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公开(公告)号:US20240319011A1
公开(公告)日:2024-09-26
申请号:US18553917
申请日:2022-05-06
Applicant: trinamiX GmbH
Inventor: Celal Mohan OEGUEN , Felix HORMUTH , Sebastian VALOUCH
CPC classification number: G01J5/0003 , G01J5/10 , H05B6/062 , H05B2213/07
Abstract: Disclosed herein are a device for monitoring an emission temperature of at least one radiation emitting element, a heating system for heating the at least one radiation emitting element to emit thermal radiation at an emission temperature, a method for monitoring an emission temperature of at least one radiation emitting element, and a method for heating the at least one radiation emitting element to emit thermal radiation at an emission temperature.
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公开(公告)号:US12098914B2
公开(公告)日:2024-09-24
申请号:US17936608
申请日:2022-09-29
Applicant: APPLIED MATERIALS, INC.
Inventor: Eric Chin Hong Ng , Todd J. Egan , Mehdi Vaez-Iravani
IPC: G01B11/30 , G01J5/00 , G01J5/0806 , G01J5/0808
CPC classification number: G01B11/303 , G01J5/0003 , G01J5/0806 , G01J5/0808
Abstract: A system includes a radiation source configured to emit a radiation beam. The system further includes a first optical sensor configured to detect a first intensity of a first portion of the radiation beam reflected from a surface of an object. The system further includes a second optical sensor configured to detect a second intensity of a second portion of the radiation beam scattered by the surface of the object. The system further includes a processing device communicatively coupled to the first optical sensor and the second optical sensor. The processing device is configured to determine at least one of a roughness or an emissivity of the surface of the object based on a comparison of the first intensity and the second intensity.
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公开(公告)号:US11971329B2
公开(公告)日:2024-04-30
申请号:US17538717
申请日:2021-11-30
Applicant: General Electric Company
Inventor: Brandon S. Good , Bijan Chitsaz , Guanghua Wang , Bernard P. Bewlay , Gyeong Woo Cheon , Alberto Santamaria-Pang
CPC classification number: G01M3/38 , F02C7/00 , G01J5/0003 , G06T7/0002 , G06T7/90 , G08B21/182 , H04N23/90 , F05D2260/80 , G01J2005/0077 , G06T2207/10048 , G06T2207/20084
Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to autonomously detect thermal anomalies. Disclosed examples include an example apparatus to detect engine anomalies comprising: at least one memory; instructions in the apparatus; and processor circuitry to execute the instructions to: control a plurality of infrared cameras to capture a baseline image set, the baseline image set including at least two thermal images; generate emissivity data based on the baseline image set; provide the baseline image set and the emissivity data to an artificial intelligence model, the artificial intelligence model to generate a reconstructed image set; determine a difference between the baseline image set and the reconstructed image set; and in response to the difference exceeding a threshold, generate an alert indicating detection of an engine anomaly.
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公开(公告)号:US20240055644A1
公开(公告)日:2024-02-15
申请号:US18278139
申请日:2022-08-04
Applicant: LG Energy Solution, Ltd.
Inventor: Kwan Woo Lee , Ha Yong Jung , Jong Myung Lee , Hyun Jae Park
CPC classification number: H01M10/0404 , G01J5/0003 , H04N23/23 , G01J2005/063
Abstract: A unit cell inspecting device includes an inspection unit which captures an image of an edge of a unit cell using long-wave infrared rays and measures a position of an edge of an electrode provided in the unit cell. The inspection unit includes: a main heating part configured to heat the edge of the unit cell, thereby raising a temperature of the edge of the electrode provided in the unit cell; and an image capturing part configured to capture the image of the edge of the unit cell by using the long-wave infrared rays, thereby acquiring a thermal image of the edge of the electrode provided in the unit cell; and an inspection part configured to measure the edge of the electrode in the thermal image captured by the image capturing part, thereby measuring the position of the electrode by using the measured edge of the electrode.
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公开(公告)号:US20230392987A1
公开(公告)日:2023-12-07
申请号:US17832296
申请日:2022-06-03
Applicant: Applied Materials, Inc.
Inventor: Wolfgang Aderhold
CPC classification number: G01J5/0003 , G01J5/80 , G01J2005/0074
Abstract: Embodiments disclosed herein include a method of calibrating a processing tool. In an embodiment, the method comprises providing a first substrate with a first emissivity, a second substrate with a second emissivity, and a third substrate with a third emissivity. In an embodiment, the process may include running a recipe on each of the first substrate, the second substrate, and the third substrate, where the recipe includes a set of calibration attributes. In an embodiment, the method may further comprise measuring a layer thickness on each of the first substrate, the second substrate, and the third substrate. In an embodiment, the method further comprises determining if the layer thicknesses are uniform.
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公开(公告)号:US20180227503A1
公开(公告)日:2018-08-09
申请号:US15880174
申请日:2018-01-25
Applicant: KAMAKURA KOKI CO., LTD.
Inventor: Kunio ANDO , Kazuya MIYAJI
CPC classification number: H04N5/265 , G01J5/0003 , G01J5/0806 , G01J5/10 , G01J2005/0077 , G01J2005/0085 , G02B23/00 , H04N5/23293 , H04N5/33
Abstract: An optical observation device for observing a target located at a distant observation sight that comprises an observation telescope and an infrared sighting device. The infrared sighting device eventually provides a visual target image as a sighting marker from a thermal infrared image of the observation sight. The sighting marker and the observation sight are simultaneously viewed in the field of view of the observation telescope so as to enable training of the observation telescope on a part of the observation sight where the target is located.
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公开(公告)号:US20180217004A1
公开(公告)日:2018-08-02
申请号:US15881757
申请日:2018-01-27
Applicant: Microsanj, LLC
Inventor: Dustin Kendig , Ali Shakouri , Hamid Piroozi
CPC classification number: G01J5/0859 , G01J5/0003 , G01J5/0096 , G01J5/0809 , G01J2005/0048 , G01J2005/0077 , G01J2005/0081 , G01N21/1717 , G01N25/18
Abstract: A method for determining change in temperature of different parts of an electronic or optoelectronic device between un-energized and energized states without contacting the device. The method includes establishing a reference image form an unexcited device by illuminating the device with an optical signal and capturing the reference image from the device in an un-energized state, illuminating the device with an optical signal during an energization pulse having a predetermined pulse width and pulse magnitude and capturing a plurality of on images from the device at different time delays, determining a transient temperature profile, calibrating the temperature profile for one or more regions of the device with unknown thermoreflectance coefficient based on the determined transient temperature profile for the one or more regions of the device with known thermoreflectance coefficient.
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公开(公告)号:US09970821B2
公开(公告)日:2018-05-15
申请号:US14688617
申请日:2015-04-16
Applicant: Raytheon Company
Inventor: Steven F. Cook , Colton L. Noble , Justan V. Forsyth
CPC classification number: G01J5/0003 , G01J5/00 , G01J5/0887
Abstract: A high SNR in-situ measurement of sample radiance in a low-temperature ambient environment is used to accurately characterize sample emissivity for transmissive, low-emissivity samples. A low-e mirror is positioned behind the sample such that the sample and low-e mirror overfill the field-of-view (FOV) of the radiometer. The sample is heated via thermal conduction in an open environment. Thermal conduction heats the sample without raising the background radiance appreciably. The low-e mirror presents both a low emission background against which to measure the sample radiance and reflects radiance from the back of the sample approximately doubling the measured signal. The low-e mirror exhibits a reflectance of at least 90% and preferably greater than 98% and an emissivity of at most 7.5% and preferably less than 2% over the spectral and temperature ranges at which the sample emissivity is characterized.
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公开(公告)号:US20170307682A1
公开(公告)日:2017-10-26
申请号:US15515686
申请日:2014-10-09
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomonori NAKAMURA
CPC classification number: G01R31/311 , G01J5/0003 , G01J5/0007 , G01J5/0066 , G01K17/08 , G01K17/16 , G01N21/88 , G01N25/005 , G01N25/20 , G01N25/72
Abstract: A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.
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公开(公告)号:US09719865B2
公开(公告)日:2017-08-01
申请号:US13687779
申请日:2012-11-28
Applicant: International Business Machines Corporation
Inventor: Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
CPC classification number: G01K15/005 , G01J5/0003 , G01J5/522 , G01K7/427 , G01K15/00 , G01K2007/422 , G06F2200/201
Abstract: A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.
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