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公开(公告)号:US12208466B2
公开(公告)日:2025-01-28
申请号:US17314559
申请日:2021-05-07
Applicant: Samsung Display Co., Ltd.
Inventor: Ji-Hwan Kim , Byung Soo So , Jonghoon Choi
IPC: B23K26/064 , B23K26/00 , B23K101/40
Abstract: A laser irradiation apparatus includes a laser beam generator that generates a first laser beam, a beam expander that expands the first laser beam and outputs the expanded first laser beam as a second laser beam, a beam splitter that splits the second laser beam into third laser beams and outputs the third laser beams, and a beam condenser that condenses the third laser beams and outputs condensed third laser beams. The beam expander includes a first lens having a first focal length and a second lens having a second focal length. The first lens is disposed between the laser beam generator and the second lens, the second lens is disposed between the first lens and the beam splitter, and the laser beam generator is spaced apart from the first lens by the first focal length.
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公开(公告)号:US12172232B2
公开(公告)日:2024-12-24
申请号:US17213998
申请日:2021-03-26
Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor: Akira Tsukui
IPC: B23K26/24 , B23K26/06 , B23K26/064 , B23K26/067 , B23K26/082 , B23K26/70 , B23K101/36 , B23K101/38 , B23K103/10 , H01M10/058 , H01M50/169
Abstract: A laser welding method includes a welding process of irradiating a multiple laser beam so as to weld together a first member and a second member at a boundary. The multiple laser beam includes a first beam that is advanced while forming a first molten pool in which the first member is melted, a second beam that is advanced while forming a second molten pool in which the second member is melted, and a main beam that is advanced subsequently to the first beam and the second beam and irradiated to an integrated molten pool formed by integration of the first molten pool and the second molten pool. The first beam and the second beam do not swing, while the main beam swings with respect to the boundary.
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公开(公告)号:US20240416453A1
公开(公告)日:2024-12-19
申请号:US18821439
申请日:2024-08-30
Inventor: Jun YOKOYAMA , Yohei TAKECHI
IPC: B23K26/082 , B23K26/03 , B23K26/064
Abstract: A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.
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公开(公告)号:US20240391020A1
公开(公告)日:2024-11-28
申请号:US18796336
申请日:2024-08-07
Applicant: Gigaphoton Inc.
Inventor: Takashi ONOSE , Yasuhiro KAMBA , Hironori IGARASHI
IPC: B23K26/0622 , B23K26/06 , B23K26/064 , B23K26/70
Abstract: A laser device, to be used in a laser processing system for performing laser processing by irradiating a workpiece with laser light in a gas containing oxygen includes a solid-state oscillator including a solid-state laser device configured to output laser light having a pulse width in a range of 100 ps to 1 ns both inclusive and having a center wavelength within an oscillation wavelength range of an ArF excimer laser device and outside absorption lines of oxygen, an ArF excimer amplifier configured to amplify the laser light output from the solid-state oscillator, and a first optical pulse stretcher configured to output laser light that is burst-pulsed by dividing the laser light amplified by the ArF excimer amplifier into a plurality of pulses as the laser light being caused to circulate through a delay optical path thereof.
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公开(公告)号:US20240375215A1
公开(公告)日:2024-11-14
申请号:US18689209
申请日:2022-07-29
Applicant: ANDRITZ Soutec AG
Inventor: Hanspeter Meyer , Jean-Frédéric Clerc
IPC: B23K26/08 , B23K26/064 , B23K26/26 , B65G17/08 , B65G17/32 , F28F3/00 , H01M8/0202
Abstract: A device and method that allows bipolar plates to be welded in a rotating transport device in a vertical position at high speed, thereby fulfilling the high requirements for loading, fixing, welding and unloading the components to a high degree. Overall, a high level of productivity is achieved with the device and method.
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公开(公告)号:US12090705B2
公开(公告)日:2024-09-17
申请号:US16923055
申请日:2020-07-07
Applicant: University of Rochester
Inventor: Kenneth L. Marshall , Stavros G. Demos , Tanya Kosc
IPC: B29C64/282 , B22F10/00 , B22F10/28 , B22F10/36 , B22F10/362 , B22F10/364 , B22F10/38 , B22F10/50 , B22F12/13 , B22F12/41 , B22F12/43 , B22F12/44 , B22F12/45 , B23K26/06 , B23K26/0622 , B23K26/064 , B23K26/342 , B29C64/00 , B29C64/10 , B29C64/153 , B29C64/20 , B29C64/268 , B33Y30/00 , B22F10/368
CPC classification number: B29C64/282 , B22F10/00 , B22F10/28 , B22F10/36 , B22F10/362 , B22F10/364 , B22F10/38 , B22F10/50 , B22F12/13 , B22F12/41 , B22F12/43 , B22F12/44 , B22F12/45 , B23K26/0624 , B23K26/064 , B23K26/342 , B29C64/00 , B29C64/10 , B29C64/153 , B29C64/20 , B29C64/268 , B22F10/368 , B33Y30/00 , B22F2999/00 , B22F12/43 , B22F10/368
Abstract: Additive manufacturing systems and methods utilizing an optical light valve configured to spatially modulate the intensity of a laser beam, in conjunction with a writing and erasing sub-system configured to repeatedly write and erase patterns in the optical light valve to repeatedly vary the spatial modulation of the laser beam. In some implementations, the systems and methods may also employ additional laser beams or other energy sources that are not spatially modulated by the optical light valve. In some implementations, the systems and methods may employ additional laser beams or other energy sources configured to reduce surface roughness of the powder or other material being used for additive manufacturing.
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公开(公告)号:US20240253156A1
公开(公告)日:2024-08-01
申请号:US18635042
申请日:2024-04-15
Applicant: TRUMPF Laser- und Systemtechnik GmbH
Inventor: Oliver Bocksrocker
IPC: B23K26/067 , B23K26/064 , B23K26/082 , B23K26/21
CPC classification number: B23K26/067 , B23K26/064 , B23K26/082 , B23K26/21
Abstract: A method for laser welding of a workpiece includes directing a laser beam onto the workpiece by using scanner optics, and in an arbitrary order with the laser beam, welding a first component to a base part of the workpiece at least in a first welding zone, and welding a second component to the base part in a second welding zone. A laser energy of the laser beam is capable of being split variably at least between a core fraction corresponding to a core beam of the laser beam, and a ring fraction corresponding to a ring beam of the laser beam that encloses the core beam. The splitting of the laser energy between the core fraction and the ring fraction is selected differently for welding in the first welding zone and for welding in the second welding zone.
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公开(公告)号:US12017298B2
公开(公告)日:2024-06-25
申请号:US17892491
申请日:2022-08-22
Applicant: General Electric Company
Inventor: Joshua Tyler Mook , William Joseph Steele , Mary Kathryn Thompson , David Scott Simmermon , Michael Thomas Gansler
IPC: B23K26/064 , B22F10/20 , B22F10/28 , B22F10/36 , B22F10/366 , B22F12/44 , B23K26/06 , B23K26/067 , B23K26/073 , B23K26/342 , B29C64/153 , B33Y30/00 , G02B3/00 , G02B26/08
CPC classification number: B23K26/064 , B22F10/20 , B22F10/28 , B22F10/36 , B22F10/366 , B22F12/44 , B23K26/0643 , B23K26/0676 , B23K26/0738 , B23K26/342 , B29C64/153 , B33Y30/00 , G02B3/0056 , G02B26/0833 , B23K26/0648
Abstract: An irradiation device for additively manufacturing three-dimensional objects may include a beam generation device configured to generate an energy beam, an optical modulator including a micromirror array disposed downstream from the beam generation device, and a focusing lens assembly disposed downstream from the optical modulator. The micromirror array may include a plurality of micromirror elements configured to reflect a corresponding plurality of beam segment of the energy beam along a beam path incident upon the focusing lens assembly. The focusing lens assembly may include one or more lenses configured to focus the plurality of beam segments such that for respective ones of a plurality of modulation groups including a subset of micromirror elements, a corresponding subset of beam segments are focused to at least partially overlap with one another at a combination zone corresponding to the respective modulation group.
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9.
公开(公告)号:US20240157474A1
公开(公告)日:2024-05-16
申请号:US18418389
申请日:2024-01-22
Applicant: TRUMPF Laser- und Systemtechnik GmbH , TRUMPF Laser GmbH
Inventor: Christoph Neugebauer , Christoph Tillkorn , Gerhard Broghammer , Daniel Corbean
IPC: B23K26/064 , B23K26/08 , B23K26/082 , B23K26/36
CPC classification number: B23K26/064 , B23K26/082 , B23K26/0876 , B23K26/36
Abstract: A method for processing a workpiece with a laser beam includes guiding the laser beam by a scanner optical unit of an optical system. The laser beam has a linear cross section with an aspect ratio of a long side to a short side of more than 2 when impinging on the workpiece.
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公开(公告)号:US11980965B2
公开(公告)日:2024-05-14
申请号:US16392188
申请日:2019-04-23
Applicant: General Electric Company
Inventor: Xiaolei Shi
IPC: B23K26/03 , B22F10/28 , B22F10/31 , B22F10/36 , B22F12/45 , B22F12/49 , B22F12/90 , B23K26/06 , B23K26/064 , B23K26/082 , B23K26/342 , B33Y30/00 , B33Y50/00
CPC classification number: B23K26/032 , B22F10/28 , B22F10/31 , B22F12/45 , B22F12/49 , B22F12/90 , B23K26/0608 , B23K26/064 , B23K26/082 , B23K26/342 , B33Y30/00 , B33Y50/00 , B22F10/36
Abstract: An additive manufacturing system includes a build platform and at least two laser heads. Each laser head includes at least one laser device, an optical sensor, and a computing device. The build platform includes a plurality of calibration marks. The laser device is configured to generate a laser beam. The laser beam is directed toward the plurality of calibration marks and the build platform. The optical sensor is configured to detect a scattering signal of the laser beam generated by reflecting off of the plurality of calibration marks and the build platform. The computing device is configured to receive the scattering signal from the optical sensor. The computing device is configured to align the laser heads such that the scattering signal aligns with the plurality of calibration marks and such that the laser heads align with each other.
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