Laser irradiation apparatus
    1.
    发明授权

    公开(公告)号:US12208466B2

    公开(公告)日:2025-01-28

    申请号:US17314559

    申请日:2021-05-07

    Abstract: A laser irradiation apparatus includes a laser beam generator that generates a first laser beam, a beam expander that expands the first laser beam and outputs the expanded first laser beam as a second laser beam, a beam splitter that splits the second laser beam into third laser beams and outputs the third laser beams, and a beam condenser that condenses the third laser beams and outputs condensed third laser beams. The beam expander includes a first lens having a first focal length and a second lens having a second focal length. The first lens is disposed between the laser beam generator and the second lens, the second lens is disposed between the first lens and the beam splitter, and the laser beam generator is spaced apart from the first lens by the first focal length.

    Laser welding method and laser welding apparatus

    公开(公告)号:US12172232B2

    公开(公告)日:2024-12-24

    申请号:US17213998

    申请日:2021-03-26

    Inventor: Akira Tsukui

    Abstract: A laser welding method includes a welding process of irradiating a multiple laser beam so as to weld together a first member and a second member at a boundary. The multiple laser beam includes a first beam that is advanced while forming a first molten pool in which the first member is melted, a second beam that is advanced while forming a second molten pool in which the second member is melted, and a main beam that is advanced subsequently to the first beam and the second beam and irradiated to an integrated molten pool formed by integration of the first molten pool and the second molten pool. The first beam and the second beam do not swing, while the main beam swings with respect to the boundary.

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

    公开(公告)号:US20240416453A1

    公开(公告)日:2024-12-19

    申请号:US18821439

    申请日:2024-08-30

    Abstract: A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.

    LASER DEVICE, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD

    公开(公告)号:US20240391020A1

    公开(公告)日:2024-11-28

    申请号:US18796336

    申请日:2024-08-07

    Abstract: A laser device, to be used in a laser processing system for performing laser processing by irradiating a workpiece with laser light in a gas containing oxygen includes a solid-state oscillator including a solid-state laser device configured to output laser light having a pulse width in a range of 100 ps to 1 ns both inclusive and having a center wavelength within an oscillation wavelength range of an ArF excimer laser device and outside absorption lines of oxygen, an ArF excimer amplifier configured to amplify the laser light output from the solid-state oscillator, and a first optical pulse stretcher configured to output laser light that is burst-pulsed by dividing the laser light amplified by the ArF excimer amplifier into a plurality of pulses as the laser light being caused to circulate through a delay optical path thereof.

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