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1.发明公开公开(公告)号：US20240326135A1
公开(公告)日：2024-10-03
申请号：US18621613
申请日：2024-03-29
Applicant: VulcanForms Inc.
Inventor： ALEXANDER DUNBAR , Michael von Dadelszen , Andrew Gregory Przyjemski
CPC classification number: B22F12/90 , B22F10/36 , B23K26/032 , B23K26/342 , B23K26/705 , B33Y50/02 , G01N21/6402 , B22F10/28 , G01N2201/0636
Abstract: Systems and methods for monitoring light emitted from a build surface as well as other sources during an additive manufacturing process are disclosed. Systems and methods for monitoring laser energy directed towards a build surface during an additive manufacturing process are also disclosed.
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公开(公告)号：US20240307997A1
公开(公告)日：2024-09-19
申请号：US18576191
申请日：2022-03-17
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor： Akira TAKEDA , Hirotake FUKUOKA
IPC: B23K26/03 , B23K26/046 , B23K26/06 , B23K26/082 , B23K26/70
CPC classification number: B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/082 , B23K26/705
Abstract: A laser processing apparatus according to an embodiment includes a laser beam source, a stage, an fθ lens, a galvano scanner that scans a processed surface of a processing target with a laser beam by operating a dielectric mirror to adjust an incident angle of the laser beam with respect to the fθ lens, a polarization beam splitter disposed between the laser beam source and the galvano scanner on an optical path of the laser beam, a quarter-wave plate disposed between the polarization beam splitter and the galvano scanner on the optical path, and a light detection unit that detects a return beam of the laser beam from the processed surface irradiated with the laser beam, the return beam passing through the fθ lens, the galvano scanner, the quarter-wave plate, and the polarization beam splitter in this order.
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3.发明公开公开(公告)号：US20240261907A1
公开(公告)日：2024-08-08
申请号：US18625968
申请日：2024-04-03
Inventor： Koji FUNAMI
CPC classification number: B23K31/125 , B23K26/21 , B23K26/705
Abstract: A laser welding quality inspection method of a welded portion between a joining object and a joined object, when the joining object and the joined object are welded by being irradiated with a laser beam, the method includes: acquiring first data indicating a signal intensity of thermal radiation light radiated from the welded portion during the welding; acquiring second data indicating a signal intensity of plasma light radiated from the welded portion during the welding; and determining whether or not the welded portion includes an abnormality based on a comparison between the signal intensity of the thermal radiation light and the signal intensity of the plasma light which are acquired.
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公开(公告)号：US12053840B2
公开(公告)日：2024-08-06
申请号：US17226094
申请日：2021-04-09
Applicant: TRUMPF Werkzeugmaschinen GmbH + Co. KG
Inventor： Boris Regaard , Winfried Magg
CPC classification number: B23K26/705 , B23K26/38
Abstract: A method determines at least one parameter for a process quality during a processing process. The method includes: processing a workpiece while moving a processing tool and the workpiece relative to one another; monitoring a region on the workpiece; determining the at least one parameter for the process quality based on the monitored region; and determining at least one position-dependent parameter for the process quality based on a plurality of measured values of the at least one parameter at a same processing position, or determining at least one direction-dependent parameter for the process quality based on the plurality of measured values of the at least one parameter in a same processing direction.
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5.发明公开公开(公告)号：US20240227066A9
公开(公告)日：2024-07-11
申请号：US18402782
申请日：2024-01-03
Applicant: TRUMPF Laser GmbH
Inventor： Jan-Patrick Hermani , Martin Stambke , Christopherg Scharfenberg , Patrick Haug
CPC classification number: B23K26/032 , B23K26/21 , B23K26/705
Abstract: A method for monitoring a laser welding process for welding workpieces by a welding laser beam is provided. The method includes, during the laser welding process, directing a measuring beam of an optical coherence tomograph onto an interaction area in which the welding laser beam interacts with the workpieces. The measuring beam penetrates the workpieces in the interaction area in a through weld of the workpieces. The measuring beam penetrating the workpieces is incident on a reference element. The method further includes acquiring measured values using the measuring beam, defining a first measured value range corresponding to detection of a material of the workpieces, defining a second measured value range corresponding to detection of the reference element, and determine a ratio of a number of measured values lying in the first measured value range and a number of measured values lying in the second measured value range.
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Patent Agency Ranking
公开(公告)号：US11999017B2
公开(公告)日：2024-06-04
申请号：US17162782
申请日：2021-01-29
Applicant: Lessmüller Lasertechnik GmbH
Inventor： Eckhard Lessmueller , Christian Truckenbrodt , Maximilian Schmidt
CPC classification number: B23K26/705 , B23K26/0643 , B23K26/0648 , B23K26/28
Abstract: The invention relates to a method for conducting and monitoring a machining process of a workpiece (10), in particular a welding process for joining the workpiece (10) to a further workpiece (10), by means of a high-energy machining beam (14), wherein the method comprises the following steps: generating a high-energy machining beam (14); projecting and/or focusing the machining beam (14) onto the workpiece (10), wherein, in accordance with a machining control signal, different machining regions of the workpiece (10) are machined; generating a measurement beam (16) by means of an optical coherence tomograph (18), wherein the measurement beam (16) is able to be coupled into the machining beam (14); determining measurement points (20) during the machining process by means of the optical coherence tomograph (18) using the measurement beam (16), in accordance with a measurement control signal; obtaining at least one external signal which is based on a measured variable and which is independent of a processing of the machining control signal and of the measurement control signal; generating an evaluation on the basis of the measurement points (20) and of the at least one external signal, which evaluation comprises a comparison of the measurement points (20) with at least one threshold value; monitoring the machining process on the basis of the evaluation.
The invention relates further to a correspondingly configured device for conducting and monitoring a machining process of a workpiece (10).-
7.发明授权公开(公告)号：US11975403B2
公开(公告)日：2024-05-07
申请号：US16995153
申请日：2020-08-17
Inventor： Yohei Takechi , Jun Yokoyama
IPC: B23K26/06 , B23K26/082 , B23K26/21 , B23K26/70
CPC classification number: B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/705 , B23K26/21
Abstract: Laser processing apparatus includes movable mirror for changing paths of laser light for processing and measurement light, and stage for changing an incident angle of measuring light. Furthermore, laser processing apparatus includes lens for condensing laser light for processing and measurement light on processing point, controller for controlling laser oscillator, movable mirror, and stage based on corrected data for processing, and measurement processor for measuring a depth of keyhole generated at processing point. The corrected data for processing is data corrected so as to a deviation of an arrival position of at least one of laser light for processing and measurement light caused by chromatic aberration of lens on the surface of workpiece. With this configuration, an accurate depth of keyhole can be measured.
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公开(公告)号：US11958135B2
公开(公告)日：2024-04-16
申请号：US16541154
申请日：2019-08-15
Applicant: FANUC Corporation
Inventor： Takashi Izumi
CPC classification number: B23K26/705 , B23K26/14 , B23K26/1436 , B23K26/1462 , G06N3/08
Abstract: A machining condition adjustment device adjusts laser beam machining conditions for a laser beam machining device to carry out laser beam machining of a workpiece, produces each of state variables including machining condition data, workpiece data, and plasma generation amount data and determination data including plasma generation amount determination data, and learns adjustment action for the laser beam machining conditions with respect to an amount of plasma generated in the laser beam machining of the workpiece under prescribed laser beam machining conditions, with use of the produced state variables and the produced determination data.
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公开(公告)号：US11858065B2
公开(公告)日：2024-01-02
申请号：US16936260
申请日：2020-07-22
Applicant: LSP Technologies, Inc.
Inventor： Tianyi Michael Yao , Timothy Thomas Gorman , Jeff L Dulaney
IPC: B23K26/06 , B23K26/0622 , B23K26/356 , B23K26/70 , B23K26/20 , B23K26/064
CPC classification number: B23K26/0624 , B23K26/064 , B23K26/0604 , B23K26/20 , B23K26/356 , B23K26/705
Abstract: A laser system includes an integrated fiber laser front-end, configured to generate and output a pre-amplified first pulsed laser beam having predefined beam characteristics corresponding to a user defined pulse shape and a user defined pulse width setting selection of a controller. The first pulsed laser beam is generated from a master oscillator which outputs a CW laser beam to a temporal pulse shaper, which modulates the CW laser beam to output the first pulsed laser beam in response to an electrical pulse from an arbitrary wave generator and a DC bias voltage from an automatic modulator bias control circuitry. The first pulsed laser beam is pre-amplified to an output pulsed laser beam for laser peening or laser bond inspection. A beam detector is used to monitor beam characteristics, and to generate an error signal to be sent back as a feedback signal to the controller for adjustments and corrections.
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公开(公告)号：US11780036B2
公开(公告)日：2023-10-10
申请号：US17017790
申请日：2020-09-11
Applicant: AAC Optics Solutions Pte. Ltd.
Inventor： Niels Christian Roemer Holme , Bingke Zhu
CPC classification number: B23P25/006 , B23K26/0093 , B23K26/0648 , B23K26/0884 , B23K26/354 , B23K26/703 , B23K26/705
Abstract: A laser assisted micromachining system, includes a working sliding, a tool module, a laser module, and a temperature control module for the processing of a workpiece. The laser module is disposed in the working slide and moves with the working slide in three-dimensional space. The temperature control module includes a temperature sensor, a cooler, a controller and a coolant, which detects the real-time temperature value of the cooler. The cooler is located in the working slide and supports the tool module. The controller controls the working state of the cooler according to the temperature feedback. Control signal induced by the temperature indicator, and the working state of the cooler are controlled by the controller. The coolant is used to control the temperature distribution of the cooler in the setting range. At the same time, the invention also provides a temperature control method for the laser assisted micro machining system.
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