K26/3584 ,  B23K26/60 ,  B23K26/703 ,  H01M8/026 ,  H01M8/188

Abstract: Systems and methods are provided for surface pretreatment of a bipolar plate for a battery system. In one example, a method for pretreating the bipolar plate includes extruding a material of the bipolar plate and irradiating a surface of the bipolar plate with a laser beam to etch a pattern into the surface. The method may further includes assembling the bipolar plate into a power module of the battery system.

公开(公告)号：US11945503B2

公开(公告)日：2024-04-02

申请号：US16766725

申请日：2018-11-26

Applicant: ArcelorMittal

Inventor： Cristian Alvarez ,  Thierry Lizon ,  Maria Poirier

IPC: B23K26/60 ,  B21D22/02 ,  B23K26/00 ,  B23K26/24 ,  B23K33/00 ,  B23K35/24 ,  B23K35/38 ,  B62D21/15 ,  B62D27/02 ,  C21D6/00 ,  C21D9/50 ,  C22C19/05 ,  C22C30/02 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/38 ,  B23K101/00 ,  B23K101/18

CPC classification number: B62D21/15 ,  B21D22/022 ,  B23K26/0006 ,  B23K26/24 ,  B23K26/60 ,  B23K33/00 ,  B23K35/24 ,  B23K35/383 ,  B62D27/02 ,  C21D6/002 ,  C21D6/005 ,  C21D6/008 ,  C21D9/505 ,  C22C19/057 ,  C22C30/02 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/38 ,  B23K2101/006 ,  B23K2101/185

Abstract: A method for producing a welded blank (1) includes providing two precoated sheets (2), butt welding the precoated sheets (2) using a filler wire. The precoating (5) entirely covers at least one face (4) of each sheet (2) at the time of butt welding. The filler wire (20) has a carbon content between 0.01 wt. % and 0.45 wt. %. The composition of the filler wire (20) and the proportion of filler wire (20) added to the weld pool is chosen such that the weld joint (22) has (a) a quenching factor FTWJ: FTWJ−0.9FTBM≥0, where FTBM is a quenching factor of the least hardenable substrate (3), and FTWJ and FTBM are determined: FT=128+1553×C+55×Mn+267×Si+49×Ni+5×Cr−79×Al−2×Ni2−1532×C2−5×Mn2−127×Si2−40×C×Ni−4×Ni×Mn, and (b) a carbon content CWJ 5000, where FA=10291+4384.1×Mo+3676.9Si−522.64×Al−2221.2×Cr−118.11×Ni−1565.1×C−246.67×Mn.

公开(公告)号：US20240042556A1

公开(公告)日：2024-02-08

申请号：US18381388

申请日：2023-10-18

Applicant: ArcelorMittal

Inventor： Francis SCHMIT ,  Rene VIERSTRAETE ,  Qingdong YIN ,  Wolfram EHLING

IPC: B23K26/60 ,  B23K26/26 ,  B23K26/322 ,  B23K26/348 ,  B23K9/173 ,  B23K26/211 ,  B23K9/167 ,  B23K26/40 ,  B23K26/361 ,  B23K28/02 ,  B23K26/32

CPC classification number: B23K26/60 ,  B23K26/26 ,  B23K26/322 ,  B23K26/348 ,  B23K9/173 ,  B23K26/211 ,  B23K9/167 ,  B23K26/40 ,  B23K26/361 ,  B23K28/02 ,  B23K26/32 ,  B23K2101/006

Abstract: A method for the preparation of steel sheets for fabricating a welded steel blank is provided. The method includes a step of removing at least part of the first and second metal alloy layers in first and second peripheral zones of pre-coated steel first and second sheets, respectively, by simultaneously ablating the first and second precoatings in the first and second peripheral zones of the pre-coated steel first and second sheets to define first and second ablation zones, the first and second peripheral zones being zones of the first and second principal faces closest to the median plane and located on either side of the median plane.

公开(公告)号：US11833612B2

公开(公告)日：2023-12-05

申请号：US17807683

申请日：2022-06-17

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Tetsuji Egawa ,  Eita Niisato ,  Jun Kitagawa ,  Masahiro Onoda

IPC: B23K26/26 ,  B23K9/025 ,  B23K33/00 ,  B23P15/00 ,  B23K26/28 ,  B23K26/60 ,  B23K26/00 ,  B23K28/02 ,  B23K101/18 ,  B23K103/04

CPC classification number: B23K26/26 ,  B23K9/025 ,  B23K26/0093 ,  B23K26/28 ,  B23K26/60 ,  B23K28/02 ,  B23K33/00 ,  B23K33/002 ,  B23P15/00 ,  B23K2101/18 ,  B23K2103/04

Abstract: A metal member includes a first plate, and a second plate abutting against and welded to the first plate in at least one butt portion. In the butt portion, a length from a first end to a second end of a welding boundary line between the first plate and the second plate is longer than a length of a straight line connecting the first end to the second end of the welding boundary line.

公开(公告)号：US11707802B2

公开(公告)日：2023-07-25

申请号：US16860702

申请日：2020-04-28

Applicant: GM Global Technology Operations LLC

Inventor： Huaxin Li ,  Liang Wang ,  Stephen R. McKenny ,  Daniel J. Wilson

IPC: B23K26/035 ,  B23K26/24 ,  B23K26/06 ,  B23K26/062 ,  B23K26/08 ,  B23K26/60 ,  B23K26/12 ,  H05B6/10 ,  B23K103/04 ,  B23K101/00

CPC classification number: B23K26/035 ,  B23K26/062 ,  B23K26/0665 ,  B23K26/08 ,  B23K26/123 ,  B23K26/60 ,  B23K2101/008 ,  B23K2103/04 ,  H05B6/10

Abstract: Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +/−5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

公开(公告)号：US20220410312A1

公开(公告)日：2022-12-29

申请号：US17471094

申请日：2021-09-09

Applicant: Delta Electronics, Inc.

Inventor： Chun-Lien HUANG ,  Wen-Yu CHUANG ,  Keng-Ning CHANG ,  Ting-Yu LU ,  Chun-Fei KUNG

IPC: B23K26/06 ,  B23K26/60 ,  B23K26/03 ,  B23K1/005 ,  G05B19/418

Abstract: A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

公开(公告)号：US20220359353A1

公开(公告)日：2022-11-10

申请号：US17737831

申请日：2022-05-05

Applicant: Analog Devices International Unlimited Company

Inventor： Chee Leong Tham ,  Eng Tat Ng ,  Teik Tiong Toong

IPC: H01L23/498 ,  B23K26/364 ,  B23K26/60 ,  H01L25/16 ,  H01L21/56 ,  H01L23/31

Abstract: An integrated device package is disclosed. The integrated device package can include a substrate that has a first side and a second side, an electronic component that is mounted on the first side or the second side of the substrate, a molding material that is disposed at least on the first side of the substrate, and an conductive material that is disposed on the first side of the substrate and extending through the molding material. The molding material has an exterior surface facing away from the substrate. The exterior surface of the molding material includes laser grooves indicative of laser lapping.