公开(公告)号：US20240351146A1

公开(公告)日：2024-10-24

申请号：US18218227

申请日：2023-07-05

申请人： HYUNDAI MOBIS CO., LTD.

发明人： Sung Hun WOO

IPC分类号： B23K31/12 ,  B23K26/03 ,  B23K26/21 ,  B23K26/70

CPC分类号： B23K31/125 ,  B23K26/03 ,  B23K26/21 ,  B23K26/702 ,  B23K31/006

摘要： The present disclosure relates to a system and method for checking quality of laser welding. The system and method for checking quality of laser welding of the present disclosure relates to a technology capable of applying a consistent defect determination criterion for laser welding quality by applying an anomaly score that is inferred based on machine learning.

公开(公告)号：US12121994B2

公开(公告)日：2024-10-22

申请号：US17598065

申请日：2019-03-29

申请人： DMG MORI CO., LTD.

发明人： Matjaz Kotar ,  Masaki Kondo ,  Gideon N. Levy ,  Edvard Govekar

IPC分类号： B23K26/342 ,  B23K26/03 ,  B23K26/073 ,  B23K26/08 ,  B23K26/70 ,  B33Y30/00

CPC分类号： B23K26/342 ,  B23K26/032 ,  B23K26/034 ,  B23K26/0734 ,  B23K26/0869 ,  B23K26/702 ,  B33Y30/00

摘要： A processing machine includes a laser irradiation device that emits an annular laser beam, and a wire feeding device that feeds a wire from an inside of the annular laser beam. When a workpiece irradiation proportion parameter (WIP) represented by an equation WIP=Pwp/P (Pwp: laser beam power introduced onto a workpiece surface when the wire exists in an irradiation region of the laser beam, P: the laser beam power introduced onto the workpiece surface when the wire does not exist in the irradiation region) is defined, a control device controls the wire feeding device so that a wire end abuts on the workpiece surface at a beginning of additive manufacturing. The control device determines initial power P0 based on the WIP at the beginning of the additive manufacturing, and controls the laser irradiation device so that the workpiece is irradiated with the laser beam at the initial power P0.

公开(公告)号：US20240342834A1

公开(公告)日：2024-10-17

申请号：US18594335

申请日：2024-03-04

申请人： Joyce Liu ,  Shangqing Liu

发明人： Joyce Liu ,  Shangqing Liu

IPC分类号： B23K26/50 ,  A61B18/00 ,  A61B18/20 ,  B23K26/03 ,  B23K26/0622 ,  G02B17/00

CPC分类号： B23K26/50 ,  A61B18/20 ,  B23K26/032 ,  B23K26/0622 ,  A61B2018/00577 ,  A61B2018/00625 ,  A61B2018/2035 ,  A61B2018/2065 ,  G02B17/004

摘要： This non-provisional application is a continuation-in-part application filed under 37 CFR 1.53(b) that claims the benefit of United States 35 USC 120 from non-provisional application with U.S. application Ser. No. 18/237,911 filed on Aug. 25, 2023, and from non-provisional application with Pub. No. US 2022/0258277 A1 filed on Feb. 12, 2021. This invention discloses an apparatus of processing object in optical turbid medium using multibeam interference. This invention creates the apparatus having important usages, such as medical no incision laser surgery with deep treating depth, underwater wireless long-distance communication, small attenuation light energy delivery in optical turbid medium. The disclosed apparatus has excellent performance. For example, the created laser scalpel can treat tissue at depths of more than 5 cm in human body with high 3D precision of about 1 μm. The effective light energy delivery distance including underwater wireless communication distance of more than 1000 m in clear seawater.

公开(公告)号：US20240342832A1

公开(公告)日：2024-10-17

申请号：US18625388

申请日：2024-04-03

申请人： DISCO CORPORATION

发明人： Tsubasa HIROSE ,  Hiroshi MORIKAZU

IPC分类号： B23K26/38 ,  B23K26/03 ,  B23K26/0622 ,  B23K101/40

CPC分类号： B23K26/38 ,  B23K26/03 ,  B23K26/0622 ,  B23K2101/40

摘要： A processing method for a workpiece includes applying to the workpiece a pulsed laser beam that causes ablation to thereby generate plasma light and generate a first distribution pattern, the beam having a wavelength and intensity of light intrinsic to the workpiece substance, the beam being used to find and set appropriate processing conditions for processing the workpiece; recording the first distribution pattern and the processing conditions in a linked manner; applying the beam to the workpiece to generate plasma light; generating a second distribution pattern including a wavelength and intensity of light intrinsic to the workpiece substance, according to the plasma light; collating the second distribution pattern and the first distribution pattern to thereby select a third distribution pattern having a degree of similarity in a predetermined range; and processing the workpiece in reference to processing conditions linked to the third distribution pattern.

公开(公告)号：US20240342824A1

公开(公告)日：2024-10-17

申请号：US18631868

申请日：2024-04-10

申请人： Prime Planet Energy & Solutions, Inc.

发明人： Takashi YOSHIDA ,  Akira SAKAMOTO

IPC分类号： B23K26/03 ,  B23K26/21 ,  G06T7/60 ,  G06V10/44 ,  G06V10/764

CPC分类号： B23K26/032 ,  B23K26/21 ,  G06T7/60 ,  G06V10/44 ,  G06V10/764 ,  G06T2207/30136

摘要： A sputter measurement system includes: a camera that captures an image of an observation region including a molten portion that is melted during welding; a telecentric lens disposed between the molten portion and the camera; and a controller that measures a size of a sputter flying from a molten portion based on an image captured by the camera.

公开(公告)号：US12115595B2

公开(公告)日：2024-10-15

申请号：US17469905

申请日：2021-09-09

申请人： TRUMPF Laser—und Systemtechnik GmbH

发明人： Oliver Bocksrocker ,  Nicolai Speker ,  Jens Brueggebors

IPC分类号： B23K26/21 ,  B23K26/03 ,  B23K26/073 ,  B23K26/08 ,  B23K101/32 ,  B23K103/12

CPC分类号： B23K26/21 ,  B23K26/032 ,  B23K26/073 ,  B23K26/0876 ,  B23K2101/32 ,  B23K2103/12

摘要： A hairpin welding method welds wire ends of at least two copper wires, arranged flush next to one another, to one another by a laser beam. The laser beam is generated with a beam cross section that impinges on the wire ends at an end side and has a round core region and a ring region surrounding the round core region. A ratio of an external diameter of the ring region to a diameter of the core region is between 7:1 and 2:1. A ratio of a laser power in the core region to a laser power in the ring region is between 10:90 and 70:30.

公开(公告)号：US12109650B2

公开(公告)日：2024-10-08

申请号：US17403989

申请日：2021-08-17

申请人： 21TH CENTURY CO., LTD

发明人： Sung Hwan Kim ,  Hyoung Shik Kang ,  Dong Bin You

IPC分类号： B23K26/36 ,  B23K26/03

CPC分类号： B23K26/36 ,  B23K26/03

摘要： Proposed is a planing-polishing apparatus 1 using a femtosecond pulsed laser and performing polishing of a planar workpiece to reduce surface roughness of the workpiece after performing planing of the workpiece using a femtosecond pulsed laser beam.

公开(公告)号：US20240326158A1

公开(公告)日：2024-10-03

申请号：US18601845

申请日：2024-03-11

申请人： DIVERGENT TECHNOLOGIES, INC.

发明人： R. Bruce Madigan ,  Lars Jacquemetton ,  Glenn Wikle ,  Mark J. Cola ,  Vivek R. Dave ,  Darren Beckett ,  Alberto M. Castro

IPC分类号： B23K26/03 ,  B22F10/28 ,  B22F10/31 ,  B22F12/90 ,  B23K15/00 ,  B23K26/342 ,  B23K26/70 ,  B23K31/12 ,  B23K101/00 ,  B29C64/393 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y50/02

CPC分类号： B23K26/032 ,  B22F12/90 ,  B23K15/0086 ,  B23K26/342 ,  B23K26/70 ,  B23K31/125 ,  B29C64/393 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y50/02 ,  B22F10/28 ,  B22F10/31 ,  B22F2203/11 ,  B23K2101/001

摘要： This disclosure describes various methods and apparatus for characterizing an additive manufacturing process. A method for characterizing the additive manufacturing process can include generating scans of an energy source across a build plane; measuring an amount of energy radiated from the build plane during each of the scans using an optical sensor; determining an area of the build plane traversed during the scans; determining a thermal energy density for the area of the build plane traversed by the scans based upon the amount of energy radiated and the area of the build plane traversed by the scans; mapping the thermal energy density to one or more location of the build plane; determining that the thermal energy density is characterized by a density outside a range of density values; and thereafter, adjusting subsequent scans of the energy source across or proximate the one or more locations of the build plane.

公开(公告)号：US12103111B2

公开(公告)日：2024-10-01

申请号：US17436795

申请日：2020-03-02

申请人： Tokyo Electron Limited

发明人： Yohei Yamashita

IPC分类号： B23K26/53 ,  B23K26/03 ,  B23K26/062 ,  B23K26/08

CPC分类号： B23K26/53 ,  B23K26/0344 ,  B23K26/062 ,  B23K26/0823

摘要： In forming modification layers by radiating laser light to an inside of a processing target object from a modifying device periodically while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and by moving the modifying device relative to the holder in a diametrical direction by a moving mechanism, a boundary position of the laser light in the diametrical direction is calculated, the boundary position being a position where a circumferential distance between the modification layers becomes a required threshold value, and a diametrical distance between the modification layers is reduced in a moving direction of the modifying device from the boundary position and/or a frequency of the laser light is reduced.

公开(公告)号：US20240316698A1

公开(公告)日：2024-09-26

申请号：US18281565

申请日：2021-04-06

申请人： Mitsubishi Electric Corporation

发明人： Kenta FUJII ,  Kyohei ISHIKAWA ,  Nobuaki TANAKA ,  Motoaki NISHIWAKI

IPC分类号： B23K26/70 ,  B23K26/03

CPC分类号： B23K26/705 ,  B23K26/03

摘要： A laser processing apparatus includes a control device controlling laser processing in accordance with processing condition; a detection unit observing processing state on a time-series basis during laser processing and outputting a signal corresponding to observation result as a time-series signal; a parameter estimation unit estimating and outputting, based on first time-series signal data including the time-series signal and/or a first feature computed from the time-series signal and preset corresponding parameter information indicating relationship between the first time-series signal data and at least one parameter value included in the processing condition, a parameter estimate corresponding to the first time-series signal data; a condition change amount determination unit comparing a target parameter value and the parameter estimate and determining a change amount for the processing condition based on comparison result; and a parameter update unit updating the processing condition based on the change amount and the processing condition.