公开(公告)号：US11999014B2

公开(公告)日：2024-06-04

申请号：US17086946

申请日：2020-11-02

申请人： Medtronic, Inc.

发明人： Xiangnan He ,  David A. Ruben ,  Mark E. Henschel ,  Chunho Kim ,  Yongqian Wang ,  Rodney D. Toles

IPC分类号： B23K26/38 ,  B23K26/06 ,  B23K26/082 ,  B23K26/362 ,  B23K26/70 ,  B23K101/38

CPC分类号： B23K26/38 ,  B23K26/0643 ,  B23K26/082 ,  B23K26/362 ,  B23K26/705 ,  B23K2101/38 ,  H05K2203/0207

摘要： A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

公开(公告)号：US20230120034A1

公开(公告)日：2023-04-20

申请号：US18067438

申请日：2022-12-16

申请人： Medtronic, Inc.

发明人： Xiangnan He ,  David A. Ruben

IPC分类号： B23K26/0622 ,  B23K26/046 ,  B23K26/122 ,  B23K26/12 ,  B23K26/352 ,  B23K26/082

摘要： A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contain a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

公开(公告)号：US11419552B2

公开(公告)日：2022-08-23

申请号：US17012961

申请日：2020-09-04

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Craig L. Schmidt

IPC分类号： H05K5/06 ,  H05K5/02 ,  A61B5/00 ,  A61N1/375 ,  A61N1/372 ,  A61B5/0245 ,  A61N1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K5/03

摘要： Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

公开(公告)号：US20220248545A1

公开(公告)日：2022-08-04

申请号：US17574362

申请日：2022-01-12

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Andrew J. Ries ,  Pankti N. Shah ,  Jason D. Hamack

IPC分类号： H05K5/00 ,  H05K1/18 ,  H02J50/10 ,  A61N1/378

摘要： Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

公开(公告)号：US10813238B2

公开(公告)日：2020-10-20

申请号：US16192933

申请日：2018-11-16

申请人： Medtronic, Inc.

发明人： David A. Ruben

IPC分类号： A61N1/375 ,  H05K5/06 ,  H05K3/38 ,  H05K7/06

摘要： Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

公开(公告)号：US10464836B2

公开(公告)日：2019-11-05

申请号：US14050415

申请日：2013-10-10

申请人： MEDTRONIC, INC.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： C03B23/20 ,  H05K5/00 ,  A61N1/375 ,  H01L23/057 ,  H01L23/10 ,  B81C1/00

摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

公开(公告)号：US09832867B2

公开(公告)日：2017-11-28

申请号：US14949277

申请日：2015-11-23

申请人： Medtronic, Inc.

发明人： John K. Day ,  David A. Ruben ,  Michael S. Sandlin

IPC分类号： H01L21/30 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46 ,  H01L23/15 ,  H01L23/498 ,  H01L21/683

CPC分类号： H05K1/0306 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K3/10 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/09036

摘要： A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.

公开(公告)号：US20170100597A1

公开(公告)日：2017-04-13

申请号：US15196643

申请日：2016-06-29

申请人： Medtronic, Inc.

发明人： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

IPC分类号： A61N1/375 ,  A61N1/378 ,  A61N1/372 ,  A61N1/05 ,  A61N1/08

CPC分类号： A61N1/3758 ,  A61N1/05 ,  A61N1/08 ,  A61N1/37205 ,  A61N1/37223 ,  A61N1/3752 ,  A61N1/3754 ,  A61N1/3756 ,  A61N1/378 ,  A61N1/3787

摘要： Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

公开(公告)号：US20170069775A1

公开(公告)日：2017-03-09

申请号：US15252398

申请日：2016-08-31

申请人： Medtronic, Inc.

发明人： Andreas A. Fenner ,  David A. Ruben ,  Jennifer Lorenz Marckmann ,  James R. Wasson

IPC分类号： H01L31/055 ,  H01L31/054 ,  H01L31/16

CPC分类号： H01L31/055 ,  G21H1/12 ,  H01L31/0547 ,  H01L31/165 ,  Y02E10/52

摘要： Various embodiments of a power source and method of forming such power source are disclosed. The power source can include a substrate and a cavity disposed in a first major surface of the substrate. The power source can also include radioactive material disposed within the cavity, where the radioactive material emits radiation particles; and particle converting material disposed within the cavity, where the particle converting material converts one or more radiation particles emitted by the radioactive material into light. The power source further includes a sealing layer disposed such that the particle converting material and the radioactive material are hermetically sealed within the cavity, and a photovoltaic device disposed adjacent the substrate. The photovoltaic device can convert at least a portion of the light emitted by the particle converting material that is incident upon an input surface of the photovoltaic device into electrical energy.

摘要翻译： 公开了电源的各种实施例和形成这种电源的方法。 电源可以包括衬底和设置在衬底的第一主表面中的空腔。 动力源还可以包括设置在空腔内的放射性物质，其中放射性物质发射辐射粒子; 粒子转换材料设置在空腔内，其中粒子转换材料将由放射性物质发射的一种或多种辐射粒子转换成光。 电源还包括密封层，其设置成使得颗粒转换材料和放射性材料气密地密封在空腔内，以及邻近基板设置的光伏器件。 光电器件可以将入射到光伏器件的输入表面上的粒子转换材料发出的光的至少一部分转换为电能。

公开(公告)号：US20150101841A1

公开(公告)日：2015-04-16

申请号：US14050415

申请日：2013-10-10

申请人： MEDTRONIC, INC.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： H05K5/06 ,  H05K5/02 ,  C03B23/20 ,  H05K5/00

CPC分类号： C03B23/20 ,  A61N1/3754 ,  A61N1/3756 ,  B81B2207/095 ,  B81C1/00301 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H05K5/0095 ,  H01L2924/00

摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

摘要翻译： 玻璃晶片具有由晶片厚度分离的内表面和相对的外表面。 密封的导电馈通通过晶片从内表面延伸到相对的外表面。 馈通包括具有沿着内表面暴露的内表面的馈通构件，用于电耦合到电路。 馈通构件从内表面部分地延伸穿过晶片厚度到密封地嵌入晶片内的面向外部的外表面。