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公开(公告)号：US20240141251A1
公开(公告)日：2024-05-02
申请号：US18410327
申请日：2024-01-11
发明人： Masahiro ISHIZUKA
IPC分类号： C10M169/00 , B23K26/20 , H01M10/04 , H01M10/05 , H01M10/0566 , H01M50/103 , H01M50/15
CPC分类号： C10M169/00 , B23K26/206 , H01M10/04 , H01M10/05 , H01M10/0566 , H01M50/103 , H01M50/15 , H01M50/119
摘要： A method of manufacturing a non-aqueous secondary battery includes the steps of preparing a case main body, preparing a lid, applying a lubricant to a contact location, and assembling a lid to an open end of the case main body. In the step of preparing a lid, a lid to be fitted to the open end of the case main body is prepared. In the step of applying a lubricant, the lubricant is applied to at least a portion of the contact location at which the case main body and the lid are in contact with each other. In the step of assembling the lid to the open end, the lid is assembled to the open end with the lubricant having been applied to the contact location. The lubricant may be a solvent used in a non-aqueous electrolyte solution for non-aqueous secondary batteries.
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公开(公告)号：US20240131625A1
公开(公告)日：2024-04-25
申请号：US18404992
申请日：2024-01-05
申请人： MEDTRONIC, INC.
发明人： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A. Munoz , Christopher T. Kinsey , Mark E. Henschel
CPC分类号： B23K26/206 , A61N1/3754 , A61N1/3968 , B23K26/32
摘要： Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
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公开(公告)号：US10052719B2
公开(公告)日：2018-08-21
申请号：US14771464
申请日：2015-03-11
发明人： Shigeki Saito , Nobuaki Sakayanagi
IPC分类号： B23K26/06 , B23K26/02 , B23K26/00 , B23K26/20 , B23K26/03 , B23K26/28 , B23K26/70 , B23K26/0622 , B23K26/067 , B23K26/26 , H01M2/02 , H01M2/04 , B23K101/36
CPC分类号： B23K26/206 , B23K26/00 , B23K26/02 , B23K26/032 , B23K26/06 , B23K26/0622 , B23K26/0626 , B23K26/067 , B23K26/26 , B23K26/28 , B23K26/702 , B23K2101/36 , H01M2/0202 , H01M2/0237 , H01M2/0285 , H01M2/0426 , H01M2/0439 , H01M2/0486
摘要： A laser welding device that laser-welds a lid to an open portion of a casing emits a laser beam to a joining subject portion including an inner side surface of the casing that defines the open portion and a peripheral surface of the lid that faces the inner side surface of the casing. The inner side surface of the casing and the peripheral surface of the lid are arranged to form a groove in between, and include inclined surfaces that function as a sliding portion. The groove portion has a groove width that is variable by sliding the sliding portion. A detection unit detects the groove width of the groove portion. An adjustment force application unit applies force for adjusting the groove width to the casing. A control unit controls the force applied by the adjustment force application unit in accordance with the groove width detected by the detection unit.
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公开(公告)号：US20180106553A1
公开(公告)日：2018-04-19
申请号：US15728526
申请日：2017-10-10
申请人： PiMEMS, Inc.
发明人： Payam BOZORGI , Shannon C. Gott , Timothy Reed
CPC分类号： F28D15/0283 , B23K26/206 , B23K26/24 , B23P15/26 , B23P2700/09 , F28D15/04 , F28F2245/02 , F28F2245/04 , F28F2255/20 , H01L23/427
摘要： The present application discloses a thermal ground plane that is charged by laser welding a cover on an aperture. Prior to sealing, the thermal ground plane is filled with a quantity of a working fluid, and the device is heated until the working fluid is boiling in the cavity. Accordingly, the cavity is filled with the working fluid and with a saturated vapor of the working fluid. When the saturated vapor has displaced other gases, the cavity is laser welded shut.
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公开(公告)号：US09902138B2
公开(公告)日：2018-02-27
申请号：US14897983
申请日：2014-06-13
申请人： CORNING INCORPORATED
发明人： Victoria Ann Edwards
IPC分类号： B32B3/00 , B32B17/06 , C03C3/091 , C03C8/24 , C03C23/00 , C03B17/02 , C03B17/06 , C03C27/06 , H01L51/52 , C03B23/203 , B23K26/20
CPC分类号： B32B17/06 , B23K26/206 , B32B17/064 , C03B17/02 , C03B17/064 , C03B23/203 , C03C3/091 , C03C8/24 , C03C23/0025 , C03C27/06 , H01L51/524
摘要： A glass sealing sheet comprising a glass core layer having a first side and a second side, a first cladding layer bonded to the first side of the glass core layer, and/or a second cladding layer bonded to the second side of the glass core layer. The first cladding layer is comprises a glass composition that is absorbing of radiation over at least a portion of an emission wavelength range.
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公开(公告)号：US09862597B2
公开(公告)日：2018-01-09
申请号：US15371659
申请日：2016-12-07
申请人： Robert Bosch GmbH
发明人： Mawuli Ametowobla , Philip Kappe
IPC分类号： H01L21/00 , B81C1/00 , B81B7/00 , B23K26/20 , B23K26/06 , B23K26/0622 , B23K26/064 , H01L23/10 , H01L23/04
CPC分类号： B81C1/00325 , B23K26/06 , B23K26/0622 , B23K26/064 , B23K26/206 , B23K2101/40 , B81B7/0051 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C2203/0145 , H01L23/04 , H01L23/10 , H01L2924/1461 , H01L2924/16152
摘要： A method for manufacturing a micromechanical component having a substrate and having a cap connected to the substrate and enclosing with the substrate a first cavity is provided, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, in a first method step an access opening that connects the first cavity to an environment of the micromechanical component being constituted in the substrate or in the cap, in a second method step the first pressure and/or the first chemical composition being established in the first cavity, in a third method step the access opening being sealed with the aid of a laser by the introduction of energy or heat into an absorbing portion of the substrate or of the cap, the introduction of energy or heat being controlled by spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of the substrate or of the cap.
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公开(公告)号：US09849538B2
公开(公告)日：2017-12-26
申请号：US14583084
申请日：2014-12-24
发明人： Judd Armstrong , Stephen Duddy
IPC分类号： B32B37/00 , B23K11/00 , B23K20/10 , B29C65/02 , B23K1/00 , B23K11/08 , B23K26/20 , B23K33/00 , B29C65/00 , B29C65/08 , B29C65/78 , B23K103/02 , B23K103/08 , B23K103/00 , B29L31/34 , B29C65/16
CPC分类号： B23K11/00 , B23K1/0008 , B23K11/08 , B23K20/10 , B23K26/206 , B23K33/004 , B23K2103/02 , B23K2103/08 , B23K2103/42 , B23K2103/54 , B29C65/02 , B29C65/08 , B29C65/16 , B29C65/7805 , B29C66/1224 , B29C66/1226 , B29C66/12445 , B29C66/12463 , B29C66/12469 , B29C66/21 , B29C66/30221 , B29C66/30223 , B29C66/54 , B29C66/7392 , B29C66/7394 , B29C66/8322 , B29L2031/3475 , B29L2031/3481
摘要： A method for watertight welding, and components formed using that welding method, wherein the welding method includes providing a first component half with a groove and a protruding ridge located therein, providing a second component half with a tenon shaped to match the profile of the groove, disposing the tenon inside the groove such that the tenon contacts the protruding ridge, applying an ultrasonic power source near the groove to melt the protruding ridge, and applying opposing vertical force to the first component half relative to the second component half, such that the protruding ridge wedges in a bonding seam between an outside surface of the tenon and an inside surface of the groove.
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公开(公告)号：US20170304943A1
公开(公告)日：2017-10-26
申请号：US15507592
申请日：2014-09-01
申请人： TOYOTA MOTOR EUROPE
发明人： Akira TSUKUI
IPC分类号： B23K26/067 , B23K26/06 , B23K26/073 , B23K26/24
CPC分类号： B23K26/0676 , B23K26/0608 , B23K26/073 , B23K26/0738 , B23K26/206 , B23K26/24 , B23K2101/045 , B23K2101/36 , H01M2/0426 , H01M2/0434 , H01M8/0297
摘要： A method for laser welding is provided. The method includes arranging at least one heat source point from a first collection of heat source points so as to overlap at least a portion of at least one heat source point from a second collection of heat source points, irradiating a portion of a target with the first and second collections of heat source points, the heat source points maintaining a linear profile within their respective collection, and directing the at least two collections of heat source points in a travel direction along a weld line, each linear profile maintaining an oblique angle relative to the travel direction.
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公开(公告)号：US20170254698A1
公开(公告)日：2017-09-07
申请号：US15391141
申请日：2016-12-27
申请人： OMRON CORPORATION
IPC分类号： G01J1/02 , B23K26/082 , B23K26/26
CPC分类号： G01J1/0271 , B23K26/082 , B23K26/206 , B23K26/244 , B23K26/26 , B23K33/004 , B23K2101/12 , B23K2101/36 , B23K2103/05 , H01H11/00 , H01H35/00
摘要： A sensor device includes a body case provided with an opening, and a body cover assembled to the body case to cover the opening. The body cover has at an outer peripheral portion thereof an overlapping region overlapping a portion of the body case located at a peripheral edge of the opening. The body cover is fixed to the body case by providing a welded portion surrounding the opening using laser-welding at a portion distant from an end surface of the body cover in a boundary of the overlapping region of the body cover and a portion of the body case overlapping the overlapping region.
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公开(公告)号：US09688533B2
公开(公告)日：2017-06-27
申请号：US13982427
申请日：2012-01-31
申请人： Payam Bozorgi , Noel C. MacDonald
发明人： Payam Bozorgi , Noel C. MacDonald
IPC分类号： H05K7/00 , B81C3/00 , B81C1/00 , H01L21/50 , H01L23/10 , B23K26/20 , B23K26/24 , H05K1/18 , B23K26/32 , B23K26/0622 , H01L23/00 , B23K103/14
CPC分类号： B81C3/001 , B23K26/0622 , B23K26/206 , B23K26/24 , B23K26/32 , B23K2103/14 , B81C1/00269 , B81C2203/0118 , B81C2203/038 , H01L21/50 , H01L23/10 , H01L24/97 , H01L2924/01019 , H01L2924/01065 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/16315 , H05K1/18 , H01L2924/00
摘要： A new packaging method for a wide range of MEMS for application on both the wafer and device scale. Titanium is used as the packaging material and both silicon and titanium MEMS devices are integrated on to a titanium substrate. A Nd:YAG pulsed laser is used to micro-weld the titanium cap to the substrate. A three-dimensional time dependent model of heat flow during laser beam welding is presented. The heat transfer and parametric design capabilities of COMSOL were employed for this purpose. Model calculations are compared and calibrated with experimental results of pulsed laser welds. The functionality and hermiticity of the proposed packaging was evaluated by packaging a self actuated Veeco Instrument AFM cantilever tip. The experimental measurements show that the resonance frequency and quality factor of the device stay the same before and after packaging and the applied technique has no effect on the device.
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