公开(公告)号：US20250069953A1

公开(公告)日：2025-02-27

申请号：US18809484

申请日：2024-08-20

Applicant: DISCO CORPORATION

Inventor： Shinya ARUGA ,  Norihisa ARIFUKU

IPC: H01L21/78

Abstract: A breaking method for dividing, along a division line, a wafer having division starting points formed along the division line. The breaking method includes a protective sheet arrangement step of arranging, on a side of a front surface of the wafer, a protective sheet that has a front surface and back surface formed flat and is free of any glue layer, an alignment step of, after performing the protective sheet arrangement step, capturing an image of the front surface of the wafer from a side of the protective sheet and conducting position matching between the division line and a pressing member, and a dividing step of, after performing the alignment step, dividing the wafer along the division line by pressing the pressing member against the wafer along the division line.

公开(公告)号：US12236619B2

公开(公告)日：2025-02-25

申请号：US17805172

申请日：2022-06-02

Applicant: DISCO CORPORATION

Inventor： Hironari Ohkubo

IPC: G06K9/00 ,  G06T3/4038 ,  G06T7/00 ,  G06T7/32 ,  H01L21/67

Abstract: A control unit of a processing apparatus detects a linear region corresponding to a first planned dividing line from an intersection region of the first planned dividing line and a second planned dividing line, obtains an angle between the linear region and an X-axis direction, and positions the linear region corresponding to the first planned dividing line in the X-axis direction. A linear region corresponding to a next first planned dividing line is detected and an interval between the first planned dividing lines is set. A second planned dividing line interval setting section detects two linear regions corresponding to second planned dividing lines, the linear regions being adjacent to each other, and an interval is set between the second planned dividing lines. A device image enclosed by a pair of first planned dividing lines and a pair of second planned dividing lines is generated and stored.

公开(公告)号：US20250054815A1

公开(公告)日：2025-02-13

申请号：US18786841

申请日：2024-07-29

Applicant: DISCO CORPORATION

Inventor： Mitsuru IKUSHIMA ,  Yoshikuni MIGIYAMA ,  Yoshinori KAKINUMA ,  Yuta TANIYAMA

IPC: H01L21/66 ,  H01L21/56

Abstract: There is provided a manufacturing method of a substrate with a protective member in which a protective member of a size corresponding to a substrate is provided on one side of the substrate, the method including a protective member forming step, a removing step of, after the protective member forming step, causing a cutter to cut into the protective member along a peripheral edge of the substrate and separating the protective member into a surplus portion extending beyond the peripheral edge of the substrate and a main body portion of the protective member on an inner side than the peripheral edge of the substrate, to remove the surplus portion, and a determining step of, after the removing step, observing the peripheral edge of the main body portion and determining presence or absence of occurrence of an abnormality at the peripheral edge of the main body portion.

公开(公告)号：US12220840B2

公开(公告)日：2025-02-11

申请号：US17814609

申请日：2022-07-25

Applicant: DISCO CORPORATION

Inventor： Yoshinori Kakinuma

IPC: B28D7/02 ,  B28D1/22 ,  B28D7/04

Abstract: A sheet sticking apparatus includes a sticking unit that sticks a sheet to a workpiece held by a chuck table and a cutting unit that cuts the stuck sheet. The cutting unit includes a cutting blade that cuts the sheet, a movement unit that raises and lowers the cutting blade from and toward the chuck table or moves the cutting blade along the outer circumference of the workpiece, and a cleaning part that removes adhering things of the cutting blade. The cleaning part is disposed on the trajectory of the cutting blade that moves by the movement unit and executes cleaning by coming into contact with the cutting blade that moves.

公开(公告)号：US12217966B2

公开(公告)日：2025-02-04

申请号：US17381784

申请日：2021-07-21

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/78

Abstract: There is provided a processing method of a wafer. The processing method includes a protective sheet preparation step of preparing a protective sheet including a first sheet that is thermocompression-bonded to a surface of the wafer by heating, a second sheet that is laid on the first sheet and has fluidity due to the heating, and a third sheet that is laid on the second sheet and keeps flatness even with the heating. The processing method also includes a protective sheet laying step of causing a side of the first sheet to face a front surface of the wafer and executing heating to execute thermocompression bonding to lay the protective sheet on the front surface of the wafer and a grinding step of causing a side of the protective sheet to be held by a holding surface of a chuck table and grinding a back surface of the wafer.

公开(公告)号：US20250033245A1

公开(公告)日：2025-01-30

申请号：US18765505

申请日：2024-07-08

Applicant: DISCO CORPORATION

Inventor： Yuya SETO

IPC: B28D5/00 ,  B23K26/364

Abstract: A β gallium oxide substrate manufacturing method for manufacturing a substrate from a workpiece formed of β gallium oxide includes a separation layer forming step of applying a laser beam of such a wavelength as to be transmitted through the β gallium oxide to the workpiece, with a focal point of the laser beam positioned at a predetermined depth from a front surface of the workpiece, to thereby form a separation layer including a modified part and a crack extending from the modified part, inside the workpiece, and a separation step of exerting an external force on the workpiece to thereby separate the substrate from the workpiece with the separation layer as a start point, after the separation layer forming step.

公开(公告)号：US12211731B2

公开(公告)日：2025-01-28

申请号：US17659107

申请日：2022-04-13

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A wafer processing method includes a wafer accommodating step of accommodating a wafer in a vacuum chamber, a protective sheet disposing step of disposing a protective sheet on a front surface of the wafer, a decompression step of decompressing the inside of the vacuum chamber, after the wafer accommodating step and the protective sheet disposing step, a press-fitting step of pressing the protective sheet against a peripheral marginal area of the wafer in the vacuum chamber to press-fit the protective sheet to the peripheral marginal area, after the decompression step, and a conveying-out step of opening the vacuum chamber to atmosphere to bring the protective sheet into close contact with the front surface of the wafer by atmospheric pressure and conveying out the wafer, after the press-fitting step.

公开(公告)号：US12208482B2

公开(公告)日：2025-01-28

申请号：US17653375

申请日：2022-03-03

Applicant: DISCO CORPORATION

Inventor： Hiroki Aikawa

IPC: B24B27/06 ,  B24B41/06

Abstract: A cutting apparatus includes a chuck table configured to hold the workpiece, and a cutting unit fitted with a cutting blade including an annular base and a cutting edge that includes abrasive grains and a binder configured to fix the abrasive grains, and is formed along an outer circumferential edge of the base. The cutting unit includes a spindle, a blade mount fitted to a distal end portion of the spindle, and a fixing nut configured to fix the cutting blade to the blade mount, and the blade mount or the fixing nut is provided with a corrosion layer formed of a material having a higher ionization tendency than a material constituting the binder.

公开(公告)号：US12208468B2

公开(公告)日：2025-01-28

申请号：US17661579

申请日：2022-05-02

Applicant: DISCO CORPORATION

Inventor： Natsuko Hanamura

IPC: B25B11/00 ,  B23K26/03 ,  B23K26/08 ,  B23K26/70 ,  B23K101/40

Abstract: A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.

公开(公告)号：US12202173B2

公开(公告)日：2025-01-21

申请号：US18045858

申请日：2022-10-12

Applicant: DISCO CORPORATION

Inventor： Hayato Iga

IPC: H01L21/322 ,  B28D5/00

Abstract: After peel-off layers have been formed in a workpiece of monocrystalline silicon such as an ingot, a bare wafer, or a device wafer with use of a laser beam having a wavelength transmittable through monocrystalline silicon, a substrate is separated from the workpiece along the peel-off layers acting as separation initiating points. The process results in increased productivity for the manufacture of substrates, compared with a process of manufacturing substrates from a workpiece with use of a wire saw.