公开(公告)号：US20220219972A1

公开(公告)日：2022-07-14

申请号：US17705714

申请日：2022-03-28

申请人： Schott AG

发明人： Robert Hettler ,  Jens Ulrich Thomas ,  Antti Maattanen ,  Jochen Herzberg ,  Yutaka Onezawa ,  Thomas Zetterer

IPC分类号： B81C1/00 ,  B81B3/00 ,  B23K26/324 ,  B23K26/20

摘要： A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.