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公开(公告)号：US12115000B2
公开(公告)日：2024-10-15
申请号：US17485220
申请日：2021-09-24
Applicant: SportScientia Pte. Ltd.
Inventor： Panayiotis Lazou , Andrew Gray , Kaspar Lauri , Erki Koplimets , Kristjan Tozen , Henri Lumiste
IPC: A61B5/00 , A43B3/34 , A43B13/22 , A43B17/14 , A61B5/103 , A61B5/11 , G01P13/00 , G06N20/00 , H02J7/00 , H05K1/03 , H05K1/18
CPC classification number: A61B5/6807 , A43B3/34 , A43B13/22 , A43B17/14 , A61B5/1038 , A61B5/1107 , A61B5/112 , A61B5/486 , A61B5/7203 , A61B5/725 , A61B5/7267 , G01P13/00 , G06N20/00 , H02J7/0042 , H05K1/0366 , H05K1/182 , H05K1/189 , H05K2201/09036 , H05K2201/10037 , H05K2201/10098 , H05K2201/10151
Abstract: A sock for capturing motion data of a user includes (i) a sock enclosure having a calf portion, a shin portion, and a foot portion, and (ii) one or more sensors, wherein each sensor is disposed within a biosignal channel in the sock enclosure. The sock includes an electronic pad disposed adjacent to the shin portion. The electronic pad includes a flexible printed circuit board on which the one or more sensors are embedded, a processor configured to receive motion data generated by the one or more sensors, and a power supply device configured to power the one or more sensors. The sock includes an insole layer disposed along the foot portion and communicatively connected to the electronic pad. The sock and an external computing device form a motion analytics system, wherein the external computing device performs a data analytics method to provide context and insight to the user.
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公开(公告)号：US20240334595A1
公开(公告)日：2024-10-03
申请号：US18617391
申请日：2024-03-26
Applicant: INFINITUM ELECTRIC INC.
Inventor： Edward C. CARIGNAN , Paulo GUEDES-PINTO
CPC classification number: H05K1/0284 , H02K3/26 , H05K1/0366 , H05K3/18 , H05K2201/09036
Abstract: A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.
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3.发明公开
公开(公告)号：US20240259000A1
公开(公告)日：2024-08-01
申请号：US18633292
申请日：2024-04-11
Applicant: VIVO MOBILE COMMUNICATION CO., LTD.
CPC classification number: H03K3/011 , G01K1/026 , H05K1/14 , H05K1/18 , H05K2201/09036 , H05K2201/10151
Abstract: A circuit board structure, an information processing method and apparatus, and a communication device. The circuit board structure includes a circuit board substrate, a temperature drift processing chip, and at least two heat-sensitive elements; the circuit board substrate including a first substrate and a second substrate opposite the first substrate. The first substrate is provided with a heat-generating device; and the second substrate has a cavity, the cavity being provided with at least one boss extending toward the first substrate. The heat-generating device is located between the first substrate and the boss; the at least two heat-sensitive elements are disposed at a peripheral position of the heat-generating device; and the temperature drift processing chip is electrically connected to the at least two heat-sensitive elements, and the temperature drift processing chip is disposed on the circuit board substrate.
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公开(公告)号：US12035485B2
公开(公告)日：2024-07-09
申请号：US17726896
申请日：2022-04-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Guh Hwan Lim , Chi Seong Kim , Won Seok Lee , Jin Oh Park , Yu Mi Kim , Sang Yun Lee , Eun Sun Kim
CPC classification number: H05K3/4697 , H05K1/115 , H05K3/4038 , H05K3/4644 , H05K2201/09036
Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.
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公开(公告)号：US20240206076A1
公开(公告)日：2024-06-20
申请号：US18591060
申请日：2024-02-29
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Matthew S. Stay , Caleb T. Nelson , David J. Tarnowski , David J. Rowe , Edwin L. Kusilek
CPC classification number: H05K3/048 , H05K1/028 , H05K3/0014 , H05K2201/09036 , H05K2203/0769
Abstract: Methods of making metal patterns on flexible substrates are provided. A releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. The releasable solid layer is transferred from the patterned surface to a transfer layer where the metal patterns are formed.
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公开(公告)号：US20240121897A1
公开(公告)日：2024-04-11
申请号：US17938066
申请日：2022-10-05
Applicant: NXP B.V.
Inventor： Abdellatif Zanati , Adrianus Buijsman , Mark Steigemann
CPC classification number: H05K1/113 , H01Q13/00 , H05K1/119 , H05K1/181 , H05K3/0026 , H05K3/0047 , H01L23/49816 , H05K2201/09036 , H05K2201/09072 , H05K2201/09509 , H05K2201/09518 , H05K2201/096 , H05K2201/09609 , H05K2203/107
Abstract: An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.
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公开(公告)号：US20240074050A1
公开(公告)日：2024-02-29
申请号：US18203294
申请日：2023-05-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jun Ki Min , Seong Ho Choi
CPC classification number: H05K1/111 , H05K3/4007 , H05K3/4644 , H05K2201/09036 , H05K2201/09481
Abstract: A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the protrusion of the connection pad may be substantially the same as or less than a surface height of the insulation layer.
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公开(公告)号：US20240064893A1
公开(公告)日：2024-02-22
申请号：US18450537
申请日：2023-08-16
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Wei TAO , Yuchuan WANG , Qingguo TANG , Wutao LIU , Shuguang XU
CPC classification number: H05K1/0263 , H05K1/18 , H05K5/02 , H05K2201/09036 , H05K2201/09563 , H05K2201/10272 , H05K2201/10553 , H05K2201/1059
Abstract: A circuit board assembly includes a circuit board and a conductive plate. The circuit board includes a substrate and a conductive trace. The conductive trace is disposed on the substrate. The conductive plate is fastened in a first region of the circuit board, and a current-carrying capacity of the conductive plate is greater than that of the conductive trace. In the circuit board assembly, the conductive plate capable of carrying a relatively large operating current is provided to significantly improve a current-carrying capability of the circuit board assembly; and the conductive plate and the circuit board are manufactured separately, and then, the conductive plate is disposed in the first region of the circuit board, to implement a fastened connection between the conductive plate and the circuit board. Therefore, manufacturing costs and process difficulty are reduced, and low-cost and batch manufacturing is implemented.
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公开(公告)号：US11800640B1
公开(公告)日：2023-10-24
申请号：US18127453
申请日：2023-03-28
Applicant: INFINITUM ELECTRIC, INC.
Inventor： Edward C. Carignan , Paulo Guedes-Pinto
CPC classification number: H05K1/0284 , H02K3/26 , H05K1/0366 , H05K3/18 , H05K2201/09036
Abstract: A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of greater than 0 degrees to about 5 degrees. The conductive traces and pads are formed into the channels and pockets by electrolytic metallization. In addition, the outer surface of conductive traces and pads are flush with the sides of the 3D dielectric substrate.
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公开(公告)号：US11792916B2
公开(公告)日：2023-10-17
申请号：US17567332
申请日：2022-01-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Han Park , Woo Seok Yang
CPC classification number: H05K1/0224 , H05K1/116 , H05K3/107 , H05K2201/09036 , H05K2201/09636
Abstract: A printed circuit board includes an insulating layer; a recess portion disposed on one surface of the insulating layer; and a circuit layer disposed on the one surface of the insulating layer and including a signal pattern and a ground pattern. At least a portion of the ground pattern covers at least a portion of the recess portion.
