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    METHOD OF MAKING VACUUM INSULATED PANEL WITH PRE-HEATING AND LASER HEATING
    1.
    发明公开
    METHOD OF MAKING VACUUM INSULATED PANEL WITH PRE-HEATING AND LASER HEATING 审中-公开

    公开(公告)号：US20240167327A1

    公开(公告)日：2024-05-23

    申请号：US18376897

    申请日：2023-10-05

    申请人： LuxWall, Inc.

    发明人： Scott V. THOMSEN

    IPC分类号： E06B3/673 ,  B23K26/20 ,  B23K26/324 ,  C03C27/08

    CPC分类号： E06B3/67334 ,  B23K26/206 ,  B23K26/324 ,  C03C27/08 ,  B23K2103/54

    摘要： A method of making a vacuum insulating panel, where the vacuum insulating panel may include a first glass substrate, a second glass substrate, a plurality of spacers provided in a gap between at least the first and second glass substrates, and a seal provided between at least the first and second glass substrates, the seal including a first seal layer and/or a second seal layer. The method may include at least one of: providing first seal material for the first seal layer at a location between at least the first and second glass substrates; pre-heating the glass substrates, the first seal material, and the second seal layer; wherein said pre-heating may cause at least one of (a) at least one of the glass substrates, (b) the second seal layer, and/or (c) the first seal material, to reach a pre-heat temperature; wherein the pre-heat temperature may be from about 40-120 degrees C. less than a melting point (Tm) of the first seal material, from about 150-450 degrees less than a melting point (Tm) of the second seal material, and/or within about 70 degrees C. of a softening point (Ts) of the first seal material; after said pre-heating, laser heating the first seal material in order to fire and/or sinter the first seal material and form the first seal layer in a manner so that the first seal layer may have a density of from about 2.8-4.0 g/cm3; and after forming the first seal layer, evacuating the gap to a pressure less than atmospheric pressure.

    Annealing system and annealing method integrated with laser and microwave
    3.
    发明授权
    Annealing system and annealing method integrated with laser and microwave 有权

    公开(公告)号：US11889609B2

    公开(公告)日：2024-01-30

    申请号：US17742446

    申请日：2022-05-12

    申请人： HIGHLIGHT TECH CORP. ,  Finesse Technology Co., Ltd.

    发明人： Chwung-Shan Kou ,  Wen-Yung Yeh

    IPC分类号： H05B6/06 ,  B23K26/20 ,  H05B6/10

    CPC分类号： H05B6/06 ,  B23K26/20 ,  H05B6/101

    摘要： Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.

    Bimetallic joining with powdered metal fillers
    8.
    发明授权
    Bimetallic joining with powdered metal fillers 有权

    公开(公告)号：US11504801B2

    公开(公告)日：2022-11-22

    申请号：US16551284

    申请日：2019-08-26

    申请人： Phoenix Laser Solutions

    发明人： Christopher Learn ,  Albert Hammeke

    IPC分类号： B23K25/00 ,  B23K26/03 ,  B23K35/00 ,  B23K35/02 ,  B23K26/20 ,  B23K26/22 ,  B23K103/12 ,  B23K103/04 ,  B23K103/22

    摘要： A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.

    Laser soldering device and laser soldering method
    9.
    发明授权
    Laser soldering device and laser soldering method 有权

    公开(公告)号：US11465234B2

    公开(公告)日：2022-10-11

    申请号：US17028088

    申请日：2020-09-22

    申请人： Delta Electronics, Inc.

    发明人： Ren-Feng Ding ,  Hung-Wen Chen ,  Shu-Han Wu

    IPC分类号： B23K26/20 ,  B23K26/352 ,  B23K26/32 ,  B23K26/06 ,  B23K1/005 ,  B23K26/03 ,  B23K101/42

    摘要： A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

    HERMETICALLY SEALED GLASS PACKAGE
    10.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE 有权

    公开(公告)号：US20220219972A1

    公开(公告)日：2022-07-14

    申请号：US17705714

    申请日：2022-03-28

    申请人： Schott AG

    发明人： Robert Hettler ,  Jens Ulrich Thomas ,  Antti Maattanen ,  Jochen Herzberg ,  Yutaka Onezawa ,  Thomas Zetterer

    IPC分类号： B81C1/00 ,  B81B3/00 ,  B23K26/324 ,  B23K26/20

    摘要： A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.