公开(公告)号：US12217966B2

公开(公告)日：2025-02-04

申请号：US17381784

申请日：2021-07-21

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/78

Abstract: There is provided a processing method of a wafer. The processing method includes a protective sheet preparation step of preparing a protective sheet including a first sheet that is thermocompression-bonded to a surface of the wafer by heating, a second sheet that is laid on the first sheet and has fluidity due to the heating, and a third sheet that is laid on the second sheet and keeps flatness even with the heating. The processing method also includes a protective sheet laying step of causing a side of the first sheet to face a front surface of the wafer and executing heating to execute thermocompression bonding to lay the protective sheet on the front surface of the wafer and a grinding step of causing a side of the protective sheet to be held by a holding surface of a chuck table and grinding a back surface of the wafer.

公开(公告)号：US12211731B2

公开(公告)日：2025-01-28

申请号：US17659107

申请日：2022-04-13

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A wafer processing method includes a wafer accommodating step of accommodating a wafer in a vacuum chamber, a protective sheet disposing step of disposing a protective sheet on a front surface of the wafer, a decompression step of decompressing the inside of the vacuum chamber, after the wafer accommodating step and the protective sheet disposing step, a press-fitting step of pressing the protective sheet against a peripheral marginal area of the wafer in the vacuum chamber to press-fit the protective sheet to the peripheral marginal area, after the decompression step, and a conveying-out step of opening the vacuum chamber to atmosphere to bring the protective sheet into close contact with the front surface of the wafer by atmospheric pressure and conveying out the wafer, after the press-fitting step.

公开(公告)号：US12080564B2

公开(公告)日：2024-09-03

申请号：US17657842

申请日：2022-04-04

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: H01L21/56 ,  H01L21/48

CPC classification number: H01L21/561 ,  H01L21/4853 ,  H01L21/565

Abstract: A package substrate processing method includes a holding step of holding a package substrate by a chuck table, a warp reducing step of, after the holding step is performed, reducing a warp in the package substrate by forming grooves of a first depth along planned dividing lines of the package substrate by using a first cutting blade, a groove forming step of forming grooves of, after the warp reducing step is performed, a second depth by further cutting the grooves of the first depth by using the first cutting blade, and a dividing step of, after the groove forming step is performed, forming packaged chips by further cutting the grooves of the second depth and thus dividing the package substrate by using a second cutting blade thinner than the first cutting blade.

公开(公告)号：US12017314B2

公开(公告)日：2024-06-25

申请号：US17813160

申请日：2022-07-18

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya ,  Miki Yoshida ,  Kei Mine

IPC: B23Q11/14

CPC classification number: B23Q11/141

Abstract: A fixed temperature liquid supply apparatus for supplying liquid adjusted in temperature to a processing apparatus including a processing unit includes a tank that accommodates the liquid, a thermometer that measures the temperature of the liquid accommodated in the tank, and a compressed gas supply pipe one end of which is connected to a compressed gas source reserving a compressed gas, the other end of which reaches the tank, and which supplies the compressed gas from the compressed gas source to the tank. The liquid accommodated in the tank is cooled by bubbles of the compressed gas, and the cooled liquid is supplied to the processing apparatus.

公开(公告)号：US11534862B2

公开(公告)日：2022-12-27

申请号：US16830407

申请日：2020-03-26

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: B23K26/06 ,  B23K26/08 ,  B23K26/082

Abstract: A laser processing apparatus includes two chuck tables for holding workpieces on their holding surfaces, an X-axis feed unit for moving the chuck tables which are being arrayed in an X-axis direction, a laser beam applying unit for applying a laser beam to the workpiece on one at a time of the chuck tables to process the workpiece, and a pair of delivery areas arrayed in the X-axis direction on both sides of the laser beam applying unit, for delivering workpieces to and from the chuck tables. The laser beam applying unit includes a laser oscillator, a beam condenser, and a laser beam scanning unit for displacing a position where the laser beam is applied to the holding surface of the one of the chuck tables.

公开(公告)号：US11188050B2

公开(公告)日：2021-11-30

申请号：US15956973

申请日：2018-04-19

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: G05B19/402 ,  G06Q30/06

Abstract: Disclosed herein is a management method of a processing tool mounted to a processing apparatus. The management method includes an information input step of inputting product type information that indicates a product type and a serial number displayed on the processing tool or a case of the processing tool to the processing apparatus when the processing tool is mounted to the processing apparatus, and a tallying step of counting the number of inputs of the serial number regarding each identical product type and tallying the number of uses regarding each product type from the input information. Order timing of each product type is determined from the number of uses.

公开(公告)号：US11167393B2

公开(公告)日：2021-11-09

申请号：US16059269

申请日：2018-08-09

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya ,  Yuichiro Matsumi

IPC: B24D5/12 ,  B24D5/16

Abstract: A cutting blade is mounted on a fixed flange having a cylindrical blade mounting portion. The cutting blade includes an annular blade main body having an outer circumference serving as a cutting edge and a central through-hole that has a diameter greater than an outer diameter of the blade mounting portion and in which the blade mounting portion is to be fitted, and three or more flexible inner circumferential protrusions that project from an inner circumference of the central through-hole toward the center in a diametrical direction and contact at extremities thereof with the blade mounting portion fitted in the central through-hole to support the annular blade main body.

公开(公告)号：US11072042B2

公开(公告)日：2021-07-27

申请号：US16739454

申请日：2020-01-10

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: B23K26/53 ,  B28D1/32 ,  B28D5/00

Abstract: A wafer producing method includes a peel-off layer forming step of applying a laser beam of a wavelength passing through a hexagonal single crystal ingot with a focal point of the laser beam positioned at a depth corresponding to a thickness of a wafer to be produced from an end face of the hexagonal single crystal ingot to form a peel-off layer, a production history forming step of applying a laser beam of a wavelength passing through the wafer with a focal point of the laser beam positioned inside the wafer at a position corresponding to each of a plurality of devices to be formed on a front surface of the wafer to form a production history, and a wafer peeling step of peeling off the wafer from the hexagonal single crystal ingot.

公开(公告)号：US10854462B2

公开(公告)日：2020-12-01

申请号：US15987051

申请日：2018-05-23

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: B24B9/06 ,  H01L21/304 ,  H01L21/683 ,  H01L21/78

Abstract: A wafer processing method for processing a wafer includes an annular groove forming step, a close contact making step, a protective member fixing step, a grinding step, and a peeling step. The wafer has a device area and a peripheral marginal area surrounding the device area on the front side, and devices each having asperities are formed in the device area. In the annular groove forming step, an annular groove is formed on the front side of the wafer along the inner circumference of the peripheral marginal area. In the close contact making step, the device area and the annular groove are covered with a protective film, and the protective film is bring into close contact with the front side of the wafer.

公开(公告)号：US10464329B2

公开(公告)日：2019-11-05

申请号：US16010672

申请日：2018-06-18

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya

IPC: B41J2/175

Abstract: A liquid container includes an inner bag that is made from a film-shaped member and reserves a liquid therein, and an outer container that accommodates the inner bag therein and has a first opening communicating with a mouth of the inner bag and a second opening for supplying a fluid into a space between the inner bag and an inner wall of the outer container.