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公开(公告)号：US12121995B2
公开(公告)日：2024-10-22
申请号：US17307928
申请日：2021-05-04
Applicant: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Inventor： Liquan Cai , Peng Chen , Houde Zhou
IPC: B23K26/38 , B23K26/40 , B23K101/40
CPC classification number: B23K26/38 , B23K26/40 , B23K2101/40
Abstract: A laser system for dicing a semiconductor structure is disclosed. The laser system includes a laser source and a laser energy adjusting unit. The laser source is configured to generate a laser. The laser energy adjusting unit is movably provided on a laser light path between the laser source and the semiconductor structure. The laser energy adjusting unit is moved to the laser light path between the laser source and the semiconductor structure based on a first determination that the laser source is focused on a first preset region of the semiconductor structure having a first material.
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公开(公告)号：US20240266220A1
公开(公告)日：2024-08-08
申请号：US18105390
申请日：2023-02-03
Applicant: Applied Materials, Inc.
Inventor： Jonathan Bryant MELLEN , Clinton GOH , Cheng SUN
IPC: H01L21/78 , B23K26/38 , B23K26/40 , H01J37/32 , H01L21/268 , H01L21/3065 , H01L21/67 , H01L23/544
CPC classification number: H01L21/78 , B23K26/38 , B23K26/40 , H01J37/32743 , H01J37/32899 , H01L21/268 , H01L21/3065 , H01L21/67167 , H01L21/67207 , H01L23/544 , H01J2237/022 , H01J2237/334 , H01L2223/5446
Abstract: A method for dicing a die from a substrate for bonding that leverages laser and multiple etch processes. The method may include performing a laser cutting process to form a cut that removes a first portion of a dicing street in the substrate, performing a first plasma etch process to increase the laser kerf width to a first plasma etch width that is less than a dicing street width and to remove any non-silicon material from a bottom of the cut, and performing a second plasma etch process to increase the first plasma etch width to the dicing street width and to remove any remaining portion of the dicing street to completely separate the die from the substrate.
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3.发明公开
公开(公告)号：US20240227084A1
公开(公告)日：2024-07-11
申请号：US18409364
申请日：2024-01-10
Applicant: Schott AG
Inventor： Fabian Wagner , Matthias Jotz , Andreas Ortner , Renè Liebers , Christopher Mauer , Pascal Schumacher
IPC: B23K26/53 , B23K26/06 , B23K26/0622 , B23K26/40
CPC classification number: B23K26/53 , B23K26/0624 , B23K26/0648 , B23K26/40 , B23K2103/54
Abstract: A method for dividing a workpiece into elements includes: a pulsed laser beam of an ultrashort pulse laser is directed onto a workpiece composed of brittle-hard material; instances of filamentary damage are introduced next to one another along a path. The distance between the instances of filamentary damage at least in one portion of the path is selected such that one of the following conditions is met: (i) the difference in terms of magnitude between the characteristic fracture strengths of the element upon bending in opposite directions in this portion is at most 10 MPa; (ii) the difference in terms of magnitude between the characteristic fracture strengths of the element upon bending in opposite directions in this portion is at least 30 MPa; and (iii) the difference in terms of magnitude between the fracture strengths upon bending of the element in opposite directions is at least 30 MPa*d[mm]*π/3.
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公开(公告)号：US20240189940A1
公开(公告)日：2024-06-13
申请号：US18411914
申请日：2024-01-12
Applicant: Wolfspeed, Inc.
Inventor： Matthew Donofrio , John Edmond , Harshad Golakia , Eric Mayer
CPC classification number: B23K26/032 , B23K26/40 , B23K26/53 , B28D5/0064 , H01L21/02686
Abstract: A crystalline material processing method includes forming subsurface laser damage at a first average depth position to form cracks in the substrate interior propagating outward from at least one subsurface laser damage pattern, followed by imaging the substrate top surface, analyzing the image to identify a condition indicative of presence of uncracked regions within the substrate, and taking one or more actions responsive to the analyzing. One potential action includes changing an instruction set for producing subsequent laser damage formation (at second or subsequent average depth positions), without necessarily forming additional damage at the first depth position. Another potential action includes forming additional subsurface laser damage at the first depth position. The substrate surface is illuminated with a diffuse light source arranged perpendicular to a primary substrate flat and positioned to a first side of the substrate, and imaged with an imaging device positioned to an opposing second side of the substrate.
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5.发明公开
公开(公告)号：US20240139994A1
公开(公告)日：2024-05-02
申请号：US18404731
申请日：2024-01-04
Applicant: Divergent Technologies, Inc.
Inventor： Kevin Robert Czinger , Broc William Tenhouten , Stuart Paul Macey , David Charles O'Connell , Jon Paul Gunner , Antonio Bernerd Martinez , Narender Shankar Lakshman
IPC: B28B1/00 , B22F3/00 , B22F5/10 , B22F10/00 , B22F10/25 , B22F10/28 , B23K26/00 , B23K26/342 , B23K26/38 , B23K26/40 , B29C64/124 , B29C64/153 , B33Y80/00 , B62D27/02 , G06F30/15
CPC classification number: B28B1/001 , B22F3/002 , B22F5/10 , B22F10/00 , B22F10/25 , B22F10/28 , B23K26/0006 , B23K26/342 , B23K26/38 , B23K26/40 , B29C64/124 , B29C64/153 , B33Y80/00 , B62D27/023 , G06F30/15 , B23K2101/28
Abstract: Some embodiments of the present disclosure relate to an additively manufactured transport structure. The transport structure includes cavities into which components that use an external interface are inserted. A plurality of components are assembled and integrated into the vehicle. In an embodiment, the components and frame are modular, enabling reparability and replacement of single parts in the event of isolated failures.
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公开(公告)号：US20240139884A1
公开(公告)日：2024-05-02
申请号：US18279993
申请日：2022-03-02
Applicant: Rogers Germany GmbH
Inventor： Thomas Kohl , Bernhard Rettinger
IPC: B23K26/364 , B23K26/40
CPC classification number: B23K26/364 , B23K26/40 , B23K2103/16
Abstract: A method for machining a metal-ceramic substrate (1), in particular for producing a predetermined breaking point, comprising:
providing a metal-ceramic substrate (1) and
forming a predetermined breaking point (7) in the metal-ceramic substrate (1) wherein the predetermined breaking point (7) has along a direction (V) thereof at least a first portion (A1) having a first depth (T1) and at least a second portion (A2) having a second depth (T2), wherein a second depth (T2) is realized, which is different from the first depth (T1).
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7.发明公开
公开(公告)号：US20240088314A1
公开(公告)日：2024-03-14
申请号：US18244767
申请日：2023-09-11
Inventor： Austin FLICK , Reinhold H. DAUSKARDT
IPC: H01L31/0463 , B23K26/0622 , B23K26/40 , H01L31/0224 , H01L31/05
CPC classification number: H01L31/0463 , B23K26/0624 , B23K26/40 , H01L31/022425 , H01L31/0512 , B23K2103/172
Abstract: A vertically selective liftoff scribing process is provided. One application is the fabrication of solar cells and solar modules. The basis of this technology is absorption of an indirectly focused laser beam in the front electrode material of the device, which enables removal of this layer (e.g., a P1 scribe) or removal of layers above the front electrode while leaving the front electrode intact (e.g., a P2 or P3 scribe). The laser fluence can be selected to choose between these alternatives, and further fine tuning is possible depending on details of the device structure.
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公开(公告)号：US20240058899A1
公开(公告)日：2024-02-22
申请号：US18499716
申请日：2023-11-01
Applicant: Siltectra GmbH
Inventor： Jan Richter , Christian Beyer , Ralf Rieske
IPC: B23K26/53 , B23K26/40 , B23K26/402 , B28D5/00 , H01L21/02 , H01L21/304 , H01L21/78
CPC classification number: B23K26/53 , B23K26/40 , B23K26/402 , B28D5/0011 , H01L21/02019 , H01L21/3043 , H01L21/78 , B23K2103/56
Abstract: A method for producing a detachment region in a solid-state body includes: providing a solid body that consists of a chemical compound comprising a combination of elements from the 3rd, 4th and 5th main group and subgroup 12 of the Periodic Table of the Elements; providing a laser light source; and exposing the solid body to laser beams from the laser light source. The laser beams penetrate into the solid body via a main surface of the solid body and are applied in a defined manner on a predefined portion of the solid body within the solid body to form a detachment region. The application of the laser beams successively creates multiple modifications in a crystal lattice of the solid body which, as a result of the modifications, fissures in a subcritical manner at least in a portion in each case in regions that surround the modifications.
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公开(公告)号：US11901233B2
公开(公告)日：2024-02-13
申请号：US17327005
申请日：2021-05-21
Applicant: NICHIA CORPORATION
Inventor： Kazuki Yamaguchi , Yoshitaka Sumitomo
IPC: H01L21/78 , B23K26/53 , B23K26/40 , H01L23/544 , B23K101/40
CPC classification number: H01L21/78 , B23K26/40 , B23K26/53 , H01L23/544 , B23K2101/40
Abstract: A method of manufacturing a semiconductor element includes a first irradiation step in which a laser beam is irradiated to form, in the interior of the substrate, a plurality of first modified portions aligned along a first direction; a second irradiation step in which a laser beam is irradiated to form a plurality of second modified portions aligned along the first direction at a position adjacent to the plurality of first modified portions in the second direction; and a third irradiation step which a laser beam is irradiated to form a plurality of third modified portions aligned along the first direction at a position closer to the first surface than the first modified portions and overlapping the plurality of first modified portions in a thickness direction of the substrate.
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10.发明授权
公开(公告)号：US11897163B2
公开(公告)日：2024-02-13
申请号：US17171867
申请日：2021-02-09
Applicant: DIVERGENT TECHNOLOGIES, INC.
Inventor： Kevin Robert Czinger , Broc William TenHouten , Stuart Paul Macey , David Charles O'Connell , Jon Paul Gunner , Antonio Bernerd Martinez , Narender Shankar Lakshman
IPC: B62D25/00 , B62D65/02 , B28B1/00 , B33Y80/00 , B23K26/342 , B23K26/03 , B23K26/40 , B23K26/00 , B22F5/10 , G06F30/15 , B22F10/00 , B22F10/25 , B22F10/28 , B29C64/124 , B29C64/153 , B22F3/00 , B62D27/02 , B23K101/28 , B23K103/10 , B29C64/10 , B23K103/08 , B23K103/14 , B23K103/04 , B22F10/18 , B22F12/00 , B22F12/46 , B22F12/53 , B22F10/80 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B23K26/21 , B23K101/00 , B22F3/115
CPC classification number: B28B1/001 , B22F3/002 , B22F5/10 , B22F10/00 , B22F10/25 , B22F10/28 , B23K26/0006 , B23K26/03 , B23K26/342 , B23K26/40 , B29C64/124 , B29C64/153 , B33Y80/00 , B62D27/023 , G06F30/15 , B22F3/115 , B22F10/18 , B22F10/80 , B22F12/22 , B22F12/46 , B22F12/53 , B22F2999/00 , B23K26/21 , B23K2101/006 , B23K2101/28 , B23K2103/04 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B29C64/10 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B62D25/00 , B62D65/02 , B22F2999/00 , B22F5/10 , B22F10/00 , B22F2999/00 , B22F10/00 , B22F3/115 , B22F2999/00 , B22F10/00 , B22F10/10 , B22F2999/00 , B22F10/25 , B22F3/115 , B22F2999/00 , B22F10/10 , B22F10/18 , B22F2999/00 , B22F5/10 , B22F10/25 , B22F2999/00 , B22F10/25 , B22F10/18
Abstract: Some embodiments of the present disclosure relate to an additively manufactured transport structure. The transport structure includes cavities into which components that use an external interface are inserted. A plurality of components are assembled and integrated into the vehicle. In an embodiment, the components and frame are modular, enabling reparability and replacement of single parts in the event of isolated failures.
