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公开(公告)号：US11980960B2
公开(公告)日：2024-05-14
申请号：US18117544
申请日：2023-03-06
发明人： Ren-Feng Ding , Hung-Wen Chen
IPC分类号： B23K1/00 , B23K1/005 , B23K3/08 , G01J5/00 , G01J5/0806 , G01J5/0808 , G02B27/14 , G02B27/30
CPC分类号： B23K1/0056 , B23K3/08 , G01J5/0003 , G01J5/0806 , G01J5/0808 , G02B27/141 , G02B27/30
摘要： A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.
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公开(公告)号：US20230201944A1
公开(公告)日：2023-06-29
申请号：US18117544
申请日：2023-03-06
发明人： Ren-Feng Ding , Hung-Wen Chen
IPC分类号： B23K1/005 , B23K3/08 , G01J5/00 , G01J5/0806 , G02B27/14 , G02B27/30 , G01J5/0808
CPC分类号： B23K1/0056 , B23K3/08 , G01J5/0003 , G01J5/0806 , G02B27/141 , G02B27/30 , G01J5/0808
摘要： A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.
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公开(公告)号：US11465234B2
公开(公告)日：2022-10-11
申请号：US17028088
申请日：2020-09-22
发明人： Ren-Feng Ding , Hung-Wen Chen , Shu-Han Wu
IPC分类号： B23K26/20 , B23K26/352 , B23K26/32 , B23K26/06 , B23K1/005 , B23K26/03 , B23K101/42
摘要： A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.
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公开(公告)号：US11599803B2
公开(公告)日：2023-03-07
申请号：US16355867
申请日：2019-03-18
发明人： Shu-Han Wu , Hung-Wen Chen , Ren-Feng Ding , Yi-Jiun Shen , Yu-Cheng Su
摘要： A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next soldering process when the final product does not meet the quality control requirements.
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公开(公告)号：US20210053132A1
公开(公告)日：2021-02-25
申请号：US16583879
申请日：2019-09-26
发明人： Ren-Feng Ding , Hung-Wen Chen
摘要： A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.
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公开(公告)号：US11628510B2
公开(公告)日：2023-04-18
申请号：US16583879
申请日：2019-09-26
发明人： Ren-Feng Ding , Hung-Wen Chen
IPC分类号： B23K1/00 , B23K1/005 , B23K3/08 , G01J5/00 , G01J5/0806 , G02B27/14 , G02B27/30 , G01J5/0808
摘要： A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.
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公开(公告)号：US11219972B2
公开(公告)日：2022-01-11
申请号：US16106007
申请日：2018-08-21
发明人： Shu-Han Wu , Hung-Wen Chen , Qi-Ming Huang , Yang-Hao Chou , Yun-Chung Sun
摘要： A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.
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公开(公告)号：US11852891B2
公开(公告)日：2023-12-26
申请号：US17182653
申请日：2021-02-23
发明人： Hung-Wen Chen , Ren-Feng Ding , Shih-Yung Chiu , Shu-Han Wu , Keng-Ning Chang
CPC分类号： G02B7/09 , B23K26/0648 , G01C3/08 , G01J1/4257 , G02B19/0009 , G02B19/0047 , G02B27/106
摘要： A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.
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公开(公告)号：US11580665B2
公开(公告)日：2023-02-14
申请号：US16714689
申请日：2019-12-14
发明人： Yu-Cheng Su , Qi-Ming Huang , Yi-Jiun Shen , Hung-Wen Chen
摘要： An image positioning system based on upsampling and a method thereof are provided. The image positioning method based on upsampling is to fetch a region image covering a target from a wide region image, determine a rough position of the target, execute an upsampling process on the region image based on neural network data model for obtaining a super-resolution region image, map the rough position onto the super-resolution region image, and analyze the super-resolution region image for determining a precise position of the target. The present disclosed example can significantly improve the efficiency of positioning and effectively reduce the required cost of hardware.
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公开(公告)号：US11338441B2
公开(公告)日：2022-05-24
申请号：US16810199
申请日：2020-03-05
发明人： Yi-Jiun Shen , Yu-Ru Huang , Hung-Wen Chen
IPC分类号： B25J9/16
摘要： A calibration system for robot tool including a robot arm adopting a first coordinate system, a tool arranged on a flange of the robot arm, and an imaging device adopting a second coordinate system is disclosed, wherein an image sensing area is established by the image device. A calibration method is also disclosed and includes steps of: controlling the robot arm to move for leading a tool working point (TWP) of the tool enters the image sensing area; recording a current gesture of the robot arm as well as a specific coordinate of the TWP currently in the second coordinate system; obtaining a transformation matrix previously established for describing a relationship between the first and the second coordinate systems; and importing the specific coordinate and the current gesture to the transformation matrix for calculating an absolute position of the TWP in the first coordinate system.
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