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    HERMETICALLY SEALED GLASS PACKAGE
    2.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE 有权

    公开(公告)号：US20220406672A1

    公开(公告)日：2022-12-22

    申请号：US17891823

    申请日：2022-08-19

    申请人： Schott AG

    发明人： Jens Ulrich Thomas ,  Thorsten Damm ,  Thomas Zetterer

    IPC分类号： H01L23/29 ,  B23K26/20 ,  H01L23/15

    摘要： A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.

    LAYERED OPTICAL COMPOSITE HAVING A REDUCED CONTENT OF HIGHLY REFRACTIVE LAYERS AND ITS APPLICATION IN AUGMENTED REALITY
    4.
    发明申请
    LAYERED OPTICAL COMPOSITE HAVING A REDUCED CONTENT OF HIGHLY REFRACTIVE LAYERS AND ITS APPLICATION IN AUGMENTED REALITY 有权

    公开(公告)号：US20210149090A1

    公开(公告)日：2021-05-20

    申请号：US17034595

    申请日：2020-09-28

    申请人： SCHOTT AG

    发明人： Kurt Nattermann ,  Jens Ulrich Thomas ,  Frank-Thomas Lentes ,  Thorsten Damm ,  Peter Naß

    IPC分类号： G02B5/00 ,  G02B27/01

    摘要： The present disclosure relates to a layered optical composite, in particular for use in an augmented reality device. In particular, the disclosure relates to a layered optical composite and a process for its preparation, a device comprising the layered optical composite and a process for its preparation, and the use of a layered optical composite in an augmented reality device.
    The present disclosure relates to a layered optical composite comprising: a. a substrate having a front face and a back face, b. a coating comprising: i. a type T layer, and ii. a type C region comprising one or more type C layers; in which the substrate has: i. a thickness tG in the range from 0.2 to 1.2 mm; ii. a refractive index nG at a wavelength λ in the range from 1.6 to 2.4; and iii. an optical absorption coefficient KG at the wavelength λ of less than 10 cm−1; in which the type C layers individually and independently have: i. a thickness tC in the range from 9 to 250 nm; ii. a refractive index nC at the wavelength λ in the range from 1.35 to 2.43; and iii. an optical absorption coefficient KC at the wavelength λ of less than 106 cm−1; in which at least one type C layer has: i. an optical absorption coefficient at the wavelength λ of at least 100 cm−1; in which the type T layer has: i. a thickness tT in the range from 50 to 300 nm; ii. a refractive index nT at the wavelength λ in the range from 1.35 to 1.96; and iii. an optical absorption coefficient KT of less than 80 cm−1; in which the type C region and the type T layer are each superimposed over one face of the substrate with the type C region further than the type T layer from the substrate; in which λ is in the range from 430 to 670 nm.

    HERMETICALLY SEALED GLASS PACKAGE
    7.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE 有权

    公开(公告)号：US20220219972A1

    公开(公告)日：2022-07-14

    申请号：US17705714

    申请日：2022-03-28

    申请人： Schott AG

    发明人： Robert Hettler ,  Jens Ulrich Thomas ,  Antti Maattanen ,  Jochen Herzberg ,  Yutaka Onezawa ,  Thomas Zetterer

    IPC分类号： B81C1/00 ,  B81B3/00 ,  B23K26/324 ,  B23K26/20

    摘要： A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.

    METHOD OF SURFACE STRUCTURING A SUBSTRATE BODY AND SUBSTRATE BODY
    8.
    发明申请
    METHOD OF SURFACE STRUCTURING A SUBSTRATE BODY AND SUBSTRATE BODY 有权

    公开(公告)号：US20220073427A1

    公开(公告)日：2022-03-10

    申请号：US17466688

    申请日：2021-09-03

    申请人： SCHOTT AG

    发明人： Andreas Ortner ,  David Sohr ,  Jens Ulrich Thomas

    IPC分类号： C03C23/00 ,  C03C15/00

    摘要： A method for preparing and/or carrying out the structuring of a predetermined or predeterminable distinguished surface of a substrate body having a substrate material includes exposing the substrate material in at least one curved effective area to an electromagnetic field which in each of the at least one curved effective area causes a non-linear interaction between the electromagnetic field and the substrate material, and thus at least partially influencing the substrate material arranged in the curved effective area. After the structuring of the distinguished surface the distinguished surface has at least in certain areas at least one first curved progression which is at least partially determined and/or influenced by the curved shape of the at least one curved effective area. The nonlinear interaction causes at least one nonlinear absorption of the electromagnetic field in the substrate material.